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    • 3. 发明专利
    • THERMAL TYPE OVER-LOAD RELAY
    • JPH04133227A
    • 1992-05-07
    • JP25448690
    • 1990-09-25
    • FUJI ELECTRIC CO LTD
    • OOGAMI TOSHIKATSUICHIKAWA HARUOAKIIKE KATSUMI
    • H01H61/01
    • PURPOSE:To provide possibility of easily offering a relay embodied in different contact constitution or combination comprising small width and height of cases by coupling a main and an aux. case which dividedly accommodate the mechanism part of contacts and opening/closing, and thereby forming a thermal type over-load relay. CONSTITUTION:When an aux. case 201 is combined with a main case 101 through engaging of detent projections 101a, 101b with detaining holes 202a, 202b, the tip of a slider 109 comes into the aux. case 201 to push a movable contact piece 207b to the position as shown by the dot-and-dash line, and a movable contact 206b in contact with a fixed contact 204b is separated to put it in the a-contact state. At this time, another fixed contact 204a and the fixed contact 206b remain in the b-contact state as they have been. If now an over- current flows through a heat element 102, an opening/closing mechanism is actuated to put a slider 109 into movement, and a prong 109a separates a contact 206a from the fixed contact 204a while another prong 109b returns to its original position, and now the movable contact 206b contacts the fixed contact 204b. Thus opening and closing of the contacts are performed.
    • 7. 发明专利
    • THERMAL TYPE OVERLOAD RELAY
    • JPH0230029A
    • 1990-01-31
    • JP18081188
    • 1988-07-20
    • FUJI ELECTRIC CO LTD
    • AKIIKE KATSUMIOOGAMI TOSHIKATSU
    • H01H61/01H01H61/00
    • PURPOSE:To reduce the size of a controlling board, etc., by disposing a reset lever for reversing and resetting a reverse spring and an adjusting dial for adjusting the performing position of a release lever through an adjusting link at the upper end of a case in parallel relationship. CONSTITUTION:On a side of a heat element 1 disposed correspondingly to a three-phase main circuit is provided a reverse mechanism part 90 comprising a reverse spring 9 formed of a flat spring and adapted to move reversely, and a release lever 3 axially supported by an adjusting link 8. A contact mechanism part 65 driven by the reverse spring 9 is installed on the upper part of the heat element 1, and a reset lever 5 for reversing and resetting the reverse spring 9, and an adjusting dial 4 for adjusting the performing position of a release lever 3 through the adjusting link 8 are disposed on the upper face of a case in parallel relationship, and installation of only a reverse mechanism part 90 on the side of the heat element 1 enables the size of the breadth of a thermal type overload relay to be reduced. Since the size of the breadth of the thermal type overload relay does not exceed that of the width of an electromagnetic contactor, these apparatus can be highly densitied to be contained in a controlling board or the like and thus the controlling board or the like can be made smaller.