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1. 发明专利

JP2011228934A Power module 有权
标题翻译：电源模块
公开(公告)号：JP2011228934A
公开(公告)日：2011-11-10
申请号：JP2010096896
申请日：2010-04-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YONEYAMA REI , OKABE HIROYUKI , ITANI NORITAKA
IPC分类号： H03K17/08 , H01L23/58 , H01L25/07 , H01L25/18 , H01L27/04 , H01L29/12 , H01L29/739 , H01L29/78 , H03K17/56
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power module that performs determination of overcurrent protection with high accuracy.SOLUTION: A power module comprises: a semiconductor device 1 having a main electrode and a sense electrode; a sense resistor R, the one end of which is connected to a sense electrode S of the semiconductor device 1, that converts a sense current depending on the main current of the semiconductor device 1, into a voltage; a first wiring 4 connecting the other terminal of the sense resistor Rto a control ground; a second wiring 5 connecting the main electrode to a main terminal E; a first current path 6 connecting the main electrode side of the second wiring 5 to the sense resistor Rside of the first wiring 4; and a second current path 7 connecting the control ground side of the first wiring 4 to the main terminal E side of the second wiring 5.
摘要翻译：要解决的问题：提供以高精度执行过电流保护的电源模块。解决方案：功率模块包括：具有主电极和感测电极的半导体器件1; 感测电阻器R s ，其一端连接到半导体器件1的检测电极S，该检测电阻器根据半导体器件的主电流转换检测电流 1，变成电压; 将检测电阻器R s 的另一个端子连接到控制地的第一布线4; 将主电极连接到主端子E的第二布线5; 将第二配线5的主电极侧与第一配线4的检测电阻器R s> SB连接的第一电流通路6; 以及将第一配线4的控制接地侧与第二配线5的主端子E侧连接的第二电流路径7.（C）2012，JPO＆INPIT

2. 发明专利

JP2002208673A SEMICONDUCTOR DEVICE AND POWER MODULE 失效
公开(公告)号：JP2002208673A
公开(公告)日：2002-07-26
申请号：JP2001002437
申请日：2001-01-10
申请人： MITSUBISHI ELECTRIC CORP
发明人： ITANI NORITAKA , OTA TATSUO
IPC分类号： H01L25/07 , H01L25/065 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a power module for which the increase in area is suppressed, the increase in time and cost required for manufacture is suppressed, and an inspection matched with the rating of an element is performed in a chip state. SOLUTION: A semiconductor device is constituted by laminating a chip, where a reflux diode 2a is formed onto the chip mounting a switching element 1a thereon, and by fixing planar connection terminals Te1, Tc1 and Tc2 to the main surfaces of both chips and between both chips. By using a plurality of the semiconductor devices, the power module is constituted. Thus, the increase in the area is suppressed. Also, since the planar connection terminals are adopted, the need for using a bonding wire for connections to both chips is eliminated and the disadvantages of the time and the cost required for the manufactured that the bonding wire has is dissolved. Further, a large current is made to flow to the planar connection terminals Te1 and Tc2, and the inspection matched with the rating of the element is carried out.

3. 发明专利

JP2002203940A SEMICONDUCTOR POWER MODULE 失效
公开(公告)号：JP2002203940A
公开(公告)日：2002-07-19
申请号：JP2001000115
申请日：2001-01-04
申请人： MITSUBISHI ELECTRIC CORP
发明人： ITANI NORITAKA , YOSHIDA HIROSHI
IPC分类号： H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To overcome the problem of a prior art such that a semiconductor power module is expensive since an insulating board with excellent thermal conductivity is used even in a control circuit section, and hence the number of processes increases. SOLUTION: In this semiconductor power module for packaging a main circuit section for mounting a power element, and the control circuit section for mounting a control element that controls the power element, a control terminal for external connection at the control circuit section is inserted into a case, a control circuit pattern is formed at one portion of the control terminal for external connection, and the control element is mounted onto the control circuit pattern.

4. 发明专利

JP2004127983A Power semiconductor device 审中-公开
公开(公告)号：JP2004127983A
公开(公告)日：2004-04-22
申请号：JP2002286031
申请日：2002-09-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ITANI NORITAKA
IPC分类号： H01L25/07 , H01L25/18 , H02H3/08
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor device for accurately determining an overcurrent in response to a temperature change.
SOLUTION: In this power semiconductor device, two main terminals C and E, a control terminal G for controlling conductivity between the two main terminals C and E, switching elements 11x-11z having a sense terminal S for current sensing, and a temperature sensor 15 for sensing the temperature of the switching element 11x are formed on a semiconductor chip. A comparator 21 is provided, for which the output of the sense terminal S of the switching element 11x serves as one input, and the output of the temperature sensor 15 is the other input. The comparator 21 compares the two inputs, and outputs the result of comparison together with the sensed current signals.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JPH065847A SEMICONDUCTOR POWER MODULE 失效
公开(公告)号：JPH065847A
公开(公告)日：1994-01-14
申请号：JP15798892
申请日：1992-06-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： OSHIMA SEIICHI , ITANI NORITAKA , YAMAGATA ATSUSHI , TAKANASHI TAKESHI
IPC分类号： H01L29/78 , H01L23/538 , H01L23/64 , H01L25/07 , H01L25/16 , H01L25/18 , H01L27/04 , H01L29/739 , H02M7/5387 , H05K1/02 , H05K1/14 , H05K3/46 , H05K9/00
摘要： PURPOSE:To make it possible to prevent a malfunction of a circuit due to an electrical noise and control a large power within a high-frequency band, by installing a wiring pattern for transmitting an input signal between wiring patterns for holding a power potential. CONSTITUTION:In a circuit substrate of a four-layer structure in which a control circuit is printed, a first layer wiring pattern 133a is divided into four areas A1, A2, A3 and A8 every circuit of common power voltage. At least a part of the circumference of each position of the wiring patterns belonging to the areas A1 to A3 is surrounded by wiring patterns PEa1 to PEa3 connected to a negative power potential of the circuit belonging to each area. Similarly, a part of the circumference of a wiring pattern Pa2 for transmitting an input signal to an active semiconductor device is surrounded by a wiring pattern PEa4. Thus, an entrance of an electrical noise to the wiring pattern for transmitting the input signal to the semiconductor device out of the wiring patterns of the control circuit can be prevented.

6. 发明专利

JP2008004728A Semiconductor element, and predicting circuit and method of life thereof 有权
标题翻译：半导体元件和预测电路及其寿命方法
公开(公告)号：JP2008004728A
公开(公告)日：2008-01-10
申请号：JP2006172280
申请日：2006-06-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ITANI NORITAKA , IGARASHI TAKASHI
IPC分类号： H01L21/822 , G01R31/26 , H01L21/336 , H01L27/04 , H01L29/78
CPC分类号： H01L22/34 , G01R31/2884 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05599 , H01L2224/0603 , H01L2224/48091 , H01L2224/48463 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/1305 , H01L2924/13055 , H01L2924/19043 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a predicting method of life of a semiconductor element whereby its deteriorating state is confirmed directly. SOLUTION: There may be the case wherein a crack is so generated in the connection of the wire bonding pad of such a power semiconductor element as an IGBT with its wire due to a heat, etc. generated when using it. Finally, the wire may be separated from the pad and it fails. In this case, a life predicting wire 14 is connected with a wire bonding pad 2 of a semiconductor element 1 to confirm whether a current flows from the life predicting wire 14 to the wire bonding pad 2 or not, and to detect whether the life predicting wire 14 is peeled from the wire bonding pad 2 or not. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供半导体元件的寿命的预测方法，从而直接确认其恶化状态。解决方案：可能存在这样的情况：在使用它时产生的热等导致在诸如IGBT的这种功率半导体元件的引线接合焊盘与其导线的连接中产生裂纹。最后，电线可能与焊盘分离，故障。在这种情况下，寿命预测线14与半导体元件1的引线接合焊盘2连接，以确认电流是否从寿命预测线14流到引线接合焊盘2，并且检测寿命预测线14从导线焊盘2剥离。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2003009509A Intelligent power module 审中-公开
标题翻译：智能电源模块
公开(公告)号：JP2003009509A
公开(公告)日：2003-01-10
申请号：JP2001191109
申请日：2001-06-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ITANI NORITAKA
IPC分类号： H02M1/00 , H02M7/48 , H02M7/537 , H02M7/5387 , H03K17/08
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable intelligent power module of a relatively simple structure. SOLUTION: This intelligent power module for controlling power in which a prescribed power semiconductor device incorporates a circuit for protecting the semiconductor device includes at least a pair of power semiconductor device connected in parallel with each other each of which has a diode connected in a forward direction from an emitter to a collector, circuit structures for detecting the semiconductor device current each of which is provided so as to correspond to each semiconductor device and has a shunt resistor connected to the emitter of the semiconductor device, and a synthesizing part which synthesizes current values detected by the respective circuit structures for detecting current and outputs it to a control circuit outside the module.
摘要翻译：要解决的问题：提供一种结构相对简单的高可靠性智能功率模块。解决方案：用于控制功率的智能功率模块，其中规定的功率半导体器件包括用于保护半导体器件的电路，至少包括一对彼此并联连接的功率半导体器件，每个功率半导体器件具有沿正向连接的二极管从发射极到集电极，用于检测半导体器件电流的电路结构，每个半导体器件电流被设置为对应于每个半导体器件，并且具有连接到半导体器件的发射极的分流电阻器，以及合成器件，其合成电流值由用于检测电流的各个电路结构检测，并将其输出到模块外部的控制电路。

8. 发明专利

JP2002315303A POWER MODULE 失效
公开(公告)号：JP2002315303A
公开(公告)日：2002-10-25
申请号：JP2001118129
申请日：2001-04-17
申请人： MITSUBISHI ELECTRIC CORP
发明人： ITANI NORITAKA , SAKATA KOJI , FUKUNAGA MASANORI
IPC分类号： G01R19/165 , H01L21/822 , H01L23/58 , H01L23/62 , H01L27/04 , H02M1/00 , H03K17/08 , H03K17/56
摘要： PROBLEM TO BE SOLVED: To solve the problem of the increase of manufacturing processes and of receiving restriction on electrical performance, when a protective sensing part is provided on a power device in a power module comprising the power device and a control IC that controls the device. SOLUTION: On the power device, sensing parts for protection against overcurrent and temperature and a protective circuit that discriminates abnormality from detection signals from the sensing parts and that breaks the gate voltage of the power device are provided. On the control IC, a circuit is provided for detecting the protected state of the power device by the gate voltage or the output current of the power device.

9. 发明专利

JP2002043512A POWER MODULE 失效
公开(公告)号：JP2002043512A
公开(公告)日：2002-02-08
申请号：JP2000228863
申请日：2000-07-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： GOLAB MAJUMDAR , IWASAKI MITSUTAKA , HATAE SHINJI , ITANI NORITAKA , IWAGAMI TORU , YAMAMOTO AKIO
IPC分类号： H01L25/07 , H01L25/16 , H01L25/18 , H01L29/78 , H02M7/48 , H03K17/08
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive power module which materializes the compactification at large of itself, and also prevents the malfunction of a control IC caused by the heating of a switching semiconductor element. SOLUTION: A power module is equipped with an insulating substrate 4 which has a heat sink 2 bonded to one face and also has a circuit pattern made on the other face by an electrode layer 6. A switching semiconductor element 8 and a free wheel diode 10 connected in reverse parallel to the above switching semiconductor element 8 are arranged on the above circuit pattern. A control IC 12 for controlling the above switching semiconductor element 8 is arranged on the above free wheel diode 10.

10. 发明专利

JP2005316133A Display device and its driving circuit 审中-公开
标题翻译：显示设备及其驱动电路
公开(公告)号：JP2005316133A
公开(公告)日：2005-11-10
申请号：JP2004134007
申请日：2004-04-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAMIDA TAICHIRO , HARADA SHIGEKI , IWATA AKIHIKO , ITANI NORITAKA , NAGAHARA TERUAKI
IPC分类号： G09G3/20 , G09F9/00 , G09G3/288 , G09G3/291 , G09G3/294 , G09G3/296 , G09G3/298
摘要： PROBLEM TO BE SOLVED: To provide a display device with which the variations of impedances arising between individual current routes can be suppressed in driving the display device with fewer switching elements and desired images can be obtained by making display characteristics uniform. SOLUTION: The display device comprises a front substrate 1f and back substrate 1b constituting a panel 2, a plurality of X electrodes 3 extended in a longitudinal direction (horizontal side direction) of the front substrate 1f, a plurality of Y electrodes 4 arranged alternately with the X electrodes 3, and at least one switching element 6x connected to the plurality of the X electrodes 3 to supply an electric current to the X electrodes 3, and at least one switching element 6y connected to the plurality of the Y electrodes 4 to supply the electric current to the Y electrodes 4. The position of the switching element 6x in the direction (vertical side direction) of the front substrate 1f is different from the position of the switching element 6y in the short side direction. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种显示装置，通过使显示特性均匀，可以获得在驱动具有较少开关元件的显示装置和所需图像的情况下可以抑制各个电流路径之间出现的阻抗变化的显示装置。解决方案：显示装置包括构成面板2的前基板1f和后基板1b，在前基板1f的长度方向（水平方向）上延伸的多个X电极3，多个Y电极4 与X电极3交替布置，以及至少一个与多个X电极3连接的开关元件6x，以向X电极3提供电流，以及至少一个与多个Y电极连接的开关元件6y 4以向Y电极4提供电流。开关元件6x在前基板1f的方向（垂直方向）上的位置与开关元件6y在短边方向上的位置不同。版权所有（C）2006，JPO＆NCIPI

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