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1. 发明专利

JPH1197604A APPARATUS FOR BENDING OUT-GOING LEADS OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH1197604A
公开(公告)日：1999-04-09
申请号：JP25048597
申请日：1997-09-16
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI
IPC分类号： B21F1/00 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To easily and surely bend out-going leads arranged at small pitches by providing means for disposing at another side in at least one a first and a second outer leads bending at least one of first and second out-going leads in cooperation with support blocks. SOLUTION: A bender 10 is disposed at one side of each of out-going leads 3a, 3b, means 14 for bending all the leads 3a, 3b is disposed at the other sides of all the leads 3a, 3b and support blocks 12 for receiving all the leads 3a, 3b. Bending members 18, 20 face the support blocks 12 through the leads 3a, 3b, and are disposed at an initial position parallel to first bearings 12P of the blocks 12. The bending member 18 rotates for bending the lead 3a cooperating with the support blocks 12.

2. 发明专利

JPH08255861A MANUFACTURE OF CIRCUIT BOARD AND CIRCUIT INSPECTION APPARATUS 失效
公开(公告)号：JPH08255861A
公开(公告)日：1996-10-01
申请号：JP5857495
申请日：1995-03-17
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI
IPC分类号： H05K9/00 , H01L21/48 , H01L21/66 , H01L23/36 , H01L23/48 , H01L23/50 , H05K1/02 , H05K1/05 , H05K3/00 , H05K3/34 , H05K5/00
摘要： PURPOSE: To obtain a manufacturing method of a circuit board and a circuit inspection apparatus in which relative positional shift of a plurality of unit circuit boards is prevented while enhancing the work efficiency and the yield. CONSTITUTION: A plurality of unit circuit boards 1a, 1b,..., 1n having identical circuit patterns are interconnected to form a unit circuit board array. A circuit is then built for each circuit pattern formed on the unit circuit board constituting the unit circuit board array or the circuit pattern is subjected to a processing for determining the characteristics thereof and then the unit circuit boards are separated. An external lead 3 extending from a lead frame 4 and heat plates 2a, 2b, ..., 2n can be provided on the rear surface of each unit circuit board and they can be formed from one metal plate. The circuit on the unit circuit board is then applied with a dummy metal cap and the characteristics thereof are measured. Subsequently, the characteristics are regulated and a metal cap is applied permanently thus shielding the circuit board electromagnetically.

3. 发明专利

JPH06326142A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06326142A
公开(公告)日：1994-11-25
申请号：JP11177393
申请日：1993-05-13
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI
IPC分类号： H01L21/56 , H01L23/28
摘要： PURPOSE:To stabilize a resin sealing operation for a semiconductor device which is sealed with a potted resin. CONSTITUTION:A semiconductor element 17 and extraction leads 42, 43 are provided on the surface of a ceramic substrate 11. The extraction leads 42, 43 are provided with grooves 42-2, 43-2 at their root parts. The grooves 42-2, 43-2 restrain a potted resin from flowing out. The title semiconductor device is constituted so as to be provided with a resin layer 45 former in a state that the resin is restrained from flowing out.

4. 发明专利

JPS6381954A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6381954A
公开(公告)日：1988-04-12
申请号：JP22759586
申请日：1986-09-26
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI
IPC分类号： H01L23/04 , H01L23/02 , H01L23/12 , H01L25/04 , H01L25/18 , H05K9/00
摘要： PURPOSE:To miniaturize and lighten a semiconductor device, and to improve mass productivity remarkably by mounting a partition on the cap side of a vessel, manufacturing the vessel at low cost by forming the partition through drawing and forming the vessel body side to a plate shape. CONSTITUTION:A cap 12 is manufactured by drawing a plate having quality of SPCC so as to shape a plurality of bowllike swelled sections through a press technique. The number, shape, etc. of the bowllike swelled section are conformed to those of semiconductor circuit elements 21, 22 loaded on a vessel body 11. The plate-shaped peripheral section of the cap 12 is brought into contact with the periphery of the plate-shaped vessel 11, and both are bonded in the sections. A plate-shaped section 12c between small chambers 12a and 12b in the cap 12 is brought into contact with only the plate-shaped vessel body 11 and is not welded as the peripheral sections. For inhibit possibility in which a clearance is formed in the section 12c, the section 12c is projected slightly to the plate- shaped vessel body 11 side (the operation is conducted on press molding), and 12c may be formed to a shape that 12c pushes 11.

5. 发明专利

JPS6343401A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6343401A
公开(公告)日：1988-02-24
申请号：JP18695286
申请日：1986-08-11
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI , HASEGAWA MITSUO , ARAI YOICHI
IPC分类号： H01L23/12 , H01P5/02 , H01P5/08 , H01P5/107
摘要： PURPOSE:To simplify the assembling method by integrating a semiconductor device after a package and each terminal are integrated by the glass sintering method and sealing the result with a cap so as to eliminate the need for soldering or the like. CONSTITUTION:A waveguide 18 and a package main body 31 are coupled and a semiconductor circuit 17 is arranged on a package main body 31. A waveguide-coaxial conversion high frequency input(output) terminal 33 exists between the semiconductor circuit 17 and the waveguide 18. Further, a metal- made power terminal 34, an internal control terminal 35 and a coaxial output (input) terminal 36 are inserted to a through hole and bonded directly to the metallic part of the package main body 31 by the glass sintering method airtightly. Since the plate thickness of the package main body 31 is made thin, press-punching is applied and disadvantages such as leakage of sealing and internal short-circuit are eliminated.

6. 发明专利

JPS55134943A MANUFACTURING OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55134943A
公开(公告)日：1980-10-21
申请号：JP4322379
申请日：1979-04-10
申请人： FUJITSU LTD
发明人： SANO YOSHIAKI , MUGITANI HIROSHI , NEMOTO MASARU , IIZUKA TOORU
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To keep the amount of fixing solder material at a constant level in a concave by a method wherein, while on the surface of a substrate, on which semiconductor chips are to be fixed, a concave is formed to lay the fixing solder material, another concave adjacent thereto is further provided for scraping down surplus solder material. CONSTITUTION:In addition to a concave 1A, which is a little larger than a chip 3 on the surface of a substrate 1 for laying on the solder material 5 to fix a semiconductor chip 3, another concave adjacent thereto is to be provided for scraping down surplus solder material 5. In this way the substrate is constituted, the solder material 5 is laid inside the concave 1A, the surface of the solder material 5 is made to coincide with the surface of the substrate 1 by sweeping with a squeeze to make it into the solder material 5' and surplus solder material is scraped down into the concave 1B. Then the chip 3 is positioned on the solder material 5' within the concave 1A, which has been levelled, to be fixed by heating, the solder material 5 within the concave 1B is either left as it is or to be removed thus making electric resistance, thermal radiation, an the like at a constant level covring the whole products.

7. 发明专利

JP2506449B2 失效
公开(公告)号：JP2506449B2
公开(公告)日：1996-06-12
申请号：JP17036189
申请日：1989-06-30
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI , MATSUMOTO KAZUHIRO
IPC分类号： H01L23/04 , H01L23/02

8. 发明专利

JPH03102902A LIMITER FOR MICROWAVE RECEIVER 失效
公开(公告)号：JPH03102902A
公开(公告)日：1991-04-30
申请号：JP24095889
申请日：1989-09-18
申请人： FUJITSU LTD
发明人： FURUYA OSAHISA , MUGITANI HIROSHI , MATSUMOTO KAZUHIRO
IPC分类号： H01P1/15
摘要： PURPOSE:To obtain a limiter ensuring isolation and coping with a broad band input signal by suppressing a received microwave signal with a limiter diode and applying branching and synthesizing waves with a directional coupler to plural diodes. CONSTITUTION:A received microwave signal (gain 50dB) from a microwave antenna is inputted to a terminal Tin and given to a PIN diode 11, in which the gain is reduced to 25dB. Then, a hybrid 12 branches the signal at the rate of the attenuation quantities between a detection diode (attenuation 7dB) and a PIN diode (attenuation 25dB) 13b. The one branched signal is detected by a diode 13a and the other signal is isolated by a diode 13b. Then each threshold level of the diodes 11, 13b is decreased based on a DC voltage obtained by the detection of the diode 13a to make the entire isolation complete. Then, the signals branched at the rate are synthesized at a hybrid 14 in the same ratio and the result is outputted from a terminal Tout.

9. 发明专利

JPH01149601A CIRCUIT DEVICE 失效
公开(公告)号：JPH01149601A
公开(公告)日：1989-06-12
申请号：JP30909687
申请日：1987-12-07
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI , ISHII KIYOUICHI
IPC分类号： H05K9/00 , H01L25/04 , H01L25/18 , H01P3/08 , H01P5/02 , H01P5/08
摘要： PURPOSE:To improve the workability of assembling works of a circuit device and the radio wave cut-off of the circuit by providing shielding bodies which shield plural circuit elements from a chip member and a cap which encloses the circuit elements and electrically connecting the plural circuit elements with each other by forming a wiring pattern in the chip member. CONSTITUTION:A matching chip member 21 is manufactured in such a way that an upper-layer chip 25 is put on a lower layer chip 24 and they are heated with a pressure. When they are heated with a pressure after the upper-layer chip 25 is put on the lower-layer chip 24, they are integrated and biers 30 and 31 are respectively butted and connected to biers 42 and 43. Biers 38 and 40 are respectively connected to the vicinity of both ends of a matching pattern 28 and biers 39 and 41 are respectively connected with the vicinity of both ends of another matching pattern 29. Therefore, in the matching chip member 21 a pattern 33 for earthing on the upper surface and a metallic film 27 on the lower surface are electrically connected with each other through the biers 30, 31, 42, and 43. Since no protruding terminal exists on the upper surface side of a metallic container main body 22, wire bonding can be carried out at a high workability.

10. 发明专利

JPS62283645A CIRCUIT ELEMENT CONTAINER 失效
公开(公告)号：JPS62283645A
公开(公告)日：1987-12-09
申请号：JP12567086
申请日：1986-06-02
申请人： FUJITSU LTD
发明人： MUGITANI HIROSHI , FURUYA OSAHISA , ARAI YOICHI
IPC分类号： H01L23/02
摘要： PURPOSE:To obtain a container having means for resealing a cover without damaging the cover and a housing by drilling a hole in the cover to be opened, inserting a screw to the hole, and forming a structure that the cover is raised in a direction for separating from the housing by rotating the screw to remove the cover after sealing the cover. CONSTITUTION:A recess 21 to become a mark is formed, for example, by a punch at a position to be opened with the hole of a cover 13. A recess 19 (a non-penetrating hole) is formed on the wall of a housing 12 corresponding to the hole to be formed. When the cover 13 is removed, a drill 22 is used to drill at the recess 21, a threaded hole 23 is then formed by a tap. Then, when a screw 24 is engaged, the cover 13 is separated above the housing 12 by a jackup effect. Since the hole 23 is opened at the cover 13, when a new cover is used for resealing, the same shape as that before opening the seal can be obtained in an external appearance and function.

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