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1. 发明专利

JP2007103545A Connection structure and method of manufacturing same 有权
标题翻译：连接结构及其制造方法
公开(公告)号：JP2007103545A
公开(公告)日：2007-04-19
申请号：JP2005289524
申请日：2005-10-03
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： H01L21/60 , H05K1/18 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a connection structure excellent in low connective resistance, high insulation reliability, and microcircuit connectivity.
SOLUTION: The connection structure is constituted such that LSI chips wherein the connection bumps are allocated to the chip peripheral part are connected to a connection substrate by an anisotropic conductive film consisting of at least curing agent and insulating resin with hardenability and conductive particles. The standard deviation of the number of conductive particles existing in the connection part for connection bumps is smaller than the larger one of either 10% or less of the average number of conductive particles existing in this connection part or 2. Furthermore, in the connection structure, 93% or more of the number of conductive particles existing in the inside part for connection bumps is independent, and existing in the surface side of the connection substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供低连接电阻，高绝缘可靠性和微电路连接性优异的连接结构。解决方案：连接结构构成为使得连接凸块分配给芯片周边部分的LSI芯片通过至少由固化剂和具有淬透性的绝缘树脂组成的各向异性导电膜和导电颗粒连接到连接基板。存在于用于连接凸块的连接部分中的导电粒子的数量的标准偏差小于存在于该连接部分或2中的导电粒子的平均数的10％以下中的较大者。此外，在连接结构存在于用于连接凸块的内部部分中的导电颗粒数量的93％以上是独立的，并且存在于连接基板的表面侧。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006299177A Anisotropically conductive adhesive sheet and fine connection structure 有权
标题翻译：各向异性粘合片和细小结构
公开(公告)号：JP2006299177A
公开(公告)日：2006-11-02
申请号：JP2005126133
申请日：2005-04-25
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , H01B5/16 , H01B13/00 , H01R11/01 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropically conductive adhesive sheet which has low connection resistance, high insulation reliability and excellent fine circuit connectability.
SOLUTION: This anisotropically conductive adhesive sheet comprising at least a curing agent, a curable insulated resin 1, and insulated coated conductive particles which have insulated coating films 2 on the conductive particles 5 is characterized in that one part or all parts of the insulated coated conductive particles on one side of the anisotropically conductive adhesive sheet are partially exposed; one part or all parts of the insulated coated conductive particles having partially exposed portions are partially insulated coated conductive particles 6 which have insulated coating 2-free surface portions on the exposed portions; and the average particle distance between the adjacent insulated coated conductive particles is one to five times the average particle diameter of the insulated coated conductive particles.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有低连接电阻，高绝缘可靠性和优异的精细电路连接性的各向异性导电粘合片。解决方案：包括至少一种固化剂，可固化绝缘树脂1和在导电颗粒5上具有绝缘涂膜2的绝缘涂覆导电颗粒的各向异性导电粘合片的特征在于，其中的一部分或全部部分在各向异性导电粘合片的一侧上的绝缘涂覆的导电颗粒被部分地暴露; 具有部分暴露部分的绝缘涂覆的导电颗粒的一部分或全部是部分绝缘的涂覆导电颗粒6，其在暴露部分上具有绝缘涂层2自由表面部分; 并且相邻的绝缘被覆导电粒子之间的平均粒子间隔为绝缘被覆导电粒子的平均粒径的1〜5倍。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005071817A Anisotropic conductive film 审中-公开
标题翻译：各向异性导电膜
公开(公告)号：JP2005071817A
公开(公告)日：2005-03-17
申请号：JP2003300393
申请日：2003-08-25
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： MATSUURA KOUYA , OTANI AKIRA
IPC分类号： C09J7/00 , C09J9/02 , C09J11/04 , C09J201/00 , H01B5/00 , H01B5/16 , H01B13/00 , H01R11/01 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film having high mechanical strength and high reliability without impairing a connection characteristic.
SOLUTION: This anisotropic conductive film is composed by dispersing conductive particles in an organic binder constituent comprising at least a thermosetting resin, a setting agent, and a film-forming resin. Gelatinized thermoplastic fine particles of 1 to 20 parts by mass are mixed in 100 parts by mass of the organic binder constituent.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有高机械强度和高可靠性而不损害连接特性的各向异性导电膜。解决方案：该各向异性导电膜通过将导电粒子分散在至少包含热固性树脂，固化剂和成膜树脂的有机粘合剂成分中而构成。在100质量份有机粘合剂成分中混合1〜20质量份的明胶化热塑性微粒。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2008238280A Abrasive particle transfer sheet and precision grinding tool 审中-公开
标题翻译：磨料颗粒转移片和精密研磨工具
公开(公告)号：JP2008238280A
公开(公告)日：2008-10-09
申请号：JP2007078284
申请日：2007-03-26
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA , MATSUIDE DAISUKE
IPC分类号： B24D11/00 , B24D3/00
摘要： PROBLEM TO BE SOLVED: To provide an abrasive particle transfer sheet with excellent low-scratching property, precision grinding property, and grinding chip discharging property. SOLUTION: This abrasive particle transfer sheet transfers abrasive particles on a grinding face of a grinding tool, and comprises a support, an adhesive layer formed on a surface of the support, and abrasive particles adhered on a surface of the adhesive layer. In this sheet, the abrasive particles are aligned so that an average particle interval between the adjacent abrasive particles becomes 0.5-10 times of an average particle size of the abrasive particles. The abrasive particles are transferred and fixed on the support using the sheet, so as to obtain a precision grinding tool having a structure that the abrasive particles are aligned. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的低刮擦性，精密研磨性和研磨屑排出性的磨料颗粒转印片。解决方案：该磨料颗粒转印片将磨料颗粒转移到研磨工具的磨削面上，并且包括支撑体，形成在支撑体的表面上的粘合剂层和粘附在粘合剂层的表面上的磨料颗粒。在该片材中，磨料颗粒被排列成使得相邻磨料颗粒之间的平均颗粒间隔成为磨料颗粒的平均粒度的0.5-10倍。磨料颗粒使用片材转移并固定在载体上，以获得具有磨料颗粒排列的结构的精密研磨工具。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2007232627A Anisotropic conductive film for inspecting minute circuit 有权
标题翻译：用于检查分电路的各向异性导电膜
公开(公告)号：JP2007232627A
公开(公告)日：2007-09-13
申请号：JP2006056333
申请日：2006-03-02
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： G01R1/06 , G01R31/26 , H01B5/16 , H01B13/00 , H01R11/01 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film for inspecting a minute circuit capable of inspection at low connection load by coping with minute wiring of 40 μ or less and enabling repeating use.
SOLUTION: In the anisotropic conductive film for inspecting the minute circuit, a support base material including an insulation resin is penetrated in a thickness direction in a state where a plurality of conductive particles are mutually insulated, each conductive particle is in the form of a substantial sphere having a projection part projected from the front face and the rear face of the support base substance. An average particle diameter of the conductive particle is 5-40 μm, a maximum particle diameter is 5-50 μm, and an average interval between the conductive particles is 0.5-5 times of the average particle diameter of the conductive particle.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种各向异性导电膜，用于通过应对40μ或更小的微细布线来检查能够在低连接负载下检查的微小回路，并且能够重复使用。解决方案：在用于检查微小电路的各向异性导电膜中，在多个导电颗粒相互绝缘的状态下，包括绝缘树脂的支撑基材在厚度方向上穿透，每个导电颗粒为具有从支撑基体的前表面和后表面突出的突出部分的实质球体。导电粒子的平均粒径为5-40μm，最大粒径为5-50μm，导电粒子的平均间隔为导电性粒子的平均粒径的0.5〜5倍。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007048687A Conductive particle transcription sheet, and connection structure 有权
标题翻译：导电颗粒转录片及连接结构
公开(公告)号：JP2007048687A
公开(公告)日：2007-02-22
申请号：JP2005234082
申请日：2005-08-12
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： H01R11/01 , H01L21/60 , H01R43/00
CPC分类号： H01L2224/13609 , H01L2224/29409 , H01L2924/01079 , H01L2924/01322
摘要： PROBLEM TO BE SOLVED: To provide a conductive particle transcription sheet provided with low connection resistance, high insulation reliability, and superior micro-circuit connectivity.
SOLUTION: This is the conductive particle transcription sheet to transcribe the conductive particles onto a connection face of a connection terminal, consisting of a support, an adhesive layer formed on the surface of the support, and the conductive particles adhered to the surface of the adhesive layer. By using the conductive particle transcription sheet in which the conductive particles are arranged and aligned for the purpose that the average particle spacing between the adjacent conductive particles becomes 0.3 to 5 times the average particle diameter of the conductive particles, the conductive particles are transcribed onto the connection face of the connection terminal of electronic parts, and a connection structure is obtained by connecting the connection face of the connection terminal onto which the conductive particles have been transcribed to the connection face of other connection terminals.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有低连接电阻，高绝缘可靠性和优异的微电路连接性的导电颗粒转印片。解决方案：这是将导电颗粒转录到连接端子的连接面上的导电颗粒转印片，该连接端由支撑体，形成在支撑体表面上的粘合剂层和附着在表面上的导电颗粒组成的粘合剂层。通过使用其中导电颗粒被排列和排列的导电颗粒转印片，用于相邻导电颗粒之间的平均颗粒间隔成为导电颗粒的平均粒径的0.3至5倍，导电颗粒被转录到电子部件的连接端子的连接面，连接结构体是将导体粒子已被转印的连接端子的连接面与其他连接端子的连接面连接起来的。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006335910A Anisotropically conductive adhesive sheet and fine connecting structure 有权
标题翻译：各向异性导电胶片和细小的连接结构
公开(公告)号：JP2006335910A
公开(公告)日：2006-12-14
申请号：JP2005163407
申请日：2005-06-03
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： C09J7/00 , C09J7/02 , C09J9/02 , C09J11/00 , C09J201/00 , H01B5/16 , H01B13/00 , H01R11/01 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropically conductive adhesive sheet excellent in low connection resistance, high reliability for insulation and fine circuit connecting property. SOLUTION: The anisotropically conductive adhesive sheet is composed of at least a curing agent, a curable insulating resin, conductive particles and insulating particles. In the anisotropically conductive adhesive sheet, ≥90% conductive particles and ≥90% insulating particles each exists in a region within the range of 2.0 times of average particle diameter of conductive particles in the thickness direction from the one side surface of the anisotropically conductive adhesive sheet and ≥90% conductive particles exist without coming into contact with other conductive particles and average particle interval between adjacent conductive particles is ≥0.5 time and ≤5 times of average particle diameter of the conductive particles and average particle diameter of the insulating particles is smaller than that of the conductive particles. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的低连接电阻，高绝缘可靠性和精细电路连接性能的各向异性导电粘合片。解决方案：各向异性导电粘合片由至少一种固化剂，可固化绝缘树脂，导电颗粒和绝缘颗粒组成。在各向异性导电性粘合片中，各向异性导电性粘合剂的一个侧面的厚度方向上的导电性粒子的平均粒径的2.0倍以内的区域中，存在≥90％的导电性粒子和≥90％的绝缘性粒子存在片状和≥90％的导电粒子而不与其他导电粒子接触，相邻导电粒子之间的平均粒子间隔为导电粒子的平均粒径的≥0.5倍和≤5倍，绝缘粒子的平均粒径越小比导电颗粒的厚度大。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005197032A Anisotropic conductive film 审中-公开
标题翻译：各向异性导电膜
公开(公告)号：JP2005197032A
公开(公告)日：2005-07-21
申请号：JP2004000610
申请日：2004-01-05
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： MATSUURA KOUYA , OTANI AKIRA
IPC分类号： B32B27/08 , H01B5/16 , H01B13/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film excellent in low temperature hardening property, continued reliability, and film preservation property.
SOLUTION: On the anisotropic conductive film having two layers, a first layer has at least a film forming resin and a thermosetting resin, and the glass transition temperature of the film forming resin in the first layer is not less than 80°C. The second layer has at least a film forming resin and a curing agent, and the glass transition temperature of the film forming resin in the second layer is -20 to 65°C.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供低温硬化性优异，可靠性和保鲜性优异的各向异性导电膜。解决方案：在具有两层的各向异性导电膜上，第一层至少具有成膜树脂和热固性树脂，第一层中的成膜树脂的玻璃化转变温度不低于80℃ 。第二层至少具有成膜树脂和固化剂，第二层中的成膜树脂的玻璃化转变温度为-20至65℃。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005089530A Anisotropic conductive composition 审中-公开
标题翻译：各向异性导电组合物
公开(公告)号：JP2005089530A
公开(公告)日：2005-04-07
申请号：JP2003321920
申请日：2003-09-12
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： MATSUURA KOUYA , OTANI AKIRA
IPC分类号： C08L101/00 , C08K5/00 , C08K9/04 , H01B5/16 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive composition excellent in productivity, detailed connectability and insulation between adjacent terminals.
SOLUTION: The anisotropic conductive composition comprises at least conductive particles, a thermosetting resin and a curing agent. The conductive particles are present in soft-shell compounded conductive particles, wherein the soft-shell compounded conductive particles have the average particle size of 2-100 times that of the conductive particles therein.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2007035897A Circuit adhesive sheet and fine connection structure 有权
标题翻译：电路胶带和细微连接结构
公开(公告)号：JP2007035897A
公开(公告)日：2007-02-08
申请号：JP2005216630
申请日：2005-07-27
申请人： Asahi Kasei Electronics Co Ltd , 旭化成エレクトロニクス株式会社
发明人： OTANI AKIRA
IPC分类号： H01L21/52 , C09J7/02 , H01L21/60 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable circuit adhesive sheet which is excellent in connection property at a low temperature for a short time.
SOLUTION: The circuit adhesive sheet consists of at least a curing agent and a curing insulating resin. The concentration of a curing agent in a region within one third times the sheet thickness along a thickness direction from one side surface of the circuit adhesive sheet is in the range of 1.1 to 10 times the average concentration of other region. The circuit adhesive sheet allows conductive particle to be mixed, and is obtained by transferring a solid curing agent which exists dispersed to a transfer medium surface to an adhesive sheet comprising at least curing insulating resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在短时间内在低温下连接性优异的高可靠性电路粘合片。解决方案：电路粘合片至少由固化剂和固化绝缘树脂组成。在电路粘合片的一个侧面沿着厚度方向的1/3厚度的区域中的固化剂的浓度在其他区域的平均浓度的1.1〜10倍的范围内。电路粘合片允许导电颗粒混合，并且通过将分散在转印介质表面中的固体固化剂转移到至少包含固化绝缘树脂的粘合片而获得。版权所有（C）2007，JPO＆INPIT

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