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1. 发明专利

JP2014117732A Tip chip of solder handling device 有权
标题翻译：烙铁处理设备提示
公开(公告)号：JP2014117732A
公开(公告)日：2014-06-30
申请号：JP2012275323
申请日：2012-12-18
申请人： Hakko Kk , 白光株式会社
发明人： KAMIYA KOJI
IPC分类号： B23K3/02 , B23K101/42 , C22C26/00 , C22C33/02 , C22C38/00 , C22C38/10 , C22C47/00
摘要： PROBLEM TO BE SOLVED: To provide a tip chip of a solder handling device with higher practicability, for lead-free solder.SOLUTION: A tip chip 30 includes a tip work portion (tip of a chip cap 302) that is iron-cobalt alloy containing 0.5-5 wt.% of cobalt with the balance being iron, or iron-carbon-cobalt alloy containing both iron and carbon.
摘要翻译：要解决的问题：为无铅焊料提供具有较高实用性的焊料处理装置的尖端芯片。解决方案：尖端芯片30包括作为铁钴合金的尖端工作部分（芯片盖302的尖端）含有0.5-5重量％的钴，余量为铁，或含有铁和碳的铁 - 碳 - 钴合金。

2. 发明专利

JP2004337961A Iron bit for solder treatment and its manufacturing method and manufacturing apparatus, electric soldering iron and electric solder sucking iron using the iron bit 审中-公开
公开(公告)号：JP2004337961A
公开(公告)日：2004-12-02
申请号：JP2003140859
申请日：2003-05-19
申请人： Hakko Kk , 白光株式会社
发明人： NUNOGAKI MASANOBU , NAGASE TAKASHI , KAMIYA KOJI
IPC分类号： B23K3/02 , C23C14/16
摘要： PROBLEM TO BE SOLVED: To provide an iron bit for solder treatment which can prevent erosion by solder on the iron bit for solder treatment and enhance solderability or removability of solder when a lead-free solder is used, and also whose material quality in the tip of the bit can be properly suited to the type and usage of the solder.
SOLUTION: In the iron bit 2 for solder treatment used for the iron bit of the electric soldering iron or the electric solder sucking iron, a coating film 20 formed by ion-plating is provided on the surface including at least the tip portion of the iron bit core material 10 made of any one of copper, copper alloy, silver, or silver alloy. Iron, nickel, cobalt, copper, silver, tin and so on are used for a component material for the coating film 20.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2004154801A Nozzle of solder sucking device 审中-公开
公开(公告)号：JP2004154801A
公开(公告)日：2004-06-03
申请号：JP2002321445
申请日：2002-11-05
申请人： Hakko Kk , 白光株式会社
发明人： YAMAZAKI MORIO , KAMIYA KOJI
IPC分类号： B23K1/018
摘要： PROBLEM TO BE SOLVED: To provide a nozzle for a solder sucking device which can prevent corrosion of a solder sucking path and solve solder clogging and has excellent heat conductivity.
SOLUTION: The nozzle of the solder sucking device has the solder sucking path 71 at a leading end and is heated to melt the solder and further to suck the molten solder through the solder sucking path. An inner surface of the solder sucking path is formed of a material 32 which is not wet with the solder but an outer surface of the leading end is formed with a material 33 which is wet with the solder. One of Al, Al alloy, stainless steel, Ti, and carbon fiber is adopted as a raw material 32 which is not wet with the solder, and one of Fe plating, Ni plating, and Fe-Ni alloy plating is adopted as a raw material 33 which is wet with the solder.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2003062688A Solder for soldering iron 有权
标题翻译：焊锡炉
公开(公告)号：JP2003062688A
公开(公告)日：2003-03-05
申请号：JP2001256167
申请日：2001-08-27
申请人： Hakko Kk , 白光株式会社
发明人： TAKEMOTO TADASHI , NAGASE TAKASHI , KAMIYA KOJI , YAMAZAKI MORIO
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a solder suitable for a resin flux cored filament solder and capable of inhibiting the corrosion of iron plated layer on the tip of solder iron.
SOLUTION: This solder contains flux component therein and is formed in filament shape. The solder has a composition of 0.2-5 wt.% Ag, 0.01-0.2 wt.% Fe, optionally prescribed amount of Cu, Bi, Pb, Ni, and Co, and the balance being Sn and inevitable impurities, except the flux component.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供适合于树脂药芯焊丝的焊料，并且能够抑制焊铁末端的镀铁层的腐蚀。解决方案：该焊料在其中含有助熔剂成分并形成为长丝形状。焊料的组成为0.2-5重量％的Ag，0.01-0.2重量％的Fe，任选规定量的Cu，Bi，Pb，Ni和Co，余量为Sn和不可避免的杂质，除了助熔剂组分。

5. 发明专利

JP2006198637A Iron tip cleaner for soldering iron 审中-公开
标题翻译：钢铁清洁器
公开(公告)号：JP2006198637A
公开(公告)日：2006-08-03
申请号：JP2005010882
申请日：2005-01-18
申请人： Hakko Kk , 白光株式会社
发明人： KAMIYA KOJI
IPC分类号： B23K3/02 , B22F1/00 , B23K35/22 , B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an iron tip cleaner for a soldering iron capable of effectively performing the cleaning of an iron tip without deteriorating the earth environment even under manual soldering in lead-free solder.
SOLUTION: Metal grains which comprise Sn as the main component and do not comprise Pb excepting as impurities, and an activator comprising an organic acid or an organic amine halogenated hydroacid salt are kneaded with a solvent, so as to be a pasty iron tip cleaner 10. More suitably, the metal grains are made into flake powder of 50 to 150 μm, and further, the solvent desirably includes a noncrystalline solid hydrocarbon or paraffin hydrocarbons.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在无铅焊料中手动焊接的情况下，也可以提供一种能够有效地进行铁尖的清洁而不会使地球环境恶化的烙铁头清洁剂。＆lt; P＆gt;解决方案：以Sn为主要成分并且不含作为杂质的Pb的金属颗粒和包含有机酸或有机胺卤化氢酸盐的活化剂与溶剂混合，以便成为糊状铁尖端清洁器10.更合适地，金属颗粒被制成50至150μm的片状粉末，此外，溶剂理想地包括非结晶固体烃或链烷烃。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005153007A Lead-free solder for manual soldering or flow soldering, and electronic component using the same 有权
标题翻译：用于手动焊接或流动焊接的无铅焊接机和使用其的电子部件
公开(公告)号：JP2005153007A
公开(公告)日：2005-06-16
申请号：JP2004012905
申请日：2004-01-21
申请人： Hakko Kk , Tadashi Takemoto , 白光株式会社 , 正竹本
发明人： TAKEMOTO TADASHI , NAGASE TAKASHI , KAMIYA KOJI , YAMAZAKI MORIO
IPC分类号： B23K35/26 , B23K35/14 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a lead-free solder which can prolong life by effectively restraining the tip of a soldering iron, a dip soldering pan and so on from being eroded, and an electronic component using the lead-free solder which can reduce its cost while preventing the global environment from being worsened.
SOLUTION: The invention relates to the lead-free solder for manual soldering or flow soldering which controls the erosion of stainless steel, iron and iron-alloy and which contains Sn as a principal constituent and at least Co out of 0.01-1 mass% of Fe, 0.01-1 mass% of Ni and 0.01-0.6 mass% of Co while the total of Fe, Ni and Co is 1 mass% or less. The invention also relates to the electronic component in which an electronic member is bonded to a printed board with the lead-free solder.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种无铅焊料，其可以通过有效地抑制烙铁的尖端，浸渍焊盘等被腐蚀而延长使用寿命，以及使用无铅焊料的电子部件这可以降低成本，同时防止全球环境恶化。解决方案：本发明涉及用于手动焊接或流焊的无铅焊料，其控制不锈钢，铁和铁合金的侵蚀，其含有Sn作为主要成分，并且至少为0.01-1的Co Fe的质量％，Ni的0.01〜1质量％和Co的0.01-0.6质量％，Fe，Ni和Co的合计为1质量％以下。本发明还涉及电子部件，其中电子部件与无铅焊料结合到印刷电路板上。版权所有（C）2005，JPO＆NCIPI

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