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1. 发明专利

JP2010010298A Flexible printed wiring base material and semiconductor apparatus 审中-公开
标题翻译：柔性印刷布基材料和半导体装置
公开(公告)号：JP2010010298A
公开(公告)日：2010-01-14
申请号：JP2008166364
申请日：2008-06-25
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO
IPC分类号： H01L23/12 , H01L21/60 , H01L23/36 , H01L33/48
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring base material capable of properly heat radiating a mounted electrical component, and to provide a semiconductor apparatus. SOLUTION: A flexible printed wiring base material 10 has an insulating base material 11, and a wiring pattern 12 including a conductor pattern, in which a conductor layer formed on one surface of the insulating base material 11 is patterned. The flexible printed wiring base material also has a heat-radiating layer 14, made of a metal material and provided on the other surface of the insulating base material 11; and a penetration part 15, provided by penetration of the insulating base material 11 and the wiring pattern 12, to enable mounting an electrical component 30 on the heat-radiating layer 14. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够适当地散热安装的电气部件的柔性印刷布线基材，并提供半导体装置。解决方案：柔性印刷布线基材10具有绝缘基材11和包括导体图案的布线图案12，其中形成在绝缘基材11的一个表面上的导体层被图案化。柔性印刷布线基材还具有由金属材料制成并设置在绝缘基材11的另一个表面上的散热层14; 以及通过绝缘基材11和布线图案12的穿透而提供的穿透部15，以便能够将电气部件30安装在散热层14上。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2008004960A Printed wiring board and circuit device 有权
标题翻译：印刷线路板和电路设备
公开(公告)号：JP2008004960A
公开(公告)日：2008-01-10
申请号：JP2007227959
申请日：2007-09-03
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , AKASHI YOSHIICHI , IGUCHI YUTAKA
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board composed of metal coated polyimide of bilevel configuration where insulation resistance is hard to change.
SOLUTION: A conductive metal is laminated on at least one surface of an insulating film through a sputtering metal layer. After the sputtering metal layer and the conductive metal layer are removed selectively by etching to form a wiring pattern; the laminate film is processed with first liquid which can dissolve Ni contained in the sputtering metal layer, and then processed with second processing liquid which can dissolve Cr contained in the sputtering metal layer and can remove the sputtering metal layer of the insulating film, thus removing the sputtering metal remaining on the surface layer of the insulating film where the wiring pattern is not formed together with the surface layer of the insulating film. The insulating film is formed at a part where the wiring pattern is not formed, with the structure thicker by 1-100 nm than the insulating film at a part where the wiring pattern is formed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供由绝缘电阻难以改变的双层结构的金属涂覆的聚酰亚胺组成的印刷线路板。解决方案：通过溅射金属层将导电金属层压在绝缘膜的至少一个表面上。在通过蚀刻选择性地去除溅射金属层和导电金属层以形成布线图案之后; 用可溶解溅射金属层中的Ni的第一液体处理层压膜，然后用可溶解溅射金属层中所含的Cr的第二处理液进行处理，并且可以除去绝缘膜的溅射金属层，从而除去残留在不与绝缘膜的表面层形成布线图案的绝缘膜的表面层上的溅射金属。绝缘膜形成在没有形成布线图形的部分，其结构比形成布线图形的部分的绝缘膜厚1-100nm。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007165816A Printed wiring board, its manufacturing method, and its using method 审中-公开
标题翻译：印刷线路板及其制造方法及其使用方法
公开(公告)号：JP2007165816A
公开(公告)日：2007-06-28
申请号：JP2006018929
申请日：2006-01-27
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , KAWAMURA HIROKAZU
IPC分类号： H05K3/34 , H05K3/16 , H05K3/24
CPC分类号： H05K3/244 , H05K3/062 , H05K3/108 , H05K3/305 , H05K3/361 , H05K3/365 , H05K3/388 , H05K2201/10977 , H05K2203/0307 , H05K2203/0723
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board in which a nodule extending from a side surface part of a wiring circuit is not formed so that short circuit is hard to be caused between adjacent wiring circuits, and irregularity caused by the nodule is formed on the top surface of the wiring circuit so that anisotropic conductive bonding is possible only with an adhesive agent. SOLUTION: The printed wiring board comprises an insulating base material and a lot of wirings formed on the surface of the insulating base material. The wiring circuit comprises a conductive base layer formed on the surface of the insulating base material, a Cu nodule layer formed on the top surface of the base layer, a covering plating layer formed over the top surface of the Cu nodule layer and a first metal plating layer formed on the top surface of the covering plating layer. An irregular surface caused by the irregularity of the top surface of the Cu nodule layer is formed at the top surface of the wiring circuit. The metal layer such as the Cu nodule layer is deposited while controlling a side wall surface of a pattern formed of a photosensitive resin, to enable manufacture. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种印刷线路板，其中从布线电路的侧面部分延伸的结节不形成，使得相邻布线电路之间难以产生短路，并且由在布线电路的顶面形成有结节，因此只能用粘合剂进行各向异性导电接合。解决方案：印刷电路板包括绝缘基材和形成在绝缘基材表面上的许多布线。布线电路包括形成在绝缘基材的表面上的导电基层，形成在基底层的顶表面上的Cu结核层，形成在Cu结节层的顶表面上的覆盖镀层和第一金属镀覆层形成在覆盖镀层的顶表面上。在布线电路的顶面形成由Cu结节层的上表面的不规则性引起的不规则面。在控制由感光性树脂形成的图案的侧壁面的同时沉积Cu结节层等金属层，能够制造。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004014888A Method of manufacturing printed wiring board and printed wiring board manufactured by it 审中-公开
公开(公告)号：JP2004014888A
公开(公告)日：2004-01-15
申请号：JP2002167981
申请日：2002-06-10
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , AOKI TATSUYA , MATSUMURA YASUNORI
IPC分类号： C23F1/00 , C23F1/18 , C23F1/28 , G03F7/40 , H05K3/06 , H05K3/26 , H05K3/38
CPC分类号： H05K3/26 , G03F7/40 , H05K3/067 , H05K3/384 , H05K2201/0338 , H05K2201/0355 , H05K2201/0761 , H05K2203/0307 , H05K2203/0789 , H05K2203/1476
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board that can maintain an excellent etching factor in a formed circuit and can effectively prevent occurrence of surface-layer migration by eliminating etching residues.
SOLUTION: In the method of manufacturing the printed wiring board using a copper-plated laminated board in which a conductive circuit forming layer formed by laminating a copper layer and a metallic layer of a metal other than copper upon another and an insulating substrate are stuck to each other so that the copper layer of the circuit forming layer is exposed on the surface, the etching of the conductive circuit forming layer is performed through a first etching step of simultaneously dissolving the copper layer and metallic layer forming the circuit forming layer and a second etching step performed after the first etching step by using a selective etchant for dissolving the metal constituting the metallic layer without dissolving the copper.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2010239022A Flexible printed wiring board and semiconductor device employing the same 审中-公开
标题翻译：柔性印刷接线板和使用其的半导体器件
公开(公告)号：JP2010239022A
公开(公告)日：2010-10-21
申请号：JP2009087032
申请日：2009-03-31
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： HAYASHI KATSUHIKO , KATAOKA TATSUO
IPC分类号： H01L21/60 , H01L23/36
CPC分类号： H01L23/49572 , H01L2224/16 , H01L2224/73204 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H05K1/0209 , H05K1/0393 , H05K3/4652 , H05K2201/0715 , H05K2201/10681 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which has a simple structure, which is produced at low cost, and which effectively dissipates heat generated by semiconductor chips, and to provide a semiconductor device employing the same. SOLUTION: The flexible printed wiring board has an insulating substrate 11, and a wiring pattern 12 formed of a conductor layer provided on one surface of the insulating substrate 11, wherein the wiring pattern 12 includes inner leads 21 for mounting the semiconductor chip and outer leads 22, 23 for input and output wire connection, and a metal layer 15 is adhered to the wiring pattern 12 via an insulating adhesion layer 14. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷电路板，其具有以低成本制造并且有效地散发由半导体芯片产生的热量的简单结构，并提供使用该柔性印刷布线板的半导体器件。解决方案：柔性印刷电路板具有绝缘基板11和由设置在绝缘基板11的一个表面上的导体层形成的布线图案12，其中布线图案12包括用于安装半导体芯片的内引线21 以及用于输入和输出线连接的外引线22,23，并且金属层15经由绝缘粘合层14粘附到布线图案12.版权所有（C）2011，JPO和INPIT

6. 发明专利

JP2009267109A Flexible wiring board, flexible semiconductor device and liquid crystal display apparatus 审中-公开
标题翻译：柔性接线板，柔性半导体器件和液晶显示器
公开(公告)号：JP2009267109A
公开(公告)日：2009-11-12
申请号：JP2008115431
申请日：2008-04-25
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO
IPC分类号： H01L21/60 , G02F1/1333 , G02F1/1345 , G09F9/00 , H05K1/02 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board which can be easily manufactured without requiring complicated manufacturing processes, and which can efficiently discharge heat generated from the electronic component when an electronic component is mounted.
SOLUTION: The flexible wiring board includes a flexible insulating substrate where an outer lead forming area and an electronic component mounting area are adjacently formed through a first bending portion formed between both the areas, and a wiring pattern is formed on one surface of the flexible insulating substrate. One end portion of the wiring pattern formed on the flexible wiring board forms an outer lead, the other end forms an inner lead, and the flexible wiring board is formed so as to be bent to a predetermined shape.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性布线板，其可以容易地制造而不需要复杂的制造工艺，并且当安装电子部件时可以有效地排出由电子部件产生的热量。解决方案：柔性布线板包括柔性绝缘基板，其中外引线形成区域和电子部件安装区域通过形成在两个区域之间的第一弯曲部分相邻地形成，并且布线图案形成在柔性绝缘基板。形成在柔性布线板上的布线图案的一端形成外引线，另一端形成内引线，柔性布线板形成为弯曲成预定形状。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008047655A Wiring substrate and its manufacturing method 审中-公开
标题翻译：接线基板及其制造方法
公开(公告)号：JP2008047655A
公开(公告)日：2008-02-28
申请号：JP2006220685
申请日：2006-08-11
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , KAWAMURA HIROKAZU
IPC分类号： H05K1/02 , H05K3/20
CPC分类号： H01L23/498 , H01L21/4846 , H01L2924/0002 , H05K3/205 , H05K3/384 , H05K3/386 , H05K2201/098 , H05K2201/2072 , H05K2203/0156 , H05K2203/0307 , H05K2203/0353 , H05K2203/0384 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring substrate having a high adhesion to an insulating substrate without its wiring pattern exfoliated from the insulating substrate even though a wiring pitch width is narrowed and a wiring width is formed narrow. SOLUTION: The wiring substrate 10 comprises the insulating substrate, and the wiring pattern 12 with its body part buried in the insulating base material and with at least its upper edge part exposed to the surface of the insulating substrate. The width of the upper edge part of the wiring pattern is narrower than the width of a lower edge part cross-section of the buried wiring pattern, and a metal 16 for forming the upper edge part of the wiring pattern is more precious than the metal for forming the body part of the wiring pattern. Therefore, the adhesion between the insulating layer and the wiring pattern gets very strong. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：即使布线间距宽度变窄并且布线宽度窄，也可以提供一种对绝缘基片具有高粘附性的布线基板，而不会使其从绝缘基片脱落的布线图案。布线基板10包括绝缘基板和布线图案12，其主体部分埋在绝缘基材中，并且至少其上边缘部分暴露于绝缘基板的表面。布线图案的上边缘部分的宽度比掩埋布线图案的下边缘部分横截面的宽度窄，并且用于形成布线图案的上边缘部分的金属16比金属更贵用于形成布线图案的主体部分。因此，绝缘层和布线图案之间的附着力变得非常强。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005210058A Printed circuit board, manufacturing method of the same and circuit device 有权
标题翻译：印刷电路板及其制造方法及电路装置
公开(公告)号：JP2005210058A
公开(公告)日：2005-08-04
申请号：JP2004222185
申请日：2004-07-29
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , AKASHI YOSHIICHI , IGUCHI YUTAKA
IPC分类号： H05K1/09 , C23F1/00 , C23F1/02 , C25D5/02 , C25D7/00 , H05K1/02 , H05K3/06 , H05K3/18 , H05K3/22 , H05K3/24 , H05K3/38
CPC分类号： C25D5/02 , C25D7/00 , H01L2924/0002 , H05K3/06 , H05K3/067 , H05K3/22 , H05K3/388 , H05K2201/0338 , H05K2201/098 , H05K2203/0346 , H05K2203/1476 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board where an insulation resistance value hardly fluctuates using a two-layered metal sheathed polyimide film. SOLUTION: The printed circuit board comprises a conductive metallic layer formed on a substrate and the substrate metallic layer on at least one surface of the insulation film, the feature is that the width of a lower end section of the conductive metallic layer in a section of the wiring pattern is smaller than that of the upper end section of the substrate metallic layer in the section, in addition, the circuit device is constructed by mounting electronic parts on the printed circuit board. The manufacturing method of the printed circuit board is characterized in that after the substrate metallic layer and the conductive metallic layer are contacted with an etching liquid that dissolves the conductive metal to form the wiring pattern, the liquid is contacted with a first processing liquid that dissolves the metal forming the substrate metallic layer, then, after the liquid is contacted with a micro etching liquid that selectively dissolves the conductive metal, the liquid is contacted with a second processing liquid of chemical composition different from that of the first processing liquid. With the manufacturing method, a migration from the substrate metallic layer hardly takes place, and the fluctuation of the inter-terminal resistance value after voltage is applied is significantly small. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造印刷电路板的方法，其中绝缘电阻值几乎不会使用两层金属护套聚酰亚胺膜波动。解决方案：印刷电路板包括形成在基板上的导电金属层和绝缘膜的至少一个表面上的基板金属层，其特征在于，导电金属层的下端部分的宽度在布线图案的截面小于该截面中的基板金属层的上端部的一部分，另外，电路装置通过将电子部件安装在印刷电路板上而构成。印刷电路板的制造方法的特征在于，在将基板金属层和导电金属层与溶解导电金属的蚀刻液接触以形成布线图案之后，液体与溶解的第一处理液接触形成基板金属层的金属，然后在液体与选择性地溶解导电金属的微蚀刻液接触之后，液体与不同于第一处理液的化学成分的第二处理液接触。通过制造方法，几乎不发生从基板金属层的迁移，并且施加电压之后的端子间电阻值的波动非常小。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004221548A Film carrier tape for electronic mounting and its manufacturing method 有权
公开(公告)号：JP2004221548A
公开(公告)日：2004-08-05
申请号：JP2003407541
申请日：2003-12-05
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO , AKASHI YOSHIICHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a film carrier tape for electronic mounting which is excellent in migration resistance and adhesiveness between the insulator film and the wiring, and its manufacturing method.
SOLUTION: This film carrier tape for electronic component mounting has: (1) a seed layer 16 comprising a zinc layer formed on the treated surface of an insulator film 12 and a nickel-based metal layer formed on the surface of the zinc layer, (2) a seed layer 16 comprising an alloy layer which is made of an alloy containing specified amounts of nickel and aluminum and is formed on the treated surface of the insulator film 12, or (3) a continuous zinc coating layer containing zinc over at least a part of a region extending from the edges at width direction of wiring 14 to the surface of the insulator film 12.
COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2009277987A Film-carrier tape for mounting electronic component and its manufacturing method, and semiconductor device 审中-公开
标题翻译：用于安装电子元件的薄膜载带及其制造方法和半导体器件
公开(公告)号：JP2009277987A
公开(公告)日：2009-11-26
申请号：JP2008129596
申请日：2008-05-16
申请人： Mitsui Mining & Smelting Co Ltd , 三井金属鉱業株式会社
发明人： KATAOKA TATSUO
IPC分类号： H01L21/60
CPC分类号： H01L2224/50
摘要： PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component having high connection reliability, a method for manufacturing the film carrier tape, and a semiconductor device using the film carrier tape. SOLUTION: The film carrier tape 10 for mounting the electronic component comprises: an inner lead 20 connected to the electronic component 50 through a bump electrode 52 formed on the electronic component 50 for processing an input/output signal from the electronic component; and an outer lead for input/output processing of a signal from the inner lead 20 through a wiring pattern. A fitting concave part 54 with the bump electrode 52 fit-connected therein is formed to the inner lead 20 for connecting with the bump electrode 52 formed to the electronic component 50. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装具有高连接可靠性的电子部件的胶片载体带，用于制造胶片载带的方法，以及使用胶片载带的半导体装置。解决方案：用于安装电子部件的胶片载带10包括：内引线20，其通过形成在电子部件50上的突起电极52连接到电子部件50，用于处理来自电子部件的输入/输出信号; 以及外引线，用于通过布线图案对来自内引线20的信号进行输入/输出处理。形成与凸起电极52嵌合的嵌合凹部54到内引线20，用于与形成于电子部件50的突起电极52连接。（C）2010，JPO＆INPIT

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