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    • 5. 发明专利
    • Package method for diode matrix
    • 二极体矩阵的包装方法
    • JPS54148470A
    • 1979-11-20
    • JP5669678
    • 1978-05-15
    • Hitachi Ltd
    • IKEDA TAKAHISAHARA HIDEKAZUMATSUMOTO HISASHIISHI ICHIROU
    • H05K1/14H01L25/07H03K17/76H05K1/00H05K1/18
    • H03K17/76H05K1/0393H05K1/182
    • PURPOSE:To secure an easy packaging of the diode through the automatic inserter and the automatic soldering device by providing both the load side land and the power source side land for the diode and then inserting the diode. CONSTITUTION:Conductor strip 32 is formed on flexible substrate 3 with its one end connected to the electrode of the heat-sensitive head, and load side land 323 of diode 5 is provided at the other end of strip 32. And power source side land 324 of diode 5 is provided in parallel to land 323 as if diode 5 covered over strip 32 which is formed into blocks with every fixed number. At the same time, the lead wire of diode 5 is inserted through the pierced hole formed on diode substrate 2 to be bent on land 323 and 324 of substrate 3. Thus, the lead wire of the diode is inserted from one direction to ensure use of the automatic inserter. Furthermore, all soldering work can be carried out through the automatic soldering device.
    • 目的:通过为二极管提供负载侧焊盘和电源侧焊盘,然后插入二极管,确保二极管通过自动插入器和自动焊接装置的简单封装。 构成:导体条32形成在柔性基板3上,其一端连接到热敏头的电极,二极管5的负载侧焊盘323设置在带32的另一端。电源侧焊盘324 二极管5与平台323平行地设置,好像二极管5覆盖在条32上,每个固定数量形成块。 同时,二极管5的引线通过形成在二极管基板2上的穿孔插入,以在基板3的焊盘323和324上弯曲。因此,二极管的引线从一个方向插入以确保使用 的自动插入器。 此外,所有焊接工作都可以通过自动焊接装置进行。