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    • 5. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH1012813A
    • 1998-01-16
    • JP16354196
    • 1996-06-25
    • FUJI ELECTRIC CO LTD
    • SHIMIZU TOMIOYAMADA TOSHIFUSAMATSUOKA TADASHI
    • H01L25/07H01L25/18
    • PROBLEM TO BE SOLVED: To improve an insert-ring buried in an attaching hole of a resin case so that stable fixing is provided when a package is screwed to a cooling fin and an appropriate layer thickness of a bonding agent is assured between an enclosing resin case and a metal base plate. SOLUTION: Relating to a semiconductor device wherein, in an attaching hole 4a of an enclosing resin case 4 incorporated with a terminal which is bonded to a metal base plate 1 on which a power semiconductor element is mounted, a metal insert-ring 10 is molded, together with the resin case into one body, the insert-ring 10 is constructed of a drawing metal plate wherein a constriction part 10a is molded at the periphery of its barrel part and a through hole 10b for an attaching screw is punched out at its upper surface, and molded into a hat shape, Its lower and periphery part is insert-molded to the resin case while it is protruded by about 0.2mm, corresponding to the layer thickness of a bonding agent, below the bottom surface of the enclosing resin case.