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1. 发明专利

JP2008169303A Composition for forming gas barrier material, gas barrier material, its manufacturing method and gas barrier packing material 有权
标题翻译：用于形成气体阻隔材料的组合物，气体阻隔材料及其制造方法和气体包装材料
公开(公告)号：JP2008169303A
公开(公告)日：2008-07-24
申请号：JP2007003725
申请日：2007-01-11
申请人： Kansai Paint Co Ltd , Toyo Seikan Kaisha Ltd , 東洋製罐株式会社 , 関西ペイント株式会社
发明人： OBU YUUSUKE , SASAKI HIROSHI , OGURA KASHIKO , MASUDA HIDEKI , MATSUDA HIDEKI , HORIIE NAOKI , HIDAKA TAKAHIRO , TAMURA KOICHI
IPC分类号： C08G59/42 , B32B27/30 , B65D65/40 , C08G59/24 , C08J3/24
摘要： PROBLEM TO BE SOLVED: To provide a composition for forming a gas barrier material capable of forming a gas barrier material having excellent gas barrier property, retort resistance, transparency and flexibility, enabling curing at a lower temperature in a short time and capable of enhancing productivity without affecting to a plastic base body. SOLUTION: The composition for forming the gas barrier material contains a polycarboxylic acid based polymer (A), and at least two-functional alicyclic epoxy compound (B). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成阻气性材料的组合物，其能够形成阻气性优异，耐蒸煮性，透明性和柔软性的阻气材料，能够在短时间内在较低温度下固化，并且能够提高生产率而不影响塑料基体。解决方案：用于形成阻气材料的组合物含有多元羧酸类聚合物（A）和至少两官能的脂环族环氧化合物（B）。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008038101A Water-based coating composition for can 有权
标题翻译：用于CAN的水基涂料组合物
公开(公告)号：JP2008038101A
公开(公告)日：2008-02-21
申请号：JP2006217606
申请日：2006-08-10
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： HIDAKA TAKAHIRO , YOKOI HIDEO , TAMURA KOICHI
IPC分类号： C09D157/10 , C09D5/02 , C09D7/12
摘要： PROBLEM TO BE SOLVED: To provide a water-based coating composition for a can, having excellent finishability because of good wettability on a wet ink, having water resistance resisting to retort treatment, being hardly scratched in a transportation process of the can because of a high-hardness coated film, and providing a coated film having excellent slipperiness at processing.
SOLUTION: The water-based coating composition for the can contains (A) a carboxy group-containing vinyl copolymer resin, (B) a crosslinking agent comprising at least one kind selected from a melamine resin and a benzoguanamine resin, and an oxazoline group-containing compound, (C) a silicone-based additive and (D) a wax, wherein the contents of the specific silicone-based additive (C) and the wax (D) are 0.1-10 pts.mass and 0.01-10 pts.mass respectively based on 100 pts.mass of the total of the solid components of the carboxy group-containing vinyl copolymer resin (A) and the crosslinking agent (B).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种罐用水性涂料组合物，由于在湿油墨上具有良好的润湿性，具有耐水蒸气处理的耐水性，在罐的运输过程中难以划伤，具有优异的整理性因为具有高硬度的涂膜，并且提供了在加工时具有优异的滑爽性的涂膜。解决方案：罐用水性涂料组合物含有（A）含羧基的乙烯基共聚物树脂，（B）包含选自三聚氰胺树脂和苯并胍胺树脂中的至少一种的交联剂，和含有恶唑啉基的化合物，（C）硅氧烷类添加剂和（D）蜡，其中特定的硅氧烷类添加剂（C）和蜡（D）的含量为0.1-10质量％基于含羧基的乙烯基共聚物树脂（A）和交联剂（B）的固体成分的总共100个聚碳酸酯，分别为10重量份。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007246603A Can coating composition 有权
标题翻译： CAN涂料组合物
公开(公告)号：JP2007246603A
公开(公告)日：2007-09-27
申请号：JP2006069082
申请日：2006-03-14
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： MASUDA HIDEKI , AMAGI SHINGO , SAKAMOTO AKIHISA , TAMURA KOICHI , YOSHIHARA HIDEKI
IPC分类号： C09D167/02 , B32B15/09 , B65D8/00 , C09D7/12 , C09D161/06 , C09D163/00
摘要： PROBLEM TO BE SOLVED: To provide a can coating composition suitable for a pre-coat process which exhibits excellent film characteristics such as coating film appearance, draw and ironing property, retorting resistance, flavor retention and hygiene. SOLUTION: The can coating composition contains (A) crystalline polyester resin fine particles mainly composed of an ethylene terephthalate unit, (B) crystalline polyester resin fine particles mainly composed of a butylene terephthalate unit and (C) an organic solvent. The solubility of the crystalline polyester resin fine particle (A) and the crystalline polyester resin fine particle (B) to the organic solvent (C) is each less than 5 mass% at 40°C or lower and 99 mass% or more at 180°C or higher. The ratios of the fine particle (A) and the fine particle (B) to the total of the fine particles (A) and (B) are 95-30 mass% and 5-70 mass% respectively. The content of the organic solvent (C) is 50-500 pts.mass to 100 pts.mass of the total of the fine particle (A) and the fine particle (B). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种适用于预涂工艺的罐涂料组合物，其表现出优异的膜特性，如涂膜外观，拉伸和熨烫性能，耐蒸煮性，香味保持性和卫生性。解决方案：罐涂料组合物含有（A）主要由对苯二甲酸乙二醇酯单元构成的结晶性聚酯树脂微粒，（B）主要由对苯二甲酸丁二醇酯单元构成的结晶性聚酯树脂微粒和（C）有机溶剂。结晶性聚酯树脂微粒（A）和结晶性聚酯树脂微粒（B）在有机溶剂（C）中的溶解度在40℃以下为小于5质量％，在180℃以下为99质量％以上 ℃以上。细颗粒（A）和细颗粒（B）与细颗粒（A）和（B）的总量的比率分别为95-30质量％和5-70质量％。有机溶剂（C）的含量为细颗粒（A）和细颗粒（B）的总计的50-500质量份至100质量ppm。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007161841A Coating for external surface of drawn can 有权
标题翻译：涂装外观表面可以
公开(公告)号：JP2007161841A
公开(公告)日：2007-06-28
申请号：JP2005358865
申请日：2005-12-13
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： KOISHIHARA TETSUYA , SHIODA ATSUSHI , TAMURA KOICHI
IPC分类号： C09D167/00 , B05D1/36 , B05D7/14 , B65D1/02 , B65D1/16 , B65D65/42 , C09D7/12 , C09D161/28
摘要： PROBLEM TO BE SOLVED: To provide a drawn can excellent in scratch after baking and workability of necking processed part and excellent in 'wet ink property' of provided strainless letters and figures of printed pattern even on the shoulder of a drawn can.
SOLUTION: The coating for an external surface of a drawn can comprises a polyester resin (A) obtained by reacting polyhydric alcohol (a1) containing 10-70 mol% 2-n-butyl-2-ethyl-1,3-propanediol based on the polyhydric alcohol component with a polybasic acid (a2) containing 60-99 mol% aromatic dicarboxylic acid based on the polybasic acid component, a crosslinking agent (B) containing a melamine resin (b1) of ≤2 average polymerization degree and a melamine resin (b2) of ≥2 average polymerization degree and a curing catalyst (C).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：待解决的问题：为了提供经烘烤后的划痕优良和颈缩加工部件的可加工性，并且即使在拉伸罐的肩部上，也提供了无菌字母和印刷图案的“湿墨水性”优异。解决方案：拉伸罐外表面的涂层包括通过使含有10-70mol％2-正丁基-2-乙基-1,3-丙二醇的多元醇（a1）反应获得的聚酯树脂（A）基于多元醇组分的丙二醇与基于多元酸组分的含有60-99mol％芳族二羧酸的多元酸（a2），含有≤2平均聚合度的三聚氰胺树脂（b1）的交联剂（B）和 ≥2平均聚合度的三聚氰胺树脂（b2）和固化催化剂（C）。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2005330372A Hydrous gel, method for producing the same, and microorganism carrier using the same 审中-公开
标题翻译：水凝胶，其制造方法和使用其的微生物载体
公开(公告)号：JP2005330372A
公开(公告)日：2005-12-02
申请号：JP2004149596
申请日：2004-05-19
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： HATTORI TADAMASA , KIN TSUBAME , IZUMIDA HITOSHI , TAMURA KOICHI
IPC分类号： C12N11/08 , C02F3/10 , C08K3/00 , C08L75/08
CPC分类号： Y02W10/15
摘要： PROBLEM TO BE SOLVED: To obtain a hydrous gel excellent in the ability to carry microorganisms. SOLUTION: The hydrous gel is obtained by compounding water in a mixture of a filler(D) and an isocyanate group-terminated polyurethane resin(C) as the reaction product of (A) a liquid polyol containing ≥70 wt.% of a copolymer obtained by copolymerization between ethylene oxide(a) and propylene oxide(b) in the weight ratio (a)/(b) of (50:50) to (90:10) and (B) a polyisocyanate followed by gelatinization. This hydrous gel has a volume expansion ratio to the resin(C) prior to gelatinization of 4-20. In this hydrous gel, the filler(D) has an average particle size of 0.1-150μm. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：获得携带微生物能力优异的含水凝胶。解决方案：通过将填料（D）和异氰酸酯基封端的聚氨酯树脂（C）的混合物中的水复合作为（A）含有≥70重量％的液体多元醇的反应产物，（50:50）〜（90:10）的重量比（a）/（b）〜（90:10）和（B）多异氰酸酯之间进行糊化后，通过环氧乙烷（a）与环氧丙烷（b）。该含水凝胶在4-20糊化前具有与树脂（C）的体积膨胀比。在该含水凝胶中，填料（D）的平均粒径为0.1〜150μm。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004354475A Stripping liquid for resist coating, method for etching aluminum plate, and aluminum etched plate 审中-公开
标题翻译：用于耐蚀涂层的剥离液，蚀刻铝板的方法和铝蚀刻板
公开(公告)号：JP2004354475A
公开(公告)日：2004-12-16
申请号：JP2003149237
申请日：2003-05-27
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： BANDO RYOTA , ONISHI SHINSUKE , TAMURA KOICHI
IPC分类号： G03F7/42 , C23F1/00 , C23F1/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a stripping liquid for a resist coating to form a fine image, to provide a method for etching an aluminum plate and to provide an aluminum etched plate.
SOLUTION: After an alkali-soluble energy ray-sensitive resist coating is formed on an aluminum plate, the resist is exposed to light to form an image and developed with a weak alkaline solution to form the image. Then the exposed aluminum plate is removed by etching with an etching liquid. The stripping liquid is used to further strip the residual resist coating. The stripping liquid for the resist coating comprises at least one kind of alkaline aqueous solution selected from mixture aqueous solutions of alkali metal compounds and sodium hydrogen carbonate.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供用于抗蚀剂涂层的剥离液以形成精细图像，以提供蚀刻铝板并提供铝蚀刻板的方法。解决方案：在铝板上形成碱溶性能量射线敏感抗蚀剂涂层后，将抗蚀剂曝光以形成图像，并用弱碱性溶液显影以形成图像。然后通过用蚀刻液蚀刻去除暴露的铝板。剥离液用于进一步剥离残留的抗蚀涂层。用于抗蚀剂涂层的剥离液包含选自碱金属化合物和碳酸氢钠的混合物水溶液中的至少一种碱性水溶液。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2008280452A Composition for forming gas barrier material, gas barrier material and method for producing the same, and gas barrier packaging material 有权
标题翻译：用于形成气体阻挡材料的组合物，气体阻挡材料及其制造方法，以及气体包装材料
公开(公告)号：JP2008280452A
公开(公告)日：2008-11-20
申请号：JP2007126899
申请日：2007-05-11
申请人： Kansai Paint Co Ltd , Toyo Seikan Kaisha Ltd , 東洋製罐株式会社 , 関西ペイント株式会社
发明人： OBU YUUSUKE , SASAKI HIROSHI , OGURA KASHIKO , MASUDA HIDEKI , MATSUDA HIDEKI , HORIIE NAOKI , HIDAKA TAKAHIRO , TAMURA KOICHI
IPC分类号： C08G59/58 , B65D65/40 , C08G59/24 , C08J7/04
摘要： PROBLEM TO BE SOLVED: To provide a gas barrier material-forming composition which enables to form a gas barrier material which is excellent in gas barrier properties, retort resistance and flexibility and can be cured at a lower temperature in a shorter time without affecting a plastic base, and thus enables to improve the productivity. SOLUTION: The composition for forming a gas barrier material is characterized by containing (A) a polycarboxylic acid polymer, (B) a compound containing two ring structures (b) containing oxygen in the ether bonds formed at carbons forming double bonds with nitrogen, and (C) a compound having at least two epoxy groups. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种阻气材料形成组合物，其能够形成阻气性优异，耐蒸煮性和柔软性的阻气材料，并且可以在更短的时间内在较低温度下固化而没有影响塑料基材，从而能够提高生产率。解决方案：用于形成阻气材料的组合物的特征在于含有（A）多元羧酸聚合物，（B）包含在与形成双键的碳上形成的醚键中含有氧的两个环结构（b）的化合物，氮和（C）具有至少两个环氧基的化合物。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2004296839A Method for manufacturing semiconductor chip 审中-公开
标题翻译：制造半导体芯片的方法
公开(公告)号：JP2004296839A
公开(公告)日：2004-10-21
申请号：JP2003088036
申请日：2003-03-27
申请人： Disco Abrasive Syst Ltd , Kansai Paint Co Ltd , 株式会社ディスコ , 関西ペイント株式会社
发明人： TAKEZOE KOJI , ICHIKAWA AKITO , TAMURA KOICHI , KITAMURA MASAHIKO , YAJIMA KOICHI , NANJO MASATOSHI , NAMIOKA SHINICHI
IPC分类号： H01L21/304 , H01L21/30 , H01L21/301 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/6834
摘要： PROBLEM TO BE SOLVED: To enable the damage-free removal of a semiconductor wafer or a semiconductor chip from the supporting substrate in the process of manufacturing a thin semiconductor chip by grinding a semiconductor wafer or a semiconductor chip supported on a rigid supporting substrate. SOLUTION: The surface of a semiconductor wafer W1 is bonded to a light-permeable supporting substrate 11 with an adhesive layer 10 in between them, with the adhesive strength of the adhesive layer 10 to weaken upon exposure to light. The rear surface of the semiconductor wafer W1 integrated with the supporting substrate 11 is exposed and ground, a tape 40 is bonded to the rear surface, and the periphery of the tape 40 is supported on a frame. Before or after the bonding of the tape 40, the adhesive layer 10 is irradiated with a light from the side of the supporting substrate 11, and this weakens the adhesive strength of the adhesive layer 10. The supporting substrate 11 and the adhesive layer 10 are then removed from the surface of the semiconductor wafer W1, and the wafer W1 is now supported on the tape 40 and on the frame. The semiconductor W1 as supported on the tape 40 and on the frame is cut along the streets for segmentation into individual semiconductor chips. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过研磨半导体晶片或支撑在刚性支撑件上的半导体芯片，在制造薄半导体芯片的过程中，能够从支撑基板上无损地去除半导体晶片或半导体芯片基质。解决方案：半导体晶片W1的表面在透光性支撑基板11之间粘合有粘合剂层10，粘合剂层10的粘合强度在曝光时变弱。与支撑基板11一体化的半导体晶片W1的背面露出并研磨，将带40粘合到后表面，并且将带40的周边支撑在框架上。在粘合带40之前或之后，用支撑基板11侧的光照射粘合剂层10，这就削弱了粘合剂层10的粘合强度。支撑基材11和粘合剂层10是然后从半导体晶片W1的表面去除，并且晶片W1现在被支撑在带40上和框架上。沿着街道切割支撑在带40上和框架上的半导体W1，以便分割成单独的半导体芯片。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004107650A Releasable adhesive composition 审中-公开
标题翻译：可释放胶粘组合物
公开(公告)号：JP2004107650A
公开(公告)日：2004-04-08
申请号：JP2003294530
申请日：2003-08-18
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： TAKEZOE KOJI , ICHIKAWA AKITO , TAMURA KOICHI
IPC分类号： C09J201/00 , C09J5/00 , C09J11/06 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having both excellent adhesion and releasability.
SOLUTION: This releasable adhesive composition contains a resin which has tackiness and a compound which generates gas by irradiation of active energy rays. The compound which generates the gas by the irradiation of the active energy rays preferably comprises a quinonediazidosulfonic acid ester in the releasable adhesive composition. The resin which has the tackiness and the compound which generates the gas by the irradiation of the active energy rays are contained in the releasable adhesive composition in such a ratio that about 1 to about 100 pts.wt. of the compound is contained based on 100 pts.wt. of the resin.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有优异的粘合性和脱模性的粘合剂组合物。解决方案：该可释放的粘合剂组合物含有具有粘性的树脂和通过照射活性能量射线产生气体的化合物。通过照射活性能量射线产生气体的化合物优选在可释放粘合剂组合物中包含醌二叠氮磺酸酯。具有粘性的树脂和通过照射活性能量射线产生气体的化合物以约1至约100重量份的比例包含在可释放粘合剂组合物中。该化合物的含量为100重量份的树脂。版权所有（C）2004，JPO

10. 发明专利

JP2004045596A Curing resin composition for semiconductor laser and resist pattern forming method using the composition 有权
公开(公告)号：JP2004045596A
公开(公告)日：2004-02-12
申请号：JP2002201024
申请日：2002-07-10
申请人： Kansai Paint Co Ltd , 関西ペイント株式会社
发明人： TAKEZOE KOJI , TAMURA KOICHI , HASEGAWA TAKEYA
IPC分类号： G03F7/029 , C08F2/50 , G03F7/004 , G03F7/028
摘要： PROBLEM TO BE SOLVED: To provide a curing resin composition for semiconductor laser. SOLUTION: A resist pattern forming method comprises a step (1) for forming a photosensitive coating film by applying the curing resin composition for the semiconductor laser on a base material, a step (2) for irradiating and curing the surface of the photosensitive coating film formed on the base material directly with a laser beam or with a light beam through a negative mask so that a desired resist coating film (an image) can be obtained thereon and a step (3) for forming the resist pattern on the base material by subjecting the resist coating film formed in the step (2) to development treatment. The curing resin composition for the semiconductor laser is characterized by containing a bisacylphosphine oxide as a photopolymerization initiator and also it is characterized in that visible light beams from which light beams having ≤440 nm wavelength in the emission spectrum of a light source are removed is used as safety light beams in at least one step of the steps from the step (1) to the step (3). COPYRIGHT: (C)2004,JPO

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