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    • 6. 发明专利
    • METHOD AND DEVICE FOR DRIVING GAS DISCHARGE TUBE
    • JP2003259254A
    • 2003-09-12
    • JP2002055602
    • 2002-03-01
    • MATSUSHITA ELECTRIC IND CO LTD
    • TOMITA KAZUOHIROHASHI MASAKIIMAMURA HIROKOKUWATA JUN
    • G02F1/13357H04N5/66H05B41/24
    • PROBLEM TO BE SOLVED: To constitute a liquid crystal display (LCD) which gives a high picture quality and is free from degradation such as blur or blot of pictures even at the time of moving picture display on the LCD using a gas discharge tube by stopping light emission in a light emission pause period with respect to the gas discharge tube. SOLUTION: A pair of maintaining electrodes (a and b) and an auxiliary electrode are provided, and a light emission preparation period is provided in the preceding stage of a light emission period, and discharge is not performed between the maintaining electrodes a and b but is performed between the maintaining electrode a or b and the auxiliary electrode at the time of restarting discharge, and thereafter, discharge between the maintaining electrodes a and b is performed. Since light emission from gas discharge can be stopped in the light emission pause period, the light emission period and the light emission pause period can be set to arbitrary time lengths when the gas discharge tube is used in a back light for LCD or the like, and an advantageous effect is obtained that blur and blot of pictures, which occur at the time of moving picture display, can be suppressed. COPYRIGHT: (C)2003,JPO
    • 8. 发明专利
    • HEAT SINK
    • JPH0222878A
    • 1990-01-25
    • JP17187288
    • 1988-07-12
    • MATSUSHITA ELECTRIC IND CO LTD
    • NEGISHI HIDEHIKOIMAMURA HIROKO
    • H01S5/00
    • PURPOSE:To obtain a heat sink which can efficiently couple a front beam from a semiconductor laser element with an optical system and a rear beam with a photodetector by a method wherein a protruding part used to fix the semiconductor laser element is formed and a metal layer is formed on the surface of the protruding part in order to fix the element stably. CONSTITUTION:A heat sink 11 is composed of silicon whose resistance is low and whose thermal conductivity is high; a protruding part 12 used to fix a semiconductor laser element is formed on its surface. This protruding part 12 is formed accurately and, with high accuracy by a photoetching operation. In addition, Ti and Ni are evaporated on the whole surface of the protruding part 12; after that, a solder is plated and a metal layer 13 is formed. A semiconductor laser element 14 is positioned and fixed to the protruding part 12 by using the solder-plated metal layer 13. In addition, a height of the protruding part 12 is decided by measuring a far field pattern of the semiconductor laser element 14; when the height is mum or higher by an experiment, good coupling between a front beam 18 and an optical lens 20 as well as between a rear beam 19 and a photodetector 22 can be obtained.