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    • 1. 发明专利
    • Metal film production device, and metal film production method
    • 金属膜生产装置和金属膜生产方法
    • JP2009191365A
    • 2009-08-27
    • JP2009068220
    • 2009-03-19
    • Canon Anelva Corpキヤノンアネルバ株式会社
    • HORI KEIICHIIRIE TAKAYUKINOGUCHI HIRONORISATAKE KOJISAKAMOTO HITOSHI
    • C23C16/448H01L21/28H01L21/285
    • PROBLEM TO BE SOLVED: To provide a metal film production device and a metal film production method by which a film to be deposited is excellent in film thickness uniformity.
      SOLUTION: A substrate 3 is installed in a chamber 1, a gaseous starting material comprising halogens is fed to the vicinity of a metallic member 11 arranged at the inside of the chamber 1, further, plasma 15 of the gaseous starting material is generated, so as to produce the radicals of the halogens, by the radicals of the halogens, the metallic material 11 is etched, so as to produce a precursor 16 composed of the metallic components comprised in the metallic member and the halogens, and the temperature of the substrate 3 is controlled to the one lower than the metallic member 11. Further, the temperature distribution in the plane of the substrate 3 is made lower at the peripheral part and is made higher at the central part, a precursor 16 is adsorbed on the substrate 3, and further, the adsorbed precursor 16 is reduced by the radicals of the halogens, so as to produce a metal film.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种金属膜制造装置和金属膜制造方法,通过该方法,待沉积的膜的膜厚度均匀性优异。 解决方案:将基板3安装在室1中,将含有卤素的气态原料供给到设置在室1内部的金属构件11的附近,气态原料的等离子体15为 产生卤素原子,通过卤素的自由基蚀刻金属材料11,从而制成由金属构件和卤素中所含的金属成分构成的前体16,温度 将基板3的温度分布控制在比金属部件11低的位置。此外,基板3的平面内的温度分布在周边部分变低,在中心部分变得更高,前体16被吸附在 基板3,并且进一步地,吸附的前体16被卤素的自由基还原,以便产生金属膜。 版权所有(C)2009,JPO&INPIT