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1. 发明专利

JP2003025310A Functional particle board and its manufacturing method 审中-公开
标题翻译：功能颗粒板及其制造方法
公开(公告)号：JP2003025310A
公开(公告)日：2003-01-29
申请号：JP2001217911
申请日：2001-07-18
申请人： Dantani Plywood Co Ltd , 段谷産業株式会社
发明人： TACHIZUKA YUJI
IPC分类号： B27D1/04 , B27K5/00 , B27N3/02 , B32B21/04
摘要： PROBLEM TO BE SOLVED: To provide a functional particle board which is free from release of formalin, adsorbs sufficiently another detrimental volatile organic substance, further has a humidity conditioning property and is excellent also in a design property, and provide its manufacturing method.
SOLUTION: The functional particle board is provided by forming an inorganic layer having a humidity conditioning property and a gas adsorbing property on a front layer. A melamine resin adhesive, an urea resin adhesive, a phenolic resin adhesive and/or an isocyanate resin adhesive is singly or compositely applied on wood material chips for a core layer to make a raw material. Then, inorganic material particles having the humidity conditioning property and the gas adsorbing property in which a binder is blended are sprayed onto either or both of a lower layer and an upper layer of the raw material for the core layer to form a forming mat. Then, it is at least formed by hot pressing.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供不含福尔马林释放的功能性粒子板，充分吸附有害的挥发性有机物质，进一步具有调湿性，在设计性能方面优异，并且提供其制造方法。解决方案：通过在前层上形成具有调湿性和气体吸附性的无机层来提供功能性粒子基板。将三聚氰胺树脂粘合剂，尿素树脂粘合剂，酚醛树脂粘合剂和/或异氰酸酯树脂粘合剂单独或复合地涂覆在用于芯层的木材芯片上以制备原料。然后，将具有调湿性和粘合剂的气体吸附性的无机材料颗粒喷涂到用于芯层的原料的下层和上层中的任一个或两个上，以形成成型垫。然后，至少通过热压形成。

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