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1. 发明专利

JPH1070414A PIEZOELECTRIC OSCILLATOR 失效
公开(公告)号：JPH1070414A
公开(公告)日：1998-03-10
申请号：JP15942597
申请日：1997-06-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SATOU HIROKI , KONDO SHUJI
IPC分类号： H03B5/32 , H03H9/10
摘要： PROBLEM TO BE SOLVED: To stabilize the output frequency of the piezoelectric oscillator. SOLUTION: This piezoelectric oscillator is provided with a 1st package 22 formed by applying resin mold to an integrated circuit element 36 fixed on a lead frame 37 and a 2nd package 21 containing a crystal vibrator 31 being an example of a piezoelectric element in the inside and having shield face to at least its upper side, the 2nd package 21 is integrated on the 1st package 22, and the integrated circuit element 36 of the 1st package 22 is electrically connected to the crystal vibrator 31 of the 2nd package 21.

2. 发明专利

JPH09244363A ELECTRONIC COPIER 失效
公开(公告)号：JPH09244363A
公开(公告)日：1997-09-19
申请号：JP5573896
申请日：1996-03-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI , ANDA MITSUO
IPC分类号： G03B27/62 , G03G15/045 , G03G15/36 , G03G21/00
摘要： PROBLEM TO BE SOLVED: To easily and surely make a copy even when a platen cover is opened by recognizing the size of a document set on an original platen, and detecting that the platen cover is open to perform the edge treatment. SOLUTION: An opening/closing sensor of a platen cover opening/closing detection part 1 is provided in the vicinity of a hinge part of the platen cover. An edge treatment judging part 2 determines whether or not the edge treatment is performed by the information from the platen cover opening/closing detection part 1. An image erasure control part 4 determines the erasure quantity of the image by the information on the size of a document from a document size detection part 3 and the information on presence/absence of the edge treatment from the edge treatment judging part 2. When the platen cover is not closed, the edge treatment corresponding to the document size is performed. No unnecessary toner is adhered to the copying paper even when a copy is made while the platen cover is open.

3. 发明专利

JPH0998020A OSCILLATOR 失效
公开(公告)号：JPH0998020A
公开(公告)日：1997-04-08
申请号：JP25598695
申请日：1995-10-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI , MOCHIDA YOSHIHISA
IPC分类号： H01L21/60 , H03B5/04 , H03B5/32
摘要： PROBLEM TO BE SOLVED: To suppress the fluctuation of oscillation frequency by connecting together the electrodes of both control and oscillation elements via the bonding wires. SOLUTION: Plural wiring patterns 2 and external terminals 3 are provided on the surface of a substrate 1, and an oscillation element 4 and its control element 5 are also mounted on the surface of the substrate 1. The element 5 includes plural electrodes 5a, and these elements 5a are connected to the patterns 2 via the bonding wires 6. At the same time, two electrodes 5a of the element 5 are directly connected to an electrode 4a of the element 4 via the wires 6. That is, the oscillation of the element 4 is controlled by the element 5 via the wires 6, and the oscillation output is outputted to the terminal 3 via the wires 6, the element 5 and the patterns 2. In such a constitution, the fluctuation of oscillation frequency can be suppressed owing to a hollow wiring consisting of the wires 6.

4. 发明专利

JPH07221590A ELECTRONIC COMPONENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH07221590A
公开(公告)日：1995-08-18
申请号：JP920394
申请日：1994-01-31
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI
IPC分类号： H03H3/08 , H03H9/10 , H03H9/25
摘要： PURPOSE:To simplify the connection between an electrode of a component in a package and a lead electrode with respect to an electronic component and its manufacture. CONSTITUTION:A vessel is provided with a through hole 7; the through hole 7 at the inner face side of the vessel is sealed with a metallic foil 13; and an electrode 6 of the component is connected to the inner face side of the vessel of the metallic foil 13. Since the metallic foil is bonded to the electrode of the component directly via the through hole 7, it is not required to form a bump or the like or the connection, and the electrode of the component contained in the air-tight package is easily led out externally.

5. 发明专利

JPH0644187B2 失效
公开(公告)号：JPH0644187B2
公开(公告)日：1994-06-08
申请号：JP2915385
申请日：1985-02-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI , KITAHIRO ISAMU
IPC分类号： G02F1/1347 , G02F1/133 , G02F1/1335 , G09F9/35 , G09F9/40

6. 发明专利

JPH0677282A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0677282A
公开(公告)日：1994-03-18
申请号：JP22560492
申请日：1992-08-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA SADASHI , TAKASE YOSHIHISA , KONDO SHUJI , FUKUI YASUHARU
IPC分类号： H01L21/60 , H01L21/321
摘要： PURPOSE:To protect an LSI against damage or to prevent a protrudent conductor from being defectively transferred in a process where the protrudent conductor transfer is transferred to the Al electrode of an LSI. CONSTITUTION:Protrudent conductor 14 and adhesive agents 15 are provided onto a film base 11, the protrudent conductors 14 and Au thin films 17 of LSI chips 16 are aligned with each other, and the LSI chips 16 are temporarily fixed to and arranged on the film base in line. The LSI chips 16 are transferred using the film base 11 as a carrier. After the chips 16 are separated off from the film base 11, then the protrudent conductors 14 and the electrodes of a mounting wiring board are aligned with each other, the electrodes of the LSI chips 16 and the protrudent conductors 14, and the protrudent conductors and the electrodes of the wiring board are pressed against each other till insulating adhesive material provided between them is discharged, and the adhesive agent is cured to fix the LSI chips 16 to the wiring board and to electrically connect them together.

7. 发明专利

JPH067552B2 失效
公开(公告)号：JPH067552B2
公开(公告)日：1994-01-26
申请号：JP6099484
申请日：1984-03-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI , KITAHIRO ISAMU
IPC分类号： H01L21/60 , H01L21/48 , H01L23/498 , H01L21/321

8. 发明专利

JPH063813B2 失效
公开(公告)号：JPH063813B2
公开(公告)日：1994-01-12
申请号：JP21110484
申请日：1984-10-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KITAHIRO ISAMU , KONDO SHUJI , ARAI MASAJI
IPC分类号： H01L29/78 , G02F1/136 , G02F1/1368 , H01L21/027 , H01L21/336 , H01L27/12 , H01L29/786 , H01L29/784

9. 发明专利

JPH05343473A 失效
公开(公告)号：JPH05343473A
公开(公告)日：1993-12-24
申请号：JP15171792
申请日：1992-06-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA SADASHI , TAKASE YOSHIHISA , KONDO SHUJI , FUKUI YASUHARU , MORI NOBORU
IPC分类号： H01L21/52 , H01L21/60
摘要： PURPOSE:To achieve that a semiconductor chip is not stripped off from an insulating substrate so as to keep their electrical connection although a bump electrode and an electrode for the semiconductor chip are shaken even when a temperature is raised or lowered and a thermal shock is exerted by a method wherein the connection of the bump electrode to the electrode for the semiconductor chip is formed as a pressure- contact structure wherein an adhesive is hardened while they are being pressurized. CONSTITUTION:An Au paste is printed and baked so as to match the position of an electrode 12 for a semiconductor element 11 to be mounted; an Au bump electrode 17 is formed on an insulating substrate 19 which is provided with a conductor wiring 18. In addition, a nonoxidizing metal conductor film 13 is formed on the electrode part 12 for the semiconductor element 11. In addition, an insulating adhesive 14 which has been made filmlike is applied to a semiconductor-element mounting part on the insulating substrate 19 or to an interconnection face on the semiconductor element 11. The electrode 12 for the semiconductor element 11 is aligned with the bump electrode 17. While they are being pressurized, the adhesive 14 is hardened. The semiconductor element 11 is fixed and bonded to the insulating substrate 19 and the bump electrode 17 is connected electrically to the electrode 12 for the semiconductor element 11.

10. 发明专利

JPH03142295A IC CARD MODULE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH03142295A
公开(公告)日：1991-06-18
申请号：JP28325689
申请日：1989-10-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO SHUJI
IPC分类号： B42D15/10 , H01L21/60
摘要： PURPOSE:To decrease the steps of assembly while reducing mounting thickness by face-down connection, and to realize a coin-shaped thin-type circular module by using the reverse main surface of a ring-shaped conductor exposed to one surface of a resin layer as the electrode terminal for transmitting and receiving information of a semiconductor element. CONSTITUTION:Electrode rings 61-66 are exposed only on a reverse main surface on the LSI chip 9 loading side, the whole rings 61-66 are resin-molded by a molding resin material 11, an LSI chip 9 is resin-sealed while being bonded and fixed by the molding resin 11, and a circular module 7, on one surface of which the ring electrodes 6 of concentric circles are exposed, is formed. The exposed surface of the electrode rings, a connecting section 21 mutually coupling the electrode rings remaining in the surface section of a package, is drilled 23 shallowly through drilling, etc., the connecting-section metal 21 is cut and removed, and the electrode rings 61-66 are separated, thus manufacturing the independent concentric circular electrodes 6. Accordingly, the mounting thickness of the LSI chip is reduced, and an ultrathin type circular module is realized, thus allowing expansion to novel application of an IC card.

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