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1. 发明专利

JPH09160070A LIQUID CRYSTAL DISPLAY DEVICE AND ITS PRODUCTION 失效
公开(公告)号：JPH09160070A
公开(公告)日：1997-06-20
申请号：JP31989895
申请日：1995-12-08
申请人： HITACHI LTD
发明人： ABU KOICHI , SATO TSUTOMU , TANAKA TAKESHI , NAKAHARA YOSHIHIKO , SUZUKI MASAHIKO , HIDA HIROYUKI , NAKATANI MITSUO
IPC分类号： G02F1/1343 , G02F1/1333 , G02F1/136 , G02F1/1368 , H01L21/336 , H01L29/786
摘要： PROBLEM TO BE SOLVED: To make it possible to obtain good image quality at a low cost. SOLUTION: This device is composed of plural scanning electrodes 10 formed on a transparent substrate 1, plural video signal electrodes 14 formed to intersect with these scanning electrodes 10, thin-film transistors(TFTs) connected to the scanning electrodes 10 and the video signal electrodes 14, pixel electrodes 13 connected to the these TFTs, auxiliary capacitors connected to the pixel electrodes 13 and protective insulating films covering at least the TFTs. The auxiliary capacitors are composed of the scanning electrodes 10, the self-oxidized films of the scanning electrodes 10 formed to cover the front surfaces and flanks of the scanning electrodes 10 and upper electrodes 17 in contact with these self-oxidized films only on the surface of the scanning electrodes 10. The semiconductor films 31 and gate insulating films 21 constituting the TFTs have approximately the same plane shape.

2. 发明专利

JPH07235738A CIRCUIT BOARD 失效
公开(公告)号：JPH07235738A
公开(公告)日：1995-09-05
申请号：JP2770294
申请日：1994-02-25
申请人： HITACHI LTD
发明人： KAMIAKUTSU MASAKI , KOBAYASHI TAKAO , HIDA HIROYUKI
IPC分类号： H05K1/02 , H01L23/12 , H05K1/00 , H05K1/11 , H05K1/18
摘要： PURPOSE:To enable quick response to proper use of a chip IC and a packaged IC depending on the variation of defective, product rate and price of monolithic IC by forming electrodes on a circuit board beforehand so that both the chip IC and the package IC are mounted. CONSTITUTION:An electrode part 3 for the chip IC to mount the chip IC is formed on a circuit board 1, and an electrode part 4 for the package IC to mount the package IC is formed surrounding the outside of it. Wiring to the electrode part 3 for the chip IC, to the electrode part 4 for the package IC and to the other monolithic IC is connected by the wiring pattern 2. Whichever of the chip IC electrodes 3 or the package IC electrodes 4 the monolithic IC is mounted on, these are connected by the wiring pattern 2 and connection is electrically the same.

3. 发明专利

JPH04192391A PATTERN DRAWING DEVICE 失效
公开(公告)号：JPH04192391A
公开(公告)日：1992-07-10
申请号：JP31805490
申请日：1990-11-26
申请人： HITACHI LTD
发明人： TAJIRI YOJI , KIYONO TASAKU , ATO KAZUHIKO , HIDA HIROYUKI
IPC分类号： B43L13/00 , H01C17/06 , H05K3/10
摘要： PURPOSE:To offer a pattern drawing device capable of coating uniformly a paste regardless of the warpage and roughness of a substrate by a method wherein a sensor is arranged so as to turn always to the direction of a nozzle. CONSTITUTION:A Z table 15 movable to the vertical direction by a Z motor 14 is arranged over an XY table 11 and a sensor table 17 is mounted to the table 15 in such a way that it is rotatable on the horizontal plane by a sensor motor 18. A nozzle 16 for discharging a paste P on a substrate 13 on the table 11 is fixed on the lower part of the table 17 and at the same time, a sensor 19 is fixed in close proximity to a discharge orifice of the nozzle 16 so that the distance ALPHAZ between the discharge orifice of the nozzle 16 and the substrate 13 can be detected. As the nozzle 16 and the sensor 19 are both rotatable on the horizontal plane, a detection signal of the sensor becomes accurate regardless of the warpage and roughness of the substrate and the paste can be uniformly applied.

4. 发明专利

JPH03266653A THICK FILM THERMAL RECORDING HEAD 失效
公开(公告)号：JPH03266653A
公开(公告)日：1991-11-27
申请号：JP6633690
申请日：1990-03-16
申请人： HITACHI LTD
发明人： SATOU KAZUYASU , WATANABE MICHIHIRO , MATSUMOTO SHOGO , HIDA HIROYUKI
IPC分类号： B41J2/345
摘要： PURPOSE:To form a simple structure with no through hole by a method wherein a heating element is connected to an intermediate pad with a first lead wire, the heating element is connected to a common electrode with a second lead wire adjacent to the first lead wire, and the intermediate pad is connected to an IC side pad with a wire passing above the common electrode while being spaced. CONSTITUTION:A glazed layer composed of glass is formed on all or a part of a substrate 1 consisting of ceramics or metals, and a common electrode 4 to which a bus electric potential is applied as a relaying point of a power source drawn out from a heating element 3 is connected further thereonto. A lead wire 2a being a second lead wire and a lead wire 2b consisting of a first lead wire for being connected to a driving IC 5 to be drawn out from the heating element are formed. The heating element 3 is formed near one end surface of the substrate 1, and the lead wires 2a, 2b are formed toward the other end surface of the substrate 1. A pad 2c is provided to a tip of the lead wire 2b drawn out from the heating element 3, and the pad 2c is wire- bonded to a pad 6 formed on another substrate 8 on which the driving IC 5 is mounted with a bonding wire 7.

5. 发明专利

JP2003151938A METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
公开(公告)号：JP2003151938A
公开(公告)日：2003-05-23
申请号：JP2001348193
申请日：2001-11-14
申请人： HITACHI LTD
发明人： ABE TOSHIHIKO , TACHIKAWA KOSAKU , HIDA HIROYUKI
IPC分类号： H01L21/76 , H01L21/304 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To increase polishing accuracy by exactly detecting the end point of polishing. SOLUTION: A silicon oxide film 16a, a silicon oxide nitride film 16b, and a silicon oxide film 16c are formed in the order in the upper part of MISFETs (Qn and Qp) on a principal plane of a semiconductor substrate 1. Then, the semiconductor substrate 1 formed with these films is set in a polisher, and during polishing, a change in intensity of reflected light which occurs, when the silicon oxide nitride film 16b is exposed, is detected. After overpolishing is conducted for a certain subsequent period of time by finishing polishing, the surface of the silicon oxide film 16a is flattened.

6. 发明专利

JPH08330684A PRINTED WIRING BOARD 失效
公开(公告)号：JPH08330684A
公开(公告)日：1996-12-13
申请号：JP13634395
申请日：1995-06-02
申请人： HITACHI LTD
发明人： YAHAGI SATORU , HIDA HIROYUKI
IPC分类号： H05K1/02 , H05K3/00
摘要： PURPOSE: To unnecessitate an excessive edge part for a pattern of checking excessive V-cuts in the periphery of a substrate so as to improve the blanking and reduce the production cost by preparing a pattern for checking V-cuts inside a circuit pattern. CONSTITUTION: A plurality of the same circuit patterns are formed on a substrate of one unit size, and V-cuts are made therein, then it is separated along V-cut grooves 2 into printed wiring boards 1. In addition, a pattern for checking V-cuts is prepared inside a circuit pattern.

7. 发明专利

JPH0536583A ALIGNMENT METHOD AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH0536583A
公开(公告)日：1993-02-12
申请号：JP19008391
申请日：1991-07-30
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MORIUCHI NOBORU , SHIRAI SEIICHIRO , NITTA KYOYA , HIDA HIROYUKI
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30
摘要： PURPOSE:To perform an alignment operation among many layers without increasing an alignment margin in the alignment operation of pattern positions in an exposure process as the manufacturing process of a semiconductor integrated circuit device. CONSTITUTION:In a process 101, individual alignment marks for a diffusion-layer pattern and a gate-electrode pattern are first detected, and positional coordinates of the individual alignment marks are computed. In a process 102, sets of the positional coordinates, of the alignment marks, which have been computed in the process 101 are averaged, and reference positional coordinates for alignment use of contact hole patterns are computed. After that, in a process 103, a reticle and a semiconductor wafer are aligned relatively on the basis of the reference positional coordinates, for alignment use of the contact hole patterns, which have been computed in the process 102.

8. 发明专利

JPS6035514A PHOTOLITHOGRAPHIC PATTERN 失效
公开(公告)号：JPS6035514A
公开(公告)日：1985-02-23
申请号：JP14381983
申请日：1983-08-08
申请人： HITACHI MICROCUMPUTER ENG , HITACHI LTD
发明人： MIWA HIDEO , ODAKA MASANORI , MIHARA TAKASHI , HIDA HIROYUKI
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30
摘要： PURPOSE:To contrive improvement in matching accuracy as well as to prevent reduction in number of chips by a method wherein the width of a scribe line is partially widened, and an alignment mark is formed within the widened width region, thereby enabling to form the alignment mark in large measurements. CONSTITUTION:The width measurements of the scribe line 3 formed between the chip patterns 2 of the reticle 1 to be used for the manufacture of a semiconductor integrated circuit device is partially increased, a width-widened part is formed in such a manner that it comes into the marginal part 7 provided around the effective pattern of the chip pattern 2, and it is constituted that the width- widened part will be formed almost in square shape. X-shaped and cross-shaped alignment marks 4 are formed respectively in the size as large as possible.

9. 发明专利

JPH11212779A PROGRAM GENERATION SUPPORT SYSTEM 失效
公开(公告)号：JPH11212779A
公开(公告)日：1999-08-06
申请号：JP30006498
申请日：1998-10-21
申请人： HITACHI LTD , HITACHI INF & CONTROL SYST LTD
发明人： HIDA HIROYUKI , HAMADA YOSHITOSHI
IPC分类号： G06F9/06
摘要： PROBLEM TO BE SOLVED: To provide a program automatic generation support system that uses a table which defines and describes function specifications as it is and outputs a program source on the basis of the function specifications inputted as a table as it is. SOLUTION: A parameter of a program for which a framework is provided in advance is decided on the basis of given data and a feasible program is generated. This system is equipped with a data definition means 11 for defining the given data as a table format expression in accordance with a predetermined definition rule, a data analysis means 21 for reading the data according to the definition rule from the data defined as the table format expression, classifying the data in accordance with a predetermined analysis rule and generating a group of classified data, and a program generation means 22 for deciding a parameter by using the group of the classified data in accordance with the framework of the prepared program and for processing to generate the feasible program.

10. 发明专利

JPH09283662A CIRCUIT BOARD 失效
公开(公告)号：JPH09283662A
公开(公告)日：1997-10-31
申请号：JP9221596
申请日：1996-04-15
申请人： HITACHI LTD
发明人： HIDA HIROYUKI , KAWAMATA TETSUJI
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To prevent a short circuit between a through-hole and a semiconductor element and prevent outflow of a sealing resin from the through-hole, by adhering and fixing an insulating plate having an area large enough to cover the through-hole or an insulating plate having a conductive film on a surface to be in contact with the semiconductor element, between a wiring board and the semiconductor element. SOLUTION: An insulating plate 6 having an area large enough to cover a through-hole 7 existing near a surface in contact with a semiconductor element 1 is adhered and fixed using an insulating adhesive 5. Then, the semiconductor element 1 is adhered and fixed onto the insulating plate 6 using the insulating adhesive 5. The semiconductor element 1 is connected to an electrode portion 3 via a bonding wire 2. In addition, a sealing resin 8 is applied, hardened and fixed in order to protect the semiconductor element 1 and the bonding wire 2. Thus, even though the sealing resin 8 has fluidity and therefore will flow into the through-hole 7 in a wiring board 4, the insulating plate 6 prevents the inflow of the resin sealing. Therefore, neither inflow into the through-hole 7 nor outflow to the back side of the wiring board 4 occurs.

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