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1. 发明专利

JP2014002267A Foam sheet, light reflection plate using the same, and backlight panel 审中-公开
标题翻译：泡沫板，使用相同的光反射板和背光面板
公开(公告)号：JP2014002267A
公开(公告)日：2014-01-09
申请号：JP2012137366
申请日：2012-06-18
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： IKURA YUKIHIRO , IKEDA HIDEYUKI , INAMORI KOJIRO , MORITA NAGAYUKI , YOSHITANI TSUTOMU , NOMURA SHINGO , MURAKAMI AKIHIRO
IPC分类号： G02B5/08 , B32B27/36 , F21S2/00 , F21V7/00 , F21V7/04 , F21V7/22 , G02B5/02 , G02F1/13357
CPC分类号： B32B5/18 , B32B3/30 , B32B27/065 , B32B27/36 , B32B2266/0264 , B32B2457/202 , G02B5/0247 , G02B5/0284 , G02B6/0051 , G02B6/0055
摘要： PROBLEM TO BE SOLVED: To provide a foam sheet having desired ruggedness on a surface and indicating excellent performance as a light reflection plate of a backlight panel.SOLUTION: In a foam sheet having at least two-layer structure composed of thermoplastic polyester resin, the foam sheet has at least one foam layer and at least one non-foam layer, at least one layer of the non-foam layers constitutes a surface layer of the foam layers, the non-foam layer contains thermoplastic polyester resin (B) different from thermoplastic polyester resin (A) composing the foam layer at a rate of more than 50 pts.mass and 100 pts.mass or less to 100 pts.mass of total thermoplastic polyester resin composing the non-foam layer, and ruggedness with arithmetic average roughness Ra of 3.5 μm or more is formed on an exposed surface of at least one non-foam layer composing the surface layer.
摘要翻译：要解决的问题：提供一种在表面上具有期望的凹凸性并表现出优异性能的泡沫片作为背光面板的光反射板。解决方案：在具有由热塑性聚酯树脂构成的至少两层结构的泡沫片中，泡沫片材具有至少一个泡沫层和至少一个非泡沫层，至少一层非泡沫层构成泡沫层的表面层，非发泡层含有热塑性聚酯树脂（B）不同于构成泡沫层的热塑性聚酯树脂（A）以构成非泡沫层的总热塑性聚酯树脂的比例大于50磅，100磅/厘米2〜100磅/秒，算术平均粗糙度为粗糙度在构成表面层的至少一个非泡沫层的暴露表面上形成3.5μm以上的Ra。

2. 发明专利

JP2012212731A Adhesive tape for processing radiation curable semiconductor 有权
标题翻译：用于加工辐射可固化半导体的胶带
公开(公告)号：JP2012212731A
公开(公告)日：2012-11-01
申请号：JP2011076686
申请日：2011-03-30
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： YOSHITANI TSUTOMU , TAKEUCHI TAKESHI , YANO SHOZO
IPC分类号： H01L21/301 , C09J4/00 , C09J4/02 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a radiation curable semiconductor which exhibits good antistatic properties in semiconductor processing, and hardly allows an adhesive to remain on an adherend in pickup.SOLUTION: In an adhesive tape for processing a radiation curable semiconductor in which an adhesive layer is formed on a base material resin film, the base material resin film is a resin composition having 90 to 70 wt.% of ethylene-vinyl acetate copolymer (a1) and 10 to 30 wt.% of a resin (a2) in which a carboxyl group of a copolymer containing at least of ethylene composition and (meta) acrylic acid composition as a component, is crosslinked by way of potassium ions, and the adhesive layer containing polymer (B) in which a radiation curable carbon-carbon double bond-containing group for a repeating unit of a principal chain is bonded, is formed on the base material resin film having a volume resistivity of equal to or less than 1×10Ω cm.
摘要翻译：要解决的问题：提供一种用于加工在半导体加工中具有良好抗静电性能的可辐射固化半导体的胶带，并且几乎不允许粘合剂保留在拾取中的被粘物上。解决方案：在基材树脂膜上形成粘合剂层的可辐射固化半导体的加工用胶带中，基材树脂膜是具有90〜70重量％的乙烯 - 乙酸乙烯酯的树脂组合物共聚物（a1）和10〜30重量％的含有至少乙烯组合物的共聚物的羧基和（甲基）丙烯酸组合物作为组分的树脂的树脂（a2）通过钾离子交联，并且在具有等于或小于等于或等于体积电阻率的基体树脂膜上形成含有用于连接主链的重复单元的可辐射固化碳 - 碳双键基团的含聚合物（B）的粘合剂层比1×10 13 Ωcm。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2017089659A 壁部貫通部材の取り付け構造、壁部貫通部材の浮き上り防止方法、係止部材の空回り防止方法および係止部材审中-公开
公开(公告)号：JP2017089659A
公开(公告)日：2017-05-25
申请号：JP2015215493
申请日：2015-11-02
申请人：古河電気工業株式会社 , Furukawa Electric Co Ltd:The , 積水ハウス株式会社 , Sekisui House Ltd
发明人： YOSHITANI TSUTOMU , HIDESHIMA TAMOTSU , IWATA ATSUSHI , URUSHIBARA SHIN
IPC分类号： F16L5/00 , E03C1/02 , F16L5/02
摘要：【課題】様々な壁部に対しても確実に壁部貫通部材を固定することが可能な壁部貫通部材の取り付け構造、壁部貫通部材の浮き上り防止方法、係止部材の空回り防止方法および係止部材を提供する。【解決手段】パイプ部5の外周面には、ネジ傾斜防止部19が設けられる。ネジ傾斜防止部19によって、ネジ9は、移動が規制される。ネジ傾斜防止部19は、ネジ9の位置を所定の範囲で規制するため、ネジ9が傾くことを防止することができる。すなわち、ネジ9は、少なくともフランジ部材3とネジ傾斜防止部19によって支持される。なお、ネジ傾斜防止部19は、フランジ部材3(第2フランジ部3b)から所定距離以上離間した位置の方が、ネジ9の傾斜防止効果は大きいが、壁部への固定の際に妨げとならない位置に設ける必要がある。さらに前記パイプ部には、周方向に向けて、前記パイプ部の変形防止のためのビードが形成される。【選択図】図1

4. 发明专利

JP2011210944A Antistatic adhesive tape for semiconductor processing 有权
标题翻译：用于半导体加工的防静电胶带
公开(公告)号：JP2011210944A
公开(公告)日：2011-10-20
申请号：JP2010077022
申请日：2010-03-30
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： YOSHITANI TSUTOMU , YANO SHOZO , TAKEUCHI TAKESHI , UCHIYAMA TOMORO
IPC分类号： H01L21/304 , C09J7/02 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide an antistatic adhesive tape for semiconductor processing, which causes little contamination on an adherend and little aging of an adhesive property as well as little influence to a surface of the adherend during dicing or back grinding treatment of a semiconductor component, and which can exhibit antistatic properties after ultraviolet curing even if an adhesive layer is thick.SOLUTION: The antistatic adhesive tape for semiconductor processing constituted by a base film and a photocuring adhesive layer includes: an antistatic layer containing a conductive polymer at least on one surface of the base film; and an adhesive layer containing a photocuring unsaturated carbon bond in a molecule of a base polymer on the antistatic layer, wherein a surface resistivity on the adhesive layer side before and after the ultraviolet curing is 1×10to 5×10Ω/square, a thickness of the adhesive layer is 20-250 μm, and a 90-degree peeling adhesive power of the adhesive layer after the ultraviolet curing when the adhesive tape adheres to a silicon mirror wafer is 0.15-0.25 N/25 mm.
摘要翻译：要解决的问题：为了提供一种用于半导体加工的抗静电胶带，其对被粘物几乎没有污染，并且对半导体部件的切割或后磨削处理期间对粘合性能的影响小，对被粘物的表面几乎没有影响并且即使粘合剂层厚，也可以在紫外线固化后表现出抗静电性。溶胶：由基膜和光固化粘合剂层构成的半导体加工用抗静电胶带包括：至少含有导电性聚合物的抗静电层基膜表面; 以及在抗静电层的基体聚合物分子中含有光固化不饱和碳键的粘合层，其中紫外线固化前后的粘合剂层侧的表面电阻率为1×10〜5×10Ω/□，粘合剂层为20-250μm，当胶带粘附到硅镜晶片时紫外线固化后粘合剂层的90度剥离粘合力为0.15-0.25N / 25mm。

5. 发明专利

JP2014237267A 発泡シート、光反射板、バックライトパネル、及び発泡シートを作製するための樹脂シート、並びに発泡シートの製造方法审中-公开
标题翻译：泡沫片，光反射板，背面板，用于生产泡沫片的树脂片和生产泡沫片的方法
公开(公告)号：JP2014237267A
公开(公告)日：2014-12-18
申请号：JP2013121196
申请日：2013-06-07
申请人：古河電気工業株式会社 , Furukawa Electric Co Ltd:The , 東洋紡株式会社 , Toyobo Co Ltd
发明人： IKURA YUKIHIRO , INAMORI KOJIRO , NOMURA SHINGO , YOSHITANI TSUTOMU , KIMURA KAZUHIRO , MORITA NAGAYUKI , UMEMURA KOJI , SUZUKI OSAMU , KABUMOTO AKIRA , MURAKAMI AKIHIRO , INOUE SHOTA , FUJINO HIDETOSHI
IPC分类号： B32B5/18 , F21S2/00 , G02B5/02
摘要：【課題】本発明は、表面に特定の凹凸が精度よく形成され、バックライトパネルの光反射板として優れたホワイトスポット耐性を示す発泡シートを提供する。【解決手段】熱可塑性樹脂からなる発泡シートであって、前記発泡シート10は、気泡を含有する熱可塑性樹脂(A)層11と、粒子を含み気泡を含有しない熱可塑性樹脂(B)層12とを有し、粒子を含み気泡を含有しない熱可塑性樹脂(B)層12は発泡シート10の最表層を構成し、かつ、表面の算術平均粗さ(Ra)が0.5μm
摘要翻译：要解决的问题：提供在表面上形成具有特定不均匀形状的发泡片，其精度高，并且作为背光面板的光反射板显示出优异的白斑电阻。解决方案：泡沫片10组成的热塑性树脂包括含有电池的热塑性树脂（A）层11和含有颗粒且没有电池的热塑性树脂（B）层12。含有颗粒，不含细胞的热塑性树脂（B）层12构成泡沫片10的最外层，其表面的算术平均粗糙度（Ra）为0.5μm

6. 发明专利

JP2013209559A Ultraviolet light curable adhesive tape for processing semiconductor device 审中-公开
标题翻译：用于加工半导体器件的超紫外线光固化胶带
公开(公告)号：JP2013209559A
公开(公告)日：2013-10-10
申请号：JP2012081737
申请日：2012-03-30
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： OTA GOSHI , YOSHITANI TSUTOMU , TAMAGAWA ARIMICHI
IPC分类号： C09J7/02 , C09J11/06 , C09J133/00 , H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a semiconductor device, exhibiting an excellent static prevention effect in a processing step for the semiconductor device and exhibiting a stable ultraviolet light curability capable of inhibiting curing reaction by ultraviolet light even on being exposed to fluorescent light during storage.SOLUTION: An ultraviolet light curable adhesive tape for processing a semiconductor device obtained by forming an adhesive layer on ultraviolet light transmitting substrate resin film is characterized by including at least (A) an acrylic copolymer having a carbon-carbon double bond-containing group in its molecule, (B) an ionic liquid consisting of an organic cationic component and anionic component and (C) a photopolymerization initiation accelerator, in the adhesive layer, and containing 0.5 to 2 pts.mass of component (C) based on 100 pts.mass of component (A).
摘要翻译：要解决的问题：提供一种用于半导体器件加工的胶带，在半导体器件的加工步骤中具有优异的防静电效果，并且即使暴露于半导体器件也能够通过紫外线显示出能够抑制紫外线固化反应的稳定的紫外光固化性存储期间的荧光灯。解决方案：用于处理通过在紫外线透射基板树脂膜上形成粘合剂层而获得的半导体器件的紫外光固化胶带的特征在于至少包括（A）具有碳 - 碳双键的丙烯酸共聚物（B）由有机阳离子成分和阴离子成分构成的离子液体和（C）光聚合引发促进剂，在粘合剂层中含有0.5〜2质量份的（C）成分在100份组分（A）上。

7. 发明专利

JP2013093519A Adhesive tape for processing semiconductor device 有权
标题翻译：用于加工半导体器件的胶带
公开(公告)号：JP2013093519A
公开(公告)日：2013-05-16
申请号：JP2011236071
申请日：2011-10-27
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： TAMAGAWA ARIMICHI , YOSHITANI TSUTOMU , MATSUBARA YUKIHIRO , OKAMOTO KAZUYUKI , HATTORI SATOSHI
IPC分类号： H01L21/301 , B32B27/00 , B32B27/32 , C09J7/02 , C09J201/00
CPC分类号： B32B27/32 , B32B2250/03 , B32B2250/242 , B32B2250/40 , C09J7/29 , C09J2201/162 , C09J2203/326 , C09J2205/31 , C09J2423/006 , C09J2423/046 , C09J2423/166 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/68381
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape that can be diced by preventing adhesion of cutting waste to a semiconductor device, without requiring new facility improvement or introduction of consumables in the processing of a semiconductor device.SOLUTION: In an adhesive tape 1 used for fixing a package sealed collectively when dividing the package into individual packages by dicing and individualizing the package, a UV-curing adhesive layer 5 is provided on a base film 3, the contact angle of the surface of the adhesive layer 5 for the pure water is less than 115° before being irradiated with a UV-ray, and the contact angle for methylene iodide is less than 65°.
摘要翻译：要解决的问题：提供一种可以通过防止切割废料粘附到半导体器件上而可以切割的胶带，而不需要在半导体器件的加工中新设备改进或引入耗材。解决方案：在通过切割和个体化包装将包装分成单独包装而将包装密封在一起的用于固定包装的胶带1中，在基膜3上设置UV固化粘合剂层5，用于纯水的粘合剂层5的表面在照射紫外线之前小于115°，二碘甲烷的接触角小于65°。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012212732A Adhesive tape for processing radiation curable semiconductor 有权
标题翻译：用于加工辐射可固化半导体的胶带
公开(公告)号：JP2012212732A
公开(公告)日：2012-11-01
申请号：JP2011076687
申请日：2011-03-30
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： YOSHITANI TSUTOMU , TAKEUCHI TAKESHI , YANO SHOZO
IPC分类号： H01L21/301 , B32B27/00 , B32B27/28 , C09J7/02 , C09J133/08
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a radiation curable semiconductor which exhibits good antistatic properties in semiconductor processing, can significantly reduce generation of fibrous cut waste in a dicing process, allows little slack of the tape by irradiation and hardly allows an adhesive to remain on an adherend in pickup.SOLUTION: In an adhesive tape for processing a radiation curable semiconductor in which a particular adhesive layer is formed on a base material resin film, the base material resin film consists of at least of two layers, a layer contacting with the adhesive layer of the base material resin film is a resin composition having ethylene-vinyl acetate copolymer (a1) and a resin (a2) in which carboxyl group of a copolymer containing at least of ethylene composition and (meta) acrylic acid composition as a component, is crosslinked by way of potassium ions, and a layer other than the layer contacting with the adhesive layer is a resin composition containing high density polyethylene or polypropylene.
摘要翻译：要解决的问题：为了提供一种用于加工在半导体加工中具有良好抗静电性能的可辐射固化半导体的胶带，可以显着减少切割工艺中的纤维切割废料的产生，通过照射允许胶带几乎不松弛，几乎不允许粘合剂保留在拾取中的被粘物上。解决方案：在基材树脂膜上形成特定粘合剂层的可辐射固化半导体处理用胶带中，基材树脂膜至少由两层构成，与粘合层接触的层的基材树脂膜是具有乙烯 - 乙酸乙烯酯共聚物（a1）和至少含有乙烯组分和（甲基）丙烯酸组合物的共聚物的羧基作为组分的树脂（a2））的树脂组合物是通过钾离子交联，除了与粘合剂层接触的层以外的层是含有高密度聚乙烯或聚丙烯的树脂组合物。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012119395A Adhesive tape for semiconductor device dicing and manufacturing method of semiconductor device chip 审中-公开
标题翻译：用于半导体器件芯片的半导体器件引脚和制造方法的粘合带
公开(公告)号：JP2012119395A
公开(公告)日：2012-06-21
申请号：JP2010265688
申请日：2010-11-29
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： TAKEUCHI TAKESHI , YOSHITANI TSUTOMU , YANO SHOZO
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor device dicing in which attachment of fibrous cut wastes during a dicing process is reduced and adherence of an adhesive is also reduced in a part around a semiconductor device laser mark, and a manufacturing method of a semiconductor device chip using the adhesive tape.SOLUTION: The present invention relates to an adhesive tape 100 for semiconductor device dicing in which an adhesive layer 20 is formed on a base material resin film 10. Resin composition constituting the base material resin film 10 contacting the adhesive layer 20 has a base resin component of an ethylene vinyl acetate copolymer which has melt flow rate of 1 to 20 as well as weight average molecular weight of 150000 to 600000.
摘要翻译：解决的问题：提供一种用于半导体器件切割的粘合带，其中在切割工艺期间纤维切割废料的附着减少，并且在半导体器件激光标记周围的部分中粘合剂的粘附也降低，并且使用该胶带的半导体器件芯片的制造方法。解决方案本发明涉及一种用于半导体器件切割的粘合带100，其中在基材树脂膜10上形成粘合剂层20.构成与粘合层20接触的基材树脂膜10的树脂组合物具有乙烯 - 乙酸乙烯酯共聚物的基础树脂组分，其熔体流动速率为1-20，重均分子量为150000至600000.版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011210989A Antistatic adhesive tape for semiconductor processing 有权
标题翻译：用于半导体加工的防静电胶带
公开(公告)号：JP2011210989A
公开(公告)日：2011-10-20
申请号：JP2010077862
申请日：2010-03-30
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： YOSHITANI TSUTOMU , YANO SHOZO , TAKEUCHI TAKESHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an antistatic adhesive tape for semiconductor processing, which exhibits an excellent antistatic performance in semiconductor processing, allows little slack of the tape by irradiation, and hardly allows an adhesive to remain on an adherend in pickup.SOLUTION: The antistatic adhesive tape for semiconductor processing includes: an antistatic layer consisting of a resin composition containing 10-45 pts.mass of an antistatic resin containing polyether based on 100 pts.mass of a base resin at least containing 40-90 wt.% polypropylene and 60-10 wt.% styrene elastomer resin; and an adhesive layer containing a base polymer having a radiation-curable unsaturated carbon bond in a molecule.
摘要翻译：要解决的问题：为了提供在半导体加工中表现出优异的抗静电性能的半导体加工用抗静电胶带，通过照射使胶带几乎不松弛，并且几乎不能使粘合剂保留在拾取器中的被粘物上。解决方案：用于半导体加工的抗静电胶带包括：抗静电层，其由含有10-45重量份含聚醚的树脂组合物组成，所述抗静电树脂基于100重量份至少包含40-90重量％聚丙烯的基础树脂， 60-10重量％苯乙烯弹性体树脂; 以及在分子中含有具有可辐射固化的不饱和碳键的基础聚合物的粘合剂层。

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