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JP2013035069A Cutting apparatus and method 有权
标题翻译：切割装置和方法
公开(公告)号：JP2013035069A
公开(公告)日：2013-02-21
申请号：JP2011170119
申请日：2011-08-03
申请人： Fuji Heavy Ind Ltd , 富士重工業株式会社
发明人： NISHIKAWA KOJI
IPC分类号： B23C3/00
CPC分类号： B23P25/006 , B23C1/00 , B23K26/0093 , B23K26/08 , Y10T29/5107 , Y10T29/5176 , Y10T83/0414 , Y10T83/283 , Y10T408/03 , Y10T409/303752
摘要： PROBLEM TO BE SOLVED: To avoid a limitation of a laser irradiation enabled area and enhance a cutting efficiency and convenience.SOLUTION: A cutting apparatus 1 includes a guide rail 18 circularly formed along a circumference centered around a spindle 10c of a cutting driving unit 10, a laser irradiation unit 22 movably formed along the guide rail and irradiating a cutting object 30 with laser at a predetermined inclination angle, a predetermined cutting position deriving unit 26a deriving a predetermined cutting position corresponding to a predetermined cutting area which is a cutting area by a cutting tool 10b after a predetermined time, a stopping position deriving unit 26b deriving a stopping position of the laser irradiation unit on the guide rail targeting the derived predetermined cutting position, and a laser irradiation driving unit 24 moving the laser irradiation unit to the derived stopping position. The limitation of the laser irradiation enabled area is avoided and the predetermined cutting area is preheated reliably by rotating the laser irradiation unit, centering around the spindle.
摘要翻译：解决的问题：为了避免激光照射区域的限制，提高切割效率和便利性。解决方案：切割装置1包括沿着围绕切割驱动单元10的心轴10c围绕的圆周圆形地形成的导轨18，沿着导轨可移动地形成的激光照射单元22，并且用激光照射切割对象30 预定切割位置导出单元26a在预定时间之后导出与通过切割工具10b作为切割区域的预定切割区域相对应的预定切割位置的预定切割位置导出单元26a，导出停止位置的停止位置导出单元26b 位于导轨上的激光照射单元对准导出的预定切割位置，激光照射驱动单元24将激光照射单元移动到导出的停止位置。避免激光照射使能区域的限制，并且通过围绕主轴旋转激光照射单元旋转来预定切割区域的预定。版权所有（C）2013，JPO＆INPIT

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