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1. 发明专利

JP2519747B2 失效
公开(公告)号：JP2519747B2
公开(公告)日：1996-07-31
申请号：JP22892787
申请日：1987-09-11
申请人： FUJITSU LTD
发明人： SOGO HIROYUKI , NISHIDA HARUKI
IPC分类号： H01P1/20 , H01P1/205 , H01P5/08 , H01P7/10

2. 发明专利

JPH06216670A HIGH OUTPUT AMPLIFIER 失效
公开(公告)号：JPH06216670A
公开(公告)日：1994-08-05
申请号：JP667293
申请日：1993-01-19
申请人： FUJITSU LTD
发明人： WATANABE SHIN , NISHIDA HARUKI
IPC分类号： H03F1/34 , H03F3/21 , H03F3/60
摘要： PURPOSE:To provide a high output amplifier excellent in power efficiency with a simple circuit constitution and to efficiently suppress signal distortion concerning a high output amplifier used for amplifying transmission signal power in a microwave radio equipment or the like. CONSTITUTION:In the high output amplifier provided with a transistor 2 for amplifying signals in a strip line 1 for a signal line, the strip line 4 for feedback provided with a line length capable of suppressing higher harmonic which is connected to the strip line 1 on the output side of the transistor 2 and also connected through a directional coupler 3 to the strip line 1 on the input side of the transistor 2 is provided.

3. 发明专利

JPH06140774A HEAT DISSIPATION STRUCTURE OF PLASTIC COVER 失效
公开(公告)号：JPH06140774A
公开(公告)日：1994-05-20
申请号：JP28649992
申请日：1992-10-26
申请人： FUJITSU LTD
发明人： WATANABE AKIRA , NISHIDA HARUKI
IPC分类号： H04B1/036 , H04B1/08 , H05K5/03 , H05K7/20
摘要： PURPOSE:To improve heat dissipation property even if a plastic material of poor heat transmitting property is used. CONSTITUTION:Metallized metallic layers 2, 3 are provided to a specified partial surface or an entire surface of an inside surface and an outside surface of a plastic cover 1. The metallic layers 2, 3 are made conductive and connected by a plurality of through-holes 4. The metallic layers are provided to inside and outside surfaces of the plastic cover. A metallic conductor layer is provided to an intermediate layer inside the plastic cover. The metallic layers in both inside and outside surfaces are made conductive and connected through the metallic conductor layer and a via hole connected thereto.

4. 发明专利

JPH0310401A STRUCTURE FOR PREVENTING RESONANCE OF CASE 失效
公开(公告)号：JPH0310401A
公开(公告)日：1991-01-18
申请号：JP14480989
申请日：1989-06-07
申请人： FUJITSU LTD
发明人： SUZUKI HIROSHI , NISHIDA HARUKI
IPC分类号： H05K9/00 , H01P3/08 , H05K5/04
摘要： PURPOSE:To suppress the undesired resonance of a case without reducing the high Q of the circuit by providing a gap between an upper ridge of a barrier and an upper face of a case so that the range of the resonance of the case is expanded from one case part to other case part and providing a radio wave absorbing body or a resonance frequency adjustment screw to the inner face of the other case part. CONSTITUTION:An oscillation circuit 55 and an amplifier circuit 56 are separated by a barrier 2 made of a copper alloy material placed upright to a bottom face 14 of a case 1 and the mount space is shielded and separated except the butt connection of a microstrip line. The upper ridge 21 of the barrier 2 is not in contact with the upper face 13 of the case being the inner face of the fixed cover 6 (61) but has a prescribed gap for coupling a microwave and the resonance range of the case is expanded to case parts A11, B12 through the gap. Moreover, a radio wave absorbing body 3 or a frequency adjustment screw 4 is provided onto the inner face of the case part B12. Thus, the undesired case resonance is suppressed without reducing the high Q of the circuit.

5. 发明专利

JPH0261165B2 失效
公开(公告)号：JPH0261165B2
公开(公告)日：1990-12-19
申请号：JP8137186
申请日：1986-04-09
申请人： FUJITSU LTD
发明人： NISHIDA HARUKI
IPC分类号： H01P1/22

6. 发明专利

JPH0152926B2 失效
公开(公告)号：JPH0152926B2
公开(公告)日：1989-11-10
申请号：JP11246684
申请日：1984-06-01
申请人： FUJITSU LTD
发明人： YANO YASUHIRO , NISHIDA HARUKI , ITO ASAO , UEDA HIROKAZU
IPC分类号： H03D3/14 , H03D13/00

7. 发明专利

JPS6472598A CIRCUIT PACKAGE STRUCTURE FOR WIRELESS INSTALLATION 失效
公开(公告)号：JPS6472598A
公开(公告)日：1989-03-17
申请号：JP22850287
申请日：1987-09-14
申请人： FUJITSU LTD
发明人： NISHIDA HARUKI
IPC分类号： H05K9/00 , H01P3/08
摘要： PURPOSE:To enhance the mounting density of circuit component parts, to reduce in size a wireless installation, and to facilitate the regulation of circuit characteristics and the mounting work of the circuit component parts by placing a printed board, on which operation circuit component parts for a signal processing circuit are mounted, in a recess formed on the outside of the bottom wall of a metal case. CONSTITUTION:A metal case 22 for hermetically sealingly containing a signal processing circuit 21 for processing a predetermined frequency signal necessary to be electromagnetically shielded for its low frequency circuit, a predetermined frequency signal transmission line 23 extended through the sidewall 22a of the case 22 and connected to the predetermined frequency signal input terminal and output terminal of the signal processing circuit in the case 22, and hermetically sealing terminal pins 24 extended through the bottom wall 22b of the case for 22 supplying power, a control signal, etc., from operating circuits 33a, 33b to the signal processing circuit in the case 22 are provided. In the circuit package structure of such a wireless installation, a printed substrate 32 on which operation circuit forming components 33 for the signal processing circuit are mounted is placed in the recess 22d formed on the outside of the bottom wall 22b of the case 22.

8. 发明专利

JPS62247602A FIXED RESISTANCE ATTENUATOR 失效
公开(公告)号：JPS62247602A
公开(公告)日：1987-10-28
申请号：JP9031886
申请日：1986-04-18
申请人： FUJITSU LTD
发明人： NISHIDA HARUKI
IPC分类号： H01C7/00 , H01P1/22 , H03H7/24
摘要： PURPOSE:To obtain a fixed resistance attenuator having comparatively satisfactory frequency characteristics by inserting the resistors of

9. 发明专利

JPS6120165B2 JPS6120165B2 - 失效
公开(公告)号：JPS6120165B2
公开(公告)日：1986-05-21
申请号：JP8371780
申请日：1980-06-20
申请人： Fujitsu Ltd
发明人： NISHIDA HARUKI
IPC分类号： H01P1/20 , H03B5/12 , H03B5/18
CPC分类号： H03B5/18

10. 发明专利

JPS59134902A Fitting device of dielectric resonator 失效
标题翻译：电介质谐振器配套装置
公开(公告)号：JPS59134902A
公开(公告)日：1984-08-02
申请号：JP867883
申请日：1983-01-24
申请人： Fujitsu Ltd
发明人： YANO YASUHIRO , NISHIDA HARUKI , UEDA HIROKAZU
IPC分类号： H01P7/10
CPC分类号： H01P7/10
摘要： PURPOSE:To adjust easily a characteristic of a dielectric resonator by constituting the dielectric resonator that it is formed attachably and detachably or its fitting position is adjusted in a device fitting the dielectric resonator while keeping a prescribed interval with a case or a circuit element in the case. CONSTITUTION:Supports 4 are fixed to the dielectric resonator 1 by an adhesives 3 and a nut 8' is fixed by an adhesives 5, and they are formed incorporatedly. On the other hand, the case 2 as a ground member is provided with the board 6 on which a microwave integrated circuit comprising a microstrip line MSL7 or the like is formed and the MSL7 as a transmission line provided on the board. The position of the dielectric resonator 1 is adjusted three-dimensionally as the inner wall face of the case 2, the MSL7 and the board 6, then the electromagnetic coupling and the phase of coupling are adjusted so as to obtain a prescribed resonance frequency. Since these adjustments are performed minutely in general and executed externally at the outside of the case 2, allowing to improve the working efficiency.
摘要翻译：目的：通过构成介质谐振器容易地调整介质谐振器的特性，可以形成为可拆卸地形成的介质谐振器，或者在安装介质谐振器的装置中调整其装配位置，同时在壳体或电路元件中保持规定的间隔案件。构成：支撑体4通过粘合剂3固定在介质谐振器1上，并且螺母8'由粘合剂5固定，并且它们被组合形成。另一方面，作为接地部件的壳体2设置有板6，在其上形成有微带线MSL7等的微波集成电路，并且设置在板上的作为传输线的MSL7。介质谐振器1的位置作为壳体2，MSL7和板6的内壁面三维地调整，然后调节电磁耦合和耦合相以获得规定的共振频率。由于这些调整一般执行很少并且在外壳2的外部执行，因此能够提高工作效率。

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