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1. 发明专利

JPH07146328A BURN-IN BOARD 失效
公开(公告)号：JPH07146328A
公开(公告)日：1995-06-06
申请号：JP29360393
申请日：1993-11-24
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： G01R31/26 , H01L21/326 , H01L21/66 , H01R9/09
摘要： PURPOSE:To reduce the noise interference and cost of a burn-in board used at the time of testing semiconductor devices and to easily manufacture the board. CONSTITUTION:First to fifth substrates 23-27 respectively having lead-out patterns 33 and power supply surfaces on their both surfaces are arranged in a laminating state by dividing the substrates 23-27 into a signal system and power supply system. Then IC sockets 22 are mounted on the first substrate 23 by successively soldering the lead pins 31a-31e of the sockets 22 from the uppermost one in corresponding to the substrates 23-27 and cutting off unnecessary parts from the pins 31a-31e.

2. 发明专利

JPH05290907A 失效
公开(公告)号：JPH05290907A
公开(公告)日：1993-11-05
申请号：JP9615692
申请日：1992-04-16
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： H05K1/14 , H05K3/36 , H01R9/09
摘要： PURPOSE:To eliminate the generation of damage even in the case where the separation of two printed wiring boards after the connection is repeated, and eliminate the trouble to be generated in a relay connector at the time of changing electron parts of the printed wiring board after the connection, and enable the probing test by providing a relay connector for the probing test of a circuit under the connected condition. CONSTITUTION:A connecting pin 3 of the first insulating body 1 side and a connecting pin of the second insulating body 2 side are respectively connected to printed wiring boards A, B, and the boards A, B are positioned and overlapped with each other, and a fitting mechanism 5 is fitted to make junction parts 1b, 2b abut on each other. The relative position of boards A, B, of which circuits are connected through a cable 4, is decided on the basis of the fitting of the fitting mechanism 5 and the abutment of the junction parts 1b, 2b. Even in the case where the separation of two substrate A, B after the connection is repeated, the generation of damage is eliminated, and the probing test of circuit under the connected condition is enabled.

3. 发明专利

JPH0410491A METHOD AND DEVICE FOR DETECTING SOLDER BRIDGE 失效
公开(公告)号：JPH0410491A
公开(公告)日：1992-01-14
申请号：JP10886290
申请日：1990-04-26
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： H05K3/34
摘要： PURPOSE:To detect the area of a solder bridge by adhering an insulating protection sheet, of which many lead terminal holes corresponding to lead terminals are formed, on the back of a printed board and peeling off the insulating protection sheet after soldering when soaking a printed board in a solder tank and fixing the lead terminals projecting from the back of the printed board on the printed board by dip-soldering. CONSTITUTION:An insulating protection sheet 21 is formed by the polyester of polyimide electrically insulating material, for example, taking the heat resistivity of a solder tank into account. The sheet has lead terminal holes 25 corresponding to the lead terminals 15 of an IC socket 13, the sheet is pushed furthest so as to adhere to the soldering side (back) of a printed board 11 under the condition that the lead terminals 15 are inserted into the lead terminal holes 25, then, dip-soldered. When soldering is completed, the insulating protection sheet 21 is peeled down. At that time, if a solder bridge S is generated, the sheet be peeled smoothly.

4. 发明专利

JP2001141780A CONTACT FILM USED FOR DEVICE OF BALL GRID ARRAY STRUCTURE AND DEVICE-MOUNTED STRUCTURE 失效
公开(公告)号：JP2001141780A
公开(公告)日：2001-05-25
申请号：JP32319299
申请日：1999-11-12
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： H01R33/76 , G01R1/04 , G01R31/26 , H01L21/60 , H01L23/12 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To enable confirmation of electrical contact of solder balls to be performed when a device is mounted. SOLUTION: This contact film 30 comes into electrically contact with the ball grid array device having the plural solder balls as external terminals arranged in a grid state. The contact film 30 has a first insulative elastic film (310, 320, 330) including plural contacting opening parts 311 formed in positions corresponding to the solder balls and first contact patters 312 around the opening parts 311 coming into first contact with the solder balls; and a second insulative elastic film 340 laminated on the first insulative elastic film (310, 320, 330), including second contact patterns 341 coming into second contact with the solder balls through the opening parts 311 in positions corresponding to the opening parts 311. The electrical contact of the solder balls can be confirmed on the basis of the presence of conduction between the first and second contact patterns 312, 341.

5. 发明专利

JP2001066345A BURN-IN BOARD OF SEMICONDUCTOR IC 失效
公开(公告)号：JP2001066345A
公开(公告)日：2001-03-16
申请号：JP24226599
申请日：1999-08-27
申请人： FUJITSU LTD
发明人： KOBASHI NAOTO , KUMAZAWA KATSUMI , KITAOKA TOMOKAZU , YOSHIOKA HIROYUKI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To easily and securely suppress noise which is easy to generate, specially, between a socket substrate and an inspection substrate as to the constitution of the burn-in board of a semiconductor IC. SOLUTION: This burn-in board is constituted including a socket substrate 22 on which an IC socket 222 is mounted, an inspection substrate 21 which is sized corresponding to multiple socket substrates, and a connector device 23 connecting the socket substrate 22 and inspection substrate 21. The connector device is composed of a plug connector 235 mounted on the socket substrate and a jack connector 231 mounted on the inspection substrate.

6. 发明专利

JP2001027659A BURN-IN DEVICE AND BURN-IN CONTROL METHOD 失效
公开(公告)号：JP2001027659A
公开(公告)日：2001-01-30
申请号：JP20021399
申请日：1999-07-14
申请人： FUJITSU LTD
发明人： IZURU HITOSHI , YOSHIOKA HIROYUKI , TOMINAGA TOSHIAKI
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To efficiently and accurately execute burn-in even when the total number of semiconductor devices for carrying out burn-in is large. SOLUTION: The burn-in device is composed of burn-in device bodies 10-1 and 10-2, and an independent counter processing terminal 20. Each of the burn-in device bodies 10-1 and 10-2 calculates a modulus being set to the number of a number of fitted semiconductor devices, and at the same time allowing the semiconductor devices to be collectively subjected to burn-in for generating measurement data for indicating the quality of each semiconductor device. The counter processing terminal 20 collectively totals up the modulus and measurement data by each of the plurality of burn-in device bodies 10-1 and 10-2. Then, a failure rate is calculated based on entire modulus being set to the total number of the modulus and the measurement data, and the burn-in of each of the burn-in device bodies 10-1 and 10-2 is collectively stopped when the failure rate is set to a specific value.

7. 发明专利

JPH08330697A PRINTED BOARD 失效
公开(公告)号：JPH08330697A
公开(公告)日：1996-12-13
申请号：JP13821395
申请日：1995-06-05
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI , NAKAMURA HIDEAKI , KITAOKA TOMOKAZU , IZURU HITOSHI
IPC分类号： H05K1/11 , H05K1/14 , H05K3/40 , H01R23/68
摘要： PURPOSE: To provide a small-space and high-density pattern by reducing the height of an function extending device at lower cost, in regard to a printed board on which the pattern of a circuit that comprises mounted components is formed. CONSTITUTION: Around the terminal part 33 of a printed board 31 that comprises a mounting part 32 and the terminal part 33, second terminal parts 36 and 37 are formed with an inserted flexible film pattern parts 34 and 35, the second terminal parts 36 and 37 are connected to external connectors supported by reinforcing rods 38a, 38b, 39a and 39b, and the second terminal parts 36 and 37 are disconnected from them by folding the pattern parts 34 and 35 without the support of the reinforcing rods.

8. 发明专利

JPH01297708A SYSTEM FOR CONTROLLING TRAVEL OF UNMANNED CARRIER 失效
公开(公告)号：JPH01297708A
公开(公告)日：1989-11-30
申请号：JP12933588
申请日：1988-05-26
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： G05D1/02
摘要： PURPOSE:To arrange a travel space at minimum by arranging a guide tape at right angles by detecting the switching point of a car body in a right or a left direction, and turning the car body at right angles at that point. CONSTITUTION:Sensors (11-13) are provided on right, left and central horizontal lines on an unmanned travel body on the rearward of a reflecting type sensor 10. Meanwhile, a guide tape 3 is provided at a travel path, however, the tape 3 is provided at right angles at a part where the travel body is turned to right or left. Thereby, when the sensor 10 detects no travel body and either the right or the left sensor 12 or 13 and the central sensor 11 detect it after the sensor 10 detects the travel body, it is judged that the turning is performed to a direction detected by the right and the left sensors, and at that point, an unmanned travel vehicle is turned at right angles.

9. 发明专利

JP2000193715A TEST BOARD FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000193715A
公开(公告)日：2000-07-14
申请号：JP37480698
申请日：1998-12-28
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI , NARITA MAMORU , KUMAZAWA KATSUMI , TOMINAGA TOSHIAKI , KITAOKA TOMOKAZU , IZURU HITOSHI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To facilitate a testing treatment in a test and to make a test of high reliability regarding a test board, for a semiconductor device, in which a plurality of sockets used to mount the semiconductor device on a printed-circuit board are arranged and installed. SOLUTION: In this test board for a semiconductor device, a plurality of IC sockets 11 which are formed in such a way that every pedestal 15 used to mount the semiconductor device 1 is provided and that contact pins 13 which are electrically connected to leads 2 installed at the semiconductor device 1 are provided are arranged and installed on a printed-circuit board 12. The test board is constituted in such a way that every pedestal 15 is displaced when the semiconductor device 1 is mounted. In addition, the test board is constituted in such a way that the displacement of every pedestal 15 is detected by POGO pins 15, and that the mounting state of the semiconductor device 1 can be recognized.

10. 发明专利

JPH05142295A METHOD FOR BURN-IN TEST AND PATTERN GENERATING CIRCUIT FOR THE TEST 失效
公开(公告)号：JPH05142295A
公开(公告)日：1993-06-08
申请号：JP30495791
申请日：1991-11-20
申请人： FUJITSU LTD
发明人： YOSHIOKA HIROYUKI
IPC分类号： G01R31/26
摘要： PURPOSE:To execute a dynamic burn-in test accurately and at the low cost by supplying separate LSIs with a plurality of active signals different in the timing from one another, respectively. CONSTITUTION:Each LSI is constructed as memory LSI formed of static RAM, and a large number of memory LSIs 1 are arranged on a burn-in board 3. Moreover, such burn-in boards 3 as the above are put together in large numbers and disposed in a high-temperature furnace 4. The LSIs 2 are divided into four groups (A to D) when they are disposed on the burn-in board 3. Chip enable signal lines C1 to C4 and read-write signal lines W2 to W4 forming active signal lines of the burn-in board 3 supply chip enable signals and read-write signals respectively to each of the groups A to D of the LSIs 2. Each chip enable signal and each read-write signal are supplied respectively from a pattern generating board 2 disposed outside the high-temperature furnace 4.

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