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1. 发明专利

JP2014160741A Normal-temperature bonding apparatus, normal-temperature bonding method, flattening apparatus, and flattening method 有权
标题翻译：正常温度接合装置，正常温度接合方法，平铺装置和平铺方法
公开(公告)号：JP2014160741A
公开(公告)日：2014-09-04
申请号：JP2013030405
申请日：2013-02-19
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社 , National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , UCHIUMI ATSUSHI , IDE KENSUKE , TAKAGI HIDEKI , KURASHIMA YUICHI , MAEDA ATSUHIKO
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24 , B23K20/26
摘要： PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.
摘要翻译：要解决的问题：提高将多个基板接合在一起时的接合可靠性。解决方案：常温接合装置包括：激活装置16，其发射激活光束Ba和Bb，第一基板52的第一表面50和照射第二基板42的第二表面40; 以及通过使第一表面50和第二表面40在第一表面50和第二表面40被激活之后使彼此接触而将第一基板52和第二基板42接合在一起的按压接触机构15 光束Ba和Bb。激活光束Ba和Bb含有氖原子。

2. 发明专利

JP2014086400A High speed atom beam source and normal temperature bonding device including the same 审中-公开
标题翻译：高速原子束源和包括其的正常温度结合装置
公开(公告)号：JP2014086400A
公开(公告)日：2014-05-12
申请号：JP2012237049
申请日：2012-10-26
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUTSUMI KEIICHIRO , TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASAHITO , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： H05H3/02 , B23K20/00 , G21K1/00 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To minimize unnecessary emission of particles.SOLUTION: A high speed atom beam source includes a housing 11 and an electrode body 12. The housing 11 has a box shape, includes a grid 14 on one face thereof, and serves as a cathode. The electrode body 12 is provided at the inside of the housing 11, and serves as an anode generating a saddle field type electric field. In at least one of the housing 11 and the electrode body 12, at least a part is formed of a first material hardly sputtered by ions generated by the electric field, or at least a part of a face capable of being irradiated with ions is covered with a coating layer using the first material.
摘要翻译：要解决的问题：最小化不必要的颗粒发射。解决方案：高速原子束源包括壳体11和电极体12.壳体11具有盒形，在其一个表面上包括栅格14，并且用作一个阴极。电极体12设置在壳体11的内部，并且用作产生鞍场型电场的阳极。在壳体11和电极体12中的至少一个中，至少一部分由不被电场产生的离子溅射的第一材料形成，或者能够被离子照射的面的至少一部分被覆盖使用第一材料的涂层。

3. 发明专利

JP2013051358A Normal temperature joining device and normal temperature joining method 审中-公开
标题翻译：正常温度接合装置和正常温度接合方法
公开(公告)号：JP2013051358A
公开(公告)日：2013-03-14
申请号：JP2011189441
申请日：2011-08-31
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUTSUMI KEIICHIRO , GOTO TAKAYUKI , TSUNO TAKESHI , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： H01L21/02 , B23K20/00 , B23K20/26 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To enable an electrostatic chuck to securely hold a substrate.SOLUTION: In a normal temperature joining device, a jig 41 is fixed to a first substrate 51. An electrostatic chuck 14 holds the jig 14 with electrostatic force and thereby holding the first substrate 51. A joining mechanism 15 causes the first substrate 51 to contact with the second substrate 31 when the jig 41 is held by the electrostatic chuck 14 and thereby joining the first substrate 51 to the second substrate 31. In the case where the jig 41 is formed so as to be held directly by the electrostatic chuck 14 even when it is difficult that the electrostatic chuck 14 directly holds the first substrate 51, the normal temperature joining device allows the electrostatic chuck 14 to hold the first substrate 51 more securely and joins the first substrate 51 to the second substrate 31 more properly.
摘要翻译：要解决的问题：使静电卡盘牢固地保持基板。解决方案：在常温接合装置中，夹具41固定到第一基板51.静电卡盘14用静电力保持夹具14，从而保持第一基板51.接合机构15使第一基板 51，当夹具41被静电吸盘14保持时与第二基板31接触，从而将第一基板51接合到第二基板31.在夹具41形成为被静电保持的情况下卡盘14即使当静电卡盘14难以直接保持第一基板51时，常温接合装置允许静电卡盘14更牢固地保持第一基板51，并且将第一基板51更接近第二基板31 。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013046033A Normal temperature bonding device and normal temperature bonding method 审中-公开
标题翻译：正常温度接合装置和正常温度接合方法
公开(公告)号：JP2013046033A
公开(公告)日：2013-03-04
申请号：JP2011185084
申请日：2011-08-26
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , KINOUCHI MASAHITO , GOTO TAKAYUKI , IDE KENSUKE , SUZUKI TAKENORI
IPC分类号： H01L21/02 , B23K20/00
摘要： PROBLEM TO BE SOLVED: To make a normal temperature bonding device more compact.SOLUTION: The normal temperature bonding device comprises a plurality of beam sources 17-1 through 17-4, 18-1 through 18-4, and a controller for controlling so that some of the plurality of beam sources 17-1 through 17-4, 18-1 through 18-4 emit particles but the other beam sources do not emit particles. This normal temperature bonding device does not require a large vacuum exhaust device having an exhaust speed that is required when the plurality of beam sources 17-1 through 17-4, 18-1 through 18-4 emit particles all at once. The normal temperature bonding device can be manufactured more compactly by providing a compact vacuum exhaust device having an exhaust speed that is required when only some of the plurality of beam sources emit particles.
摘要翻译：要解决的问题：使常温接合装置更紧凑。解决方案：常温接合装置包括多个光束源17-1至17-4,18-1至18-4，以及控制器，用于控制使得多个光束源17-1至 17-4,18-1至18-4发射颗粒，但其他光束源不发射颗粒。这种常温接合装置不需要具有当多个光束源17-1至17-4,18-1至18-4同时发射颗粒时所需的排气速度的大型真空排气装置。通过提供一种紧凑的真空排气装置，可以更紧凑地制造常温接合装置，该真空排气装置具有仅当多个光束源中的一些发射粒子时所需的排气速度。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012138418A Joint apparatus 有权
标题翻译：联合装置
公开(公告)号：JP2012138418A
公开(公告)日：2012-07-19
申请号：JP2010288450
申请日：2010-12-24
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , KINOUCHI MASAHITO , GOTO TAKAYUKI , IDE KENSUKE
IPC分类号： H01L21/02 , B23K20/00 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a joint apparatus capable of processing substrates having different diameters and efficiently producing joint substrates.SOLUTION: A suction force exerting region 47 in which a pattern electrode 49 is buried and which sucks and holds an upper substrate SA by exerting adsorption force, is provided on a contact surface 46 of an electrostatic chuck 45 provided on a lower edge of a substrate holding part 44. The suction force exerting region 47 is formed in the size that the upper substrate SA1 covers the suction force exerting region 47 when the upper substrate SA1 having a minimum diameter among substrates to be processed is sucked. In the suction force exerting region 47, a detection window W where a contact part 55 of a movable part 58 configuring a detection sensor 50 moves back and forth, is opened. Thereby it is possible to detect not only the suction/non-suction to the electrostatic chuck 45 of the upper substrate SA1 but also the suction/non-suction to the electrostatic chuck 45 of upper substrates SA2, SA3 having diameters larger than that of the upper substrate SA1.
摘要翻译：要解决的问题：提供一种能够处理具有不同直径的基板并且有效地生产接头基板的接合装置。解决方案：在设置在下边缘的静电卡盘45的接触表面46上设置吸入力47的区域47，其中埋设有图案电极49并通过施加吸附力吸住并保持上基板SA 当吸入要处理的基板中的最小直径的上基板SA1时，吸力施加区域47形成为上基板SA1覆盖吸力施加区域47的尺寸。在吸力施加区域47中，打开构成检测传感器50的可动部件58的接触部55前后移动的检测窗口W。因此，不仅可以检测上基板SA1的静电卡盘45的吸入/非吸引，而且可以检测直径大于上基板SA1的上基板SA2，SA3的静电卡盘45的吸入/非吸引上基板SA1。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012125817A Joining device 有权
标题翻译：加工设备
公开(公告)号：JP2012125817A
公开(公告)日：2012-07-05
申请号：JP2010280409
申请日：2010-12-16
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KINOUCHI MASAHITO , GOTO TAKAYUKI , TSUNO TAKESHI , IDE KENSUKE , SUZUKI KITEN
IPC分类号： B23K20/00 , B23K20/24 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a cold joining device with improved reliability having a detection sensor capable of detecting an attraction state of a substrate to an electrostatic chuck without being influenced by impurities caused by activation.SOLUTION: The cold joining device 1 includes a substrate holding part 44 for attracting and holding an upper substrate SA, an ion gun 32 for cleaning the upper substrate SA attracted by the substrate holding part 44, the detection sensor 50 disposed on the substrate holding part 44, and a control part 4 for controlling the ion gun 32 by the detection result of the detection sensor 50. The detection sensor 50 includes a movable part 53 displaced in contact with the upper substrate SA attracted by the substrate holding part 44, and a detection part 54 for detecting the movable part 53. When the upper substrate SA is attracted by the substrate holding part 44, the detection sensor 50 is shielded from the outside by the upper substrate SA, and therefore, the detection sensor 50 is not influenced by the impurities caused by irradiation of the ion gun 32.
摘要翻译：要解决的问题：提供一种具有改进可靠性的冷连接装置，该冷连接装置具有检测传感器，该检测传感器能够在不受激活引起的杂质影响的情况下检测基板对静电卡盘的吸引状态。解决方案：冷连接装置1包括用于吸附和保持上基板SA的基板保持部44，用于清洁被基板保持部44吸引的上基板SA的离子枪32，设置在基板保持部44上的检测传感器50 基板保持部44，以及用于通过检测传感器50的检测结果来控制离子枪32.控制部分4包括与被基板保持部44吸引的上基板SA相接触的移动部53 以及用于检测可动部53的检测部54.当上基板SA被基板保持部44吸引时，检测传感器50被上基板SA与外部隔绝，因此检测传感器50为不受离子枪32照射引起的杂质的影响。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011096781A Controller for bonding apparatus, and multilayer bonding method 有权
标题翻译：用于粘接装置的控制器和多层粘结方法
公开(公告)号：JP2011096781A
公开(公告)日：2011-05-12
申请号：JP2009247855
申请日：2009-10-28
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KINOUCHI MASAHITO , GOTO TAKAYUKI , TSUNO TAKESHI , IDE KENSUKE , SUZUKI KITEN
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14 , B23K20/24 , B81C3/00
CPC分类号： H01L21/67092 , B81C1/00357 , B81C99/0025
摘要： PROBLEM TO BE SOLVED: To bond three or more substrates into one bonded substrate at high speed. SOLUTION: A multilayer bonding method includes a step S12 of manufacturing a first bonded substrate by bonding an upper substrate and its intermediate substrate together in a bonding chamber, a step S13 of carrying its lower substrate in the bonding chamber when the first bonded substrate is arranged in the bonding chamber, and a step S14 of manufacturing a second bonded substrate by joining the first bonded substrate and its lower substrate together in the bonding chamber. In such a multilayer bonding method, its upper substrate can be bonded with its lower substrate without being taken out of the bonding chamber after being bonded with its intermediate substrate. Consequently, the second bonded substrate can be manufactured at high speed, so it is manufactured inexpensively. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：将三个或更多个基板以高速结合到一个键合的基板中。解决方案：多层接合方法包括通过在接合室中将上基板和其中间基板接合在一起来制造第一接合基板的步骤S12;当第一接合时，将其下基板承载在接合室中的步骤S13 衬底布置在接合室中，并且步骤S14通过在接合室中将第一接合衬底及其下衬底接合在一起来制造第二接合衬底。在这种多层接合方法中，其上基板可以与其下基板结合，而不会在与其中间基板接合之后从接合室中取出。因此，第二接合衬底可以高速制造，因此廉价地制造。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011071445A Jointing apparatus 有权
标题翻译：连接装置
公开(公告)号：JP2011071445A
公开(公告)日：2011-04-07
申请号：JP2009223298
申请日：2009-09-28
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , KINOUCHI MASAHITO , GOTO TAKAYUKI , SUZUKI KITEN , IDE KENSUKE
IPC分类号： H01L21/02 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To hold a jointing object without fail. SOLUTION: A jointing apparatus includes an electrostatic chuck 18 and an activating device. The electrostatic chuck 18 holds the object to be jointed 7, by applying a voltage to internal electrodes 22-1 to 22-2 via terminals 23-1 to 23-2. The activating device has the surface of the object to be jointed 7 held by the electrostatic chuck 18 irradiated with particles. The terminals 23-1 to 23-2 are arranged, in a region having no irradiation of the particles on the front surface of the electrostatic chuck 18; and consequently, in the jointing apparatus, the thin film of a conductor to be formed by the long-term irradiation of the particles is prevented from forming in the neighborhood of the terminals 23-1 to 23-2; spark discharge caused by the voltage to be applied on the internal electrodes 22-1 to 22-2 is prevented from occurring; and the electrostatic chuck 18 is able to hold the object to be jointed 7 without fail. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：保持连接对象，不要失败。解决方案：接合装置包括静电吸盘18和启动装置。静电吸盘18通过端子23-1至23-2向内部电极22-1至22-2施加电压，从而保持要接合的物体7。激活装置具有由被颗粒照射的静电卡盘18保持的被接合物体7。端子23-1至23-2布置在静电卡盘18的前表面上没有颗粒照射的区域中; 因此，在接合装置中，防止了通过长期照射颗粒形成的导体的薄膜在端子23-1至23-2附近形成; 防止施加在内部电极22-1〜22-2上的电压引起的火花放电发生; 并且静电卡盘18能够不间断地保持要被接合的物体7。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010120068A Joining device 有权
标题翻译：加工设备
公开(公告)号：JP2010120068A
公开(公告)日：2010-06-03
申请号：JP2008297614
申请日：2008-11-21
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TAWARA SATOSHI , IDE KENSUKE , GOTO TAKAYUKI
IPC分类号： B23K20/00 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To reliably dechuck an object to be joined which is held by a chuck. SOLUTION: A joining apparatus comprises a chuck 12, a member 24, and a supply and exhaust device. A holding face 21, a cylinder chamber 23 and a hole 27 are formed in the chuck 12. The holding face 21 comes into contact with an object 22 to be joined when the chuck 12 holds the object 22. The cylinder chamber 23 is formed inside the chuck 12. The member 24 separates the cylinder chamber 23 to a first chamber 26 and a second chamber 25. The hole 27 connects the second chamber 25 to the holding face 21. The supply and exhaust device supplies air to the first chamber 26, or exhausts air from the first chamber 26. The member 24 has a projection part which is projected from the holding face 21 via the hole 27 by supplying air to the first chamber 26. The joining apparatus can reliably dechuck the object 22 to be held by the holding face 21 by projecting the projection part from the holding face 21. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：可靠地将由卡盘保持的待接合物体卡住。解决方案：接合装置包括卡盘12，构件24和供排气装置。保持面21，气缸室23和孔27形成在卡盘12中。当卡盘12保持物体22时，保持面21与要接合的物体22接触。气缸室23形成在内部构件24将气缸室23分离成第一室26和第二室25.孔27将第二室25连接到保持面21.供排装置将空气供应到第一室26，或从第一室26排出空气。构件24具有通过向第一室26供给空气而经由孔27从保持面21突出的突出部。接合装置可以可靠地将对象物22卡住以保持保持面21通过将投影部从保持面21突出来。
版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009208084A Cold joining device 有权
标题翻译：冷连接装置
公开(公告)号：JP2009208084A
公开(公告)日：2009-09-17
申请号：JP2008050551
申请日：2008-02-29
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TSUNO TAKESHI , GOTO TAKAYUKI , KINOUCHI MASAHITO , TAWARA SATOSHI , UCHIUMI ATSUSHI , TSUMURA YOICHIRO , IDE KENSUKE , SUZUKI KITEN
IPC分类号： B23K20/00 , B23K20/14 , B23K20/24 , B23K101/40 , H01L21/02
CPC分类号： H01L21/67778 , H01L21/67092 , H01L21/6732 , H01L21/67748 , H01L21/68 , H01L21/683 , Y10T156/1744
摘要： PROBLEM TO BE SOLVED: To load a large load to a joining surface uniformly. SOLUTION: The cold joining device is provided with an angle adjustment mechanism 12 for supporting a first sample base 13 on a first stage 11 so as to change the direction of the first sample base 13 which supports a first substrate, a first drive device 14 for driving the first stage 11 in a first direction, a second drive device for driving a second sample base 46 for holding a second substrate in a second direction, and a carriage support base for supporting the second sample base in the first direction when the first substrate and the second substrate are brought into pressure contact with each other. Then, the cold joining device 1 applies a large load exceeding the limit load of the second drive device to the first substrate and the second substrate. The cold joining device 1 changes the direction of the first substrate using the angle adjustment mechanism 12 to bring the first substrate and the second substrate into parallel contact with each other and loads the large load to the joining surface uniformly. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：将大的负载均匀地加载到接合表面。解决方案：冷连接装置设置有角度调节机构12，用于在第一平台11上支撑第一样本基座13，以便改变支撑第一基板的第一样本基座13的方向，第一驱动用于沿第一方向驱动第一台11的装置14，用于驱动用于沿第二方向保持第二基板的第二样本基座46的第二驱动装置和用于沿第一方向支撑第二样本基座的滑架支撑基座，第一基板和第二基板彼此压力接触。然后，冷连接装置1将超过第二驱动装置的极限载荷的大负载施加到第一基板和第二基板。冷连接装置1使用角度调节机构12改变第一基板的方向，使第一基板和第二基板平行接触，并且将大的负载均匀地加载到接合面。版权所有（C）2009，JPO＆INPIT

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