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    • 2. 发明专利
    • LAYER BUILDING DEVICE OF MULTILAYER PRINTED CIRCUIT BOARD
    • JPS62104740A
    • 1987-05-15
    • JP24403085
    • 1985-11-01
    • HITACHI LTDSHIN MEIWA IND CO LTD
    • KOIDE TOSHIOKIMURA SHIGETOHIROTA MASAMIYASUO TAKESHIYOSHIHARA TAKESHIFUJITA KEIJI
    • B29C70/06B29L9/00B32B37/00H05K3/46
    • PURPOSE:To automatically perform the layer building operation of a multilayer printed circuit board by a method wherein a printed circuit board is roughly positioned on a conveyer and, after that, transferred from the conveyer, undergoing the precise positioning and insertion to a guide pin by means of a horizontal multijoint robot. CONSTITUTION:First, when the sensor of a stopper 13 detects the tip of a printed circuit board, a conveyer 12 is stopped and, after the board is corrected its position and put aside widthwise, the guide pin of a positioning table is inserted in then reference hole of the printed circuit board. Secondly, when the rough positioning of the printed circuit board is completed, a horizontal multijoint robot 8 is brought into actuation so as to fix the printed circuit board onto a suction pad 9 by suction so as to transfer for the printed circuit board, from the underside of which dusts are removed by a dusting brush 19 during the transferring, in order to be piled up on a laminating bonding jig plate, which is precisely positioned. Thirdly, a pick-and-place 10 shifts a prepreg from a prepreg positioning table 24 to be lamination bonding jig plate by fixing the prepreg onto a suction pad 11 by suction and lowering the prepreg onto the jig plate. The sequential piling of printed circuit boards and prepregs onto the lamination bonding jig plate is performed as described above so that the layer building is completed.