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1. 发明专利

JP2010138364A Resin composition, prepreg and metal foil laminated plate 有权
标题翻译：树脂组合物，PREPREG和金属箔层压板
公开(公告)号：JP2010138364A
公开(公告)日：2010-06-24
申请号：JP2009025855
申请日：2009-02-06
申请人： Mitsubishi Gas Chemical Co Inc , 三菱瓦斯化学株式会社
发明人： MORI KENICHI , ITO SHOICHI
IPC分类号： C08G59/32 , B32B15/08 , C08G65/48 , C08J5/24
CPC分类号： B32B15/092 , C08G65/44 , C08G65/485 , C08J5/24 , C08J2363/00 , C08K5/3415 , C08L63/00 , C08L71/126 , H05K1/0353 , H05K1/036 , H05K1/0366 , H05K1/056 , Y10T428/31511 , Y10T428/31522 , Y10T428/31529 , Y10T442/2934 , Y10T442/30 , Y10T442/3415 , Y10T442/3423 , C08L2666/22
摘要： PROBLEM TO BE SOLVED: To provide a resin composition based on a vinyl compound and for use in a printed wiring board for a multilayer board or for high frequency wave, which is excellent in varnish shelf life at low temperature and does not show the decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and to provide a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition. SOLUTION: The resin composition contains a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种基于乙烯基化合物的树脂组合物，并且用于多层板或高频波的印刷线路板，其在低温下的清漆保质期优异且不显示多层成形性，吸湿后的耐热性，冬季和长时间的电特性和剥离强度的降低，以及提供预浸料，金属箔覆层压板和树脂片，使用上述树脂组合物。解决方案：树脂组合物含有具有聚苯醚骨架的双官能亚苯基醚低聚物的末端乙烯基化合物（a），特殊的马来酰亚胺化合物（b），萘酚芳烷基型氰酸酯树脂（c）和萘 - 骨架改性酚醛清漆型环氧树脂（d）。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010138366A Resin composition, prepreg and metal foil-clad laminate 有权
标题翻译：树脂组合物，PREPREG和金属箔层压板
公开(公告)号：JP2010138366A
公开(公告)日：2010-06-24
申请号：JP2009089273
申请日：2009-04-01
申请人： Mitsubishi Gas Chemical Co Inc , 三菱瓦斯化学株式会社
发明人： MORI KENICHI , ITO SHOICHI
IPC分类号： C08L71/10 , B32B15/08 , B32B17/04 , C08J5/24 , C08K3/00 , C08K5/16 , C08L63/00 , H05K1/03
CPC分类号： H05K1/0373 , C08G65/485 , C08K3/36 , C08K7/20 , C08L63/00 , C08L65/00 , C08L67/00 , C08L69/00 , C08L71/126 , H05K2201/012 , H05K2201/0209 , Y10T428/31678 , Y10T442/30 , C08L2666/14
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a vinyl compound as a base component and is for use in a printed wiring board for high frequency and is improved in conventional problems of moldability and copper foil peel strength, without any decrease in electric characteristics and heat resistance after moisture absorption while keeping flame retardancy, a prepreg composed of the above resin composition, and to provide a metal plate-clad laminate and a resin sheet. SOLUTION: The resin composition contains a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl type cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The prepreg is composed of the above resin composition and a glass woven fabric. The metal-foil-clad laminate is obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and the resin sheet is obtained by applying a solution of the above resin composition to a surface of a metal foil or a film. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：为了提供含有乙烯基化合物作为基础成分并用于高频印刷线路板的树脂组合物，并且改进了常规的成型性和铜箔剥离强度的问题，没有任何在保持阻燃性的同时降低吸湿后的电特性和耐热性，由上述树脂组合物制成的预浸料，并且提供覆金属层压板和树脂片。解决方案：树脂组合物含有具有聚苯醚结构的双官能亚苯基醚低聚物的末端乙烯基化合物（a），萘酚芳烷基型氰酸酯树脂（b），双酚A氰酸酯树脂（c），溴化阻燃剂（d）和无机填料（e）。预浸料由上述树脂组合物和玻璃织物构成。通过在至少一个预浸料坯的叠层的一侧或两侧设置金属箔，并且通过将上述树脂组合物的溶液涂布在金属箔的表面上而获得树脂片而获得覆盖有金属箔的层叠体或电影。版权所有（C）2010，JPO＆INPIT

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