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1. 发明专利

JP2006002729A Steam turbine plant and moisture separation heater 审中-公开
标题翻译：蒸汽涡轮机和湿度分离加热器
公开(公告)号：JP2006002729A
公开(公告)日：2006-01-05
申请号：JP2004182578
申请日：2004-06-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAGASAWA MASAYUKI , HAMAURA KIICHI
IPC分类号： F01K7/22
摘要： PROBLEM TO BE SOLVED: To provide a steam turbine plant provided with a means increasing energy efficiency of the plant by efficiently collecting energy which moisture separation heater vent steam has and a moisture separation heater for that.
SOLUTION: This steam turbine plant includes a steam generating source 1, a high pressure steam turbine 3, and a low pressure steam turbine 7 driven by exhaust steam from the high pressure steam turbine 3. The plant is provided with the moisture separation heater 4 installed between the high pressure steam turbine 3 and the low pressure steam turbine 7, separating and removing moisture of exhaust steam from the high pressure steam turbine 3, and having heaters 5, 6 heating high pressure steam turbine exhaust steam from which moisture is separated and removed by part of main steam and high pressure turbine bleed steam built therein. Each heater vent pipe 19, 20 of the moisture separation heater 4 is connected to the high pressure steam turbine 3 respectively to increase efficiency of the high pressure turbine 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种蒸汽轮机设备，其具有通过有效地收集湿气分离加热器排放蒸汽的能量和用于其的湿气分离加热器来提高设备的能量效率的装置。解决方案：该蒸汽轮机设备包括蒸汽发生源1，高压蒸汽轮机3和由来自高压汽轮机3的排气蒸汽驱动的低压汽轮机7.该设备设有水分分离加热器4安装在高压蒸汽轮机3和低压蒸汽轮机7之间，从高压蒸气轮机3分离和除去废气蒸汽的水分，并具有加热器5,6加热高压汽轮机废气蒸汽，通过部分主蒸汽和内置高压汽轮机排放蒸汽分离和除去。湿度分离加热器4的每个加热器排气管19,20分别连接到高压汽轮机3，以提高高压汽轮机3的效率。（C）2006，JPO＆NCIPI

2. 发明专利

JP2005201696A Nuclear power plant and its operation method 有权
标题翻译：核电厂及其运行方法
公开(公告)号：JP2005201696A
公开(公告)日：2005-07-28
申请号：JP2004006198
申请日：2004-01-14
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KITO KAZUAKI , CHAGI MASAO , SHIINA KOJI , AOYAMA TADAO , OTSUKA MASAYA , NAGASAWA MASAYUKI , OKURA MINORU
IPC分类号： G21D3/00 , G21D5/06 , G21D5/12
CPC分类号： Y02E30/40
摘要： PROBLEM TO BE SOLVED: To suppress the generation of steam and reduction of design margine of main steam system and increase electric power when increasing the reactor thermal power of a nulcear power plant.
SOLUTION: In a nuclear power system, heating rate of supply water heated by extracted main steam is reduced, the enthalpy (temperature) of the supply water is lowered, steam generation rate in the reactor core is reduced and the increase of main steam flow rate is suppressed. Simultaneously, steam rate going into a low-pressure turbine is increased so that the energy recovery rate (power generation rate) in the low-pressure turbine is increased and the electric power of the reactor is increased.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了抑制蒸汽的产生，降低主蒸汽系统的设计裕度，并且在增加电力设备的反应堆热功率时增加电力。解决方案：在核电系统中，提取的主蒸汽加热的供水的加热速率降低，供水的焓（温度）降低，反应堆堆芯的蒸汽发生率降低，主堆的增加蒸汽流量被抑制。同时，进入低压涡轮机的蒸汽速率增加，使得低压涡轮机中的能量回收率（发电率）增加并且反应器的功率增加。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2012163279A Device for controlling flow rate of feed-water, and power plant using the same 审中-公开
标题翻译：用于控制供水流量的装置，以及使用该装置的发电厂
公开(公告)号：JP2012163279A
公开(公告)日：2012-08-30
申请号：JP2011025009
申请日：2011-02-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SOGA KOHEI , NAGASAWA MASAYUKI
IPC分类号： F22D5/32
摘要： PROBLEM TO BE SOLVED: To provide a device for controlling a flow rate of feed water that prevents a decrease in the flow rate of feed water when a trip is caused in one of pumps of a feed-water supply system to mitigate the draw-down of a nuclear reactor or the like when using a variable speed motor driven feed-water pump, and to provide a power plant using the same.SOLUTION: The device for controlling a flow rate of feed water includes: a vessel such as a nuclear reactor or a steam generator with a function of controlling a water level in a power plant; a multi-unit pump set including reserve machines in which a plurality of kinds of pumps are coupled with one another in a direction of a flow from the upstream side to the downstream side to increase the pressure of condensate step by step so as to feed the condensate from a condenser to the vessel; and a feed-water flow rate control means for controlling the flow rate of the feed water of a pump coupled in the most downstream position in the multi-unit pump set. The feed-water flow rate control means includes a predicted flow rate increasing circuit that, when detecting a trip caused in at least one driven pump, rapidly increases a flow rate of the other pump which is continued in operation to a preset flow rate immediately after the detection of the trip.
摘要翻译：要解决的问题：提供一种用于控制供水流量的装置，其防止在供水系统的泵中的一个中产生跳闸以减少供水的流量的减少的装置在使用变速电动机驱动的给水泵时，使用核反应堆等进行抽取，并提供使用其的动力装置。解决方案：用于控制给水流量的装置包括：具有控制发电厂水位功能的诸如核反应堆或蒸汽发生器的容器; 一种多单元泵组，包括备用机器，其中多个泵在从上游侧到下游侧的流动方向上彼此联接，以逐步增加冷凝水的压力，以便进料从冷凝器到容器的冷凝物; 以及供水流量控制装置，用于控制耦合在多单元泵组中最下游位置的泵的给水流量。给水流量控制装置包括预测流量增加电路，当检测到在至少一个从动泵中产生的跳闸时，将在运行中继续运行的另一个泵的流量迅速增加到紧随其后的预设流量检测行程。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2006064210A Feed water control system for steam generator in power generation plant 有权
标题翻译：发电厂蒸汽发生器进水控制系统
公开(公告)号：JP2006064210A
公开(公告)日：2006-03-09
申请号：JP2004244556
申请日：2004-08-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KOTANI KAZUMASA , NAGASAWA MASAYUKI
IPC分类号： F22D5/00
CPC分类号： F01K13/02 , F01K7/165 , F01K11/02 , F22D5/00
摘要： PROBLEM TO BE SOLVED: To provide stability of a water level of a steam generator, and stability of a flow rate balance between a steam flow rate and a feed water flow rate of each turbine plant in feed water control for the steam generator in a power generation plant composed by combining the steam generator and a plurality of turbine plants.
SOLUTION: In the power generation plant composed by combining the steam generator 1 and the plurality of turbine plants 100 and 200, control in a feed water controller 5 of the first turbine plant (the main turbine plant) 100 is carried out by normal control, namely, control of a feed water flow regulating valve 6 by using detection signals of a steam generator water level detector 7, a main steam flow rate detector 8, and a feed water flow rate detector 9 of the first turbine plant 100, and control in a feed water controller 15 of the second turbine plant (the sub turbine plant) is carried out by control of a feed water flow regulating valve 16 by using a detection signal of a condenser water level detector 10 of the first turbine plant.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供蒸汽发生器的水位的稳定性，以及蒸汽发生器的给水控制中每个涡轮机厂的蒸汽流量与给水流量之间的流量平衡的稳定性在通过组合蒸汽发生器和多个涡轮机组合而构成的发电厂中。解决方案：在通过组合蒸汽发生器1和多个涡轮机设备100和200组成的发电设备中，第一涡轮机设备（主涡轮机设备）100的给水控制器5中的控制由通过使用第一涡轮机100的蒸汽发生器水位检测器7，主蒸汽流量检测器8和给水流量检测器9的检测信号来控制给水流量调节阀6，并且通过使用第一涡轮机厂的冷凝器水位检测器10的检测信号，通过进给给水流量调节阀16的控制来进行第二涡轮机厂（副涡轮发电厂）的给水控制器15的控制。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2002184733A TREATMENT METHOD, MEASUREMENT METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002184733A
公开(公告)日：2002-06-28
申请号：JP2000383194
申请日：2000-12-18
申请人： HITACHI LTD
发明人： KAWAMURA YOSHIO , KATAGIRI SOUICHI , YASUI KAN , NAGASAWA MASAYUKI , YAMAGUCHI TAKATADA
IPC分类号： H01L21/00 , H01L21/02 , H01L21/302 , H01L21/304 , H01L21/306 , H01L21/3065 , H01L21/3205 , H01L21/66 , H01L21/8242 , H01L27/10 , H01L27/108
摘要： PROBLEM TO BE SOLVED: To provide a treatment method for improving productivity by presenting treatment conditions accurately. SOLUTION: The treatment method comprises a process for performing first treatment to a first substrate and a process for performing second treatment to the first substrate, or the second treatment to a second substrate, obtains a correlation function to each position in a surface as difference data of a plurality of treatment processes to each position in the surface, calculates the distribution characteristics in the surface of the substrate under desired treatment conditions from the correlation function, and treats the substrate, based on the distribution characteristics in the surface.

6. 发明专利

JPH0658104A MULTISHAFT COMBINED CYCLE POWER PLANT 失效
公开(公告)号：JPH0658104A
公开(公告)日：1994-03-01
申请号：JP21145992
申请日：1992-08-07
申请人： HITACHI LTD
发明人： AKIYAMA KOSEI , KANAMARU TAKESHI , NAGASAWA MASAYUKI
IPC分类号： F01D13/02 , F01K23/10 , F02C6/18
摘要： PURPOSE:To easily start and stop a multishaft combined cycle, change the number of operative ones of them, and deal with abnormality or accident by providing CV valves on pipes on the upstream side of common headers, and also providing a control means for controlling the opening and closing amount of the CV valves. CONSTITUTION:Valves 69 to 71 are respectively provided on pipes on the upstream side of common headers 51 to 53 so as to be controlled by steam generated on respective shafts individually. For example, even if failures or accidents are generated on A shaft, the other B and C shafts are so arranged as not to be affected by the failure or accident by shutting off the valve 69 of this shaft. A control means for controlling the shutoff of steam to be flow into steam turbines 7 to 9 of this shaft is provided in the parts for constituting steam shut-off valves. Pressure control from the time when the CV valves are full opened to the time when they are full closed can be performed by the control means. Thereby, pressure on the upstream side of the CV valves can be prevented from drastically varying from the set value. Therefore, starting, stopping, change the number of operative one of the cycles, and dealing with, abnormality and accident of a multishaft combined cycle can be easily performed.

7. 发明专利

JP2001338901A PROCESS METHOD AND EQUIPMENT FOR PLANARIZATION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001338901A
公开(公告)日：2001-12-07
申请号：JP2000161125
申请日：2000-05-26
申请人： HITACHI LTD
发明人： KATAGIRI SOUICHI , KAWAMURA YOSHIO , YASUI KAN , NAGASAWA MASAYUKI , YAMAGUCHI TAKATADA
IPC分类号： B24B7/22 , B24D3/00 , B24D7/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and processing equipment including a wafer holder, which can constantly process more than 10,000 pieces of the wafers with high planarizing performance, scratch free, narrow edge exclusion, and high uniformity. SOLUTION: The equipment can attain the wafer process performance by way of keeping a non-contact gap between a retainer and a grindstone, with a means to control the gap within the limited range, and by specifying the retainer compression at 3000 kg/cm2 or higher.

8. 发明专利

JPH0982667A ABRASIVE AND POLISHING AND FLATTENING 失效
公开(公告)号：JPH0982667A
公开(公告)日：1997-03-28
申请号：JP24129995
申请日：1995-09-20
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： FURUSAWA KENJI , KUSUKAWA KIKUO , HONMA YOSHIO , NAGASAWA MASAYUKI , MORIYAMA SHIGEO , GOSHIMA HIDEKAZU
IPC分类号： B24B37/00 , B82Y10/00 , B82Y99/00 , C09K3/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To make the surface of a stepped substrate flatten without increasing cost by a method wherein an abrasive obtainable by mixing a plurality of kinds of abrasives is used as the abrasive for materials to be polished, which contain silicon and have polishing rates different from each other. SOLUTION: A low-cost organic coat glass film (an organic SOG film) 4 is formed on an insulating film 2 to keep thickened the film thickness of the film 2 prior to a polishing. A plurality of abrasives having different abrasion characteristics are mixed and a laminated film consisting of the films 2 and 4 is polished and flattened using the abrasive adjusted so that the polishing rates of the films 2 and 4 become the same degree. The polishing rate of the film 4 at a region of pH >3 is high in a cerium oxide abrasive having small crystallites (30nm or smaller) and in contact with this, the polishing rate is low in a cerium oxide abrasive having large crystallites (60nm or larger). Accordingly, by mixing these abrasives, the polishing rate of the film 4 can be adjusted.

9. 发明专利

JPH07122557A FABRICATION OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH07122557A
公开(公告)日：1995-05-12
申请号：JP26858693
申请日：1993-10-27
申请人： HITACHI LTD
发明人： KUSUKAWA KIKUO , HONMA YOSHIO , MORIYAMA SHIGEO , NAGASAWA MASAYUKI
IPC分类号： H01L21/3205 , H01L21/304 , H01L21/316
摘要： PURPOSE:To prevent short circuit or open circuit of wiring by covering the wiring layer on a substrate with an insulation film thicker than the wiring layer, mirror polishing the rear of the substrate and polishing the surface of the insulation film. CONSTITUTION:An Al film is vacuum deposited by about 800nm, as a first wiring layer 3, on the surface of a substrate. Subsequently, a wiring pattern is formed and a photoresist pattern is removed by conventional photoresist pattern forming step and dry etching step. Furthermore, a plasma oxide 4 is deposited by about 1mum on the Al film. The plasma oxide has surface level difference of about 600nm. Finally, the single crystal silicon substrate 1 is polished on the rear side thereof.

10. 发明专利

JPH0740232A POLISHING DEVICE AND POLISHING METHOD 失效
公开(公告)号：JPH0740232A
公开(公告)日：1995-02-10
申请号：JP19445893
申请日：1993-08-05
申请人： HITACHI LTD
发明人： MORIYAMA SHIGEO , HONMA YOSHIO , KUSUKAWA KIKUO , FURUSAWA KENJI , NAGASAWA MASAYUKI
IPC分类号： B24B37/00 , B24B37/20 , B24B37/24
摘要： PURPOSE:To improve the productivity and reduce the running cost. CONSTITUTION:A polishing pad 17 with water permeability with a large number of cavity parts formed inside is adhered on a rotary surface plate 10 manufactured of porous ceramics, a polishing liquid supply passage 11 is provided inside of the rotary surface plate 10, the polishing liquid supply passage 11 is connected to a polishing liquid supply source (not graphically displayed), and the rotary surface plate 10 is installed on an axis of rotation.

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