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1. 发明专利

JP2012063723A Lens unit and method of manufacturing lens unit 有权
标题翻译：透镜单元及制造透镜单元的方法
公开(公告)号：JP2012063723A
公开(公告)日：2012-03-29
申请号：JP2010209978
申请日：2010-09-17
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： G02B7/02
摘要： PROBLEM TO BE SOLVED: To solve the problem of the conventional lens unit in which: a resin hardens and shrinks after a lens part is molded and that it is difficult to obtain a desired shape of the lens part when a thermosetting transparent resin such as a silicon resin is used for the lens part, although the conventional lens unit has an advantage such as excellent heat resistance compared with a thermoplastic resin since the lens part is formed by the thermosetting transparent resin such as the silicon resin.SOLUTION: The lens unit comprises the lens part, a frame holding the lens part, and a plurality of coupling parts being extended from the lens part to the inside of the frame. The lens part and the coupling parts are made of the same material which is the thermosetting transparent resin.
摘要翻译：解决的问题：为了解决传统的透镜单元的问题，其中：在透镜部件被模制之后树脂硬化和收缩，并且当热固性透明树脂例如硅树脂用于透镜部分，虽然传统的透镜单元具有与热塑性树脂相比优异的耐热性的优点，因为透镜部分由诸如硅树脂的热固性透明树脂形成。解决方案：透镜单元包括透镜部分，保持透镜部分的框架，以及从透镜部分延伸到框架内部的多个联接部件。透镜部分和耦合部分由与热固性透明树脂相同的材料制成。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2010156779A Method for manufacturing optical waveguide and optical waveguide forming mold 有权
标题翻译：制造光波导和光波形成模具的方法
公开(公告)号：JP2010156779A
公开(公告)日：2010-07-15
申请号：JP2008334148
申请日：2008-12-26
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI , TAKAHASHI KOICHI
IPC分类号： G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide a method for readily and highly efficiently manufacturing a desired optical waveguide, and to provide a core part forming mold which is suitable for the execution of the method. SOLUTION: The optical waveguide forming mold includes a mold body 1 and first and second sliders 2 and 3, provided freely slidably with respect to the mold body 1. A recessed groove 4, corresponding to the core part of the optical waveguide, is formed in the principal surface of the mold body 1, and a resin supply path 5 and an air discharge path 6, one end of each of the paths 5 and communicating with each end portion of the recessed groove 4, are formed in the side surfaces facing both end portions of the recessed groove 4 of the mold body 1. Furthermore, a first slider penetrating hole 7, crossing the resin supply path and a second slider penetrating hole 8 crossing the air discharge path are formed in other side surfaces of the mold body 1; then the first and second sliders 2 and 3 are inserted freely slidably into the holes. The side surfaces of the sliders 2 and 3 constitute the end portions of the recessed portion 4. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种容易且高效地制造期望的光波导的方法，并且提供适于执行该方法的芯部形成模具。解决方案：光波导形成模具包括模具本体1和相对于模具主体1自由滑动地设置的第一和第二滑块2和3。对应于光波导的芯部的凹槽4，形成在模具主体1的主表面上，并且树脂供给路径5和空气排出路径6，每个路径5的一端与凹槽4的每个端部连通，形成在侧面面对模具体1的凹槽4的两端部的表面。此外，与树脂供给路径交叉的第一滑块贯通孔7和与空气排出路径交叉的第二滑块贯通孔8形成在模体1; 那么第一和第二滑块2和3可自由滑动地插入孔中。滑块2和3的侧表面构成凹部4的端部。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010021163A Through electrode circuit substrate and forming method thereof 审中-公开
标题翻译：通过电极电路基板及其形成方法
公开(公告)号：JP2010021163A
公开(公告)日：2010-01-28
申请号：JP2006299252
申请日：2006-11-02
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： H05K1/11 , H05K3/18 , H05K3/40 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a through electrode circuit substrate in which air tightness between the substrate and a copper-plating film as a conductor is improved, and also to provide a forming method thereof.
SOLUTION: The through electrode circuit substrate has a through electrode 9 formed by inserting a metal conductor 8 into a through-hole 2, wherein the through-hole 2 has an electroless copper-plated film 6 formed on the inner wall surface subjected to smoothing processing by etching.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过电极电路基板，其中基板和作为导体的镀铜膜之间的气密性得到改善，并且还提供了其形成方法。解决方案：贯通电极电路基板具有通过将金属导体8插入通孔2而形成的通孔9，其中通孔2具有形成在内壁表面上的化学镀铜膜6 通过蚀刻来平滑处理。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010003744A Manufacturing method of light-emitting element 审中-公开
标题翻译：发光元件的制造方法
公开(公告)号：JP2010003744A
公开(公告)日：2010-01-07
申请号：JP2008159162
申请日：2008-06-18
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： H01L33/32 , H01L21/302
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-emitting element, capable of effectively utilizing the light emitted from a luminescent layer and improves the luminous efficiency of the light-emitting element. SOLUTION: In a light-emitting element 1, an LED operation layer 3 is laminated on a surface of a semiconductor substrate 2. The LED operation layer 3 includes at least a first contact layer 4, the luminescent layer 5 and a second contact layer 6, by laminating them, in the order starting from the semiconductor substrate 2 side. The LED operation layer 3, further, includes a space layer 12 which extends in a direction (direction parallel to the surface direction of the LED operation layer), orthogonal to the thickness direction in the first contact layer 4, in addition to a two-dimensional diffraction grating 10A comprising a plurality of recessed parts 11A. The space layer 12 is formed, by bringing a fluid light-absorbing substance into contact with a side face of the first contact layer 4, and conducting laser etching by emitting laser light from the opposite side thereof. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种发光元件的制造方法，能够有效地利用从发光层发出的光，并提高发光元件的发光效率。解决方案：在发光元件1中，在半导体衬底2的表面层叠LED操作层3.LED工作层3至少包括第一接触层4，发光层5和第二接触层5。接触层6以从半导体衬底2侧开始的顺序层叠它们。此外，LED工作层3还具有与第一接触层4的厚度方向正交的方向（与LED工作层的面方向平行的方向）延伸的空间层12，包括多个凹部11A的三维衍射光栅10A。通过使流体光吸收物质与第一接触层4的侧面接触而形成空间层12，并且通过从其相对侧发射激光来进行激光蚀刻。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2006291315A Electroless plating method and method for manufacturing circuit board 审中-公开
标题翻译：电镀方法及制造电路板的方法
公开(公告)号：JP2006291315A
公开(公告)日：2006-10-26
申请号：JP2005115526
申请日：2005-04-13
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： C23C18/30 , C23C18/20 , C23C18/31 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To form an electroless-plated film superior in adhesiveness on the surface of a resin substrate.
SOLUTION: This electroless plating method comprises the steps of: irradiating the surface of the resin substrate 1 with an electron beam to produce a radical on the surface of the resin substrate 1; graft-polymerizing a monomer having a double bond with the radical produced on the surface of the resin-based substrate 1 and forming the graft-polymerized chain 4 on the surface of the resin substrate 1; introducing an ion-exchange group 5 into the graft-polymerized chain 4; imparting a catalyst 6 to the ion-exchange group 5; and forming the electroless-plated film 7 on a part having the catalyst 6 imparted on the resin substrate 1.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：形成在树脂基板的表面上具有优异的粘合性的无电解电镀膜。解决方案：该无电镀方法包括以下步骤：用电子束照射树脂基板1的表面，以在树脂基板1的表面上产生自由基; 在树脂基基板1的表面上产生的自由基与双键的单体接枝聚合，并在树脂基板1的表面上形成接枝聚合链4; 将离子交换基团5引入接枝聚合链4中; 将催化剂6赋予离子交换基团5; 在具有赋予树脂基板1的催化剂6的部分上形成无电解电镀膜7.版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2004216256A Steam treatment apparatus 有权
标题翻译：蒸汽处理设备
公开(公告)号：JP2004216256A
公开(公告)日：2004-08-05
申请号：JP2003005904
申请日：2003-01-14
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： WATABE HIROYA , MIMORI KENICHI , ITO TAKUO
IPC分类号： B08B3/02 , B08B3/10 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a steam treatment apparatus at low cost capable of preventing a deposition substance removed from an article to be treated from being re-deposited on the article to be treated and reducing an exhaust amount.
SOLUTION: The steam treatment apparatus is provided with a steam treatment part 10 comprising a vapor spraying nozzle 2 for spraying vapor G
1 for steam treatment toward the article A to be treated; an exhaust mechanism 5 provided near the vapor spraying nozzle 2 and discharging at least a part of the vapor G
2 after applied to the steam treatment to the outside the system of the steam treatment; and a cooling mechanism 6 for cooling the vapor G
2 after the steam treatment. A flow passage 15 permissible with a condensate L
2 of the vapor cooled and condensed by the cooling mechanism 6 is formed in a gap of the surface of the article A to be treated and the steam treatment part 10.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种低成本的蒸汽处理装置，能够防止从待处理物品上除去的沉积物质再沉积在待处理物品上并减少排气量。蒸汽处理装置设置有蒸汽处理部10，蒸汽处理部10包括用于蒸汽处理的蒸气G 1 的蒸气喷嘴2朝向待处理的物品A; 设置在蒸气喷射喷嘴2附近并在施加到蒸汽处理之后将至少一部分蒸气G SB SB 2 2排出到蒸汽处理系统的排气机构5; 以及用于在蒸汽处理之后冷却蒸汽G 2 的冷却机构6。通过冷却机构6冷却和冷凝的蒸汽的冷凝物L 2 允许的流路15形成在待处理制品A的表面和蒸汽处理部分10的间隙中。版权所有（C）2004，JPO＆NCIPI

7. 发明专利

JP2004209440A Ultrasonic cleaning apparatus and method for ultrasonic cleaning 有权
公开(公告)号：JP2004209440A
公开(公告)日：2004-07-29
申请号：JP2003002279
申请日：2003-01-08
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： HAGA NOBUAKI , MIMORI KENICHI
IPC分类号： B08B3/12 , B06B1/06 , B08B3/04
摘要： PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning apparatus capable of efficiently utilizing ultrasound, cleaning with a small amount of a cleaning liquid, and contributing to downsizing of the apparatus.
SOLUTION: The ultrasonic cleaning apparatus 10 can provide an ultrasonic wave with almost no attenuation to the cleaning liquid 27 and can strongly provide an ultrasonic vibration to the cleaning liquid 27 by an ultrasonic vibration unit 15 which is directly mounted on a cleaning drum 14 and is rotated together therewith. For the ultrasonic vibration unit 15, it is unnecessary to use a large output in consideration of attenuation, and the cleaning liquid 27 can be vibrated efficiently and with a small amount of electric power consumption by ultrasonic vibration. In addition, as the ultrasonic vibration unit 15 is directly mounted on the cleaning drum 14, it is unnecessary to use a liquid and an outer tank for transmitting the ultrasonic vibration to the surrounding of the cleaning drum 14, and it is therefore possible to remarkably perform size reduction and weight reduction of the ultrasonic cleaning apparatus 10.
COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2003081423A Device for wet treatment, and system for wet treatment 有权
标题翻译：湿处理设备和湿处理系统
公开(公告)号：JP2003081423A
公开(公告)日：2003-03-19
申请号：JP2001274245
申请日：2001-09-10
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： B08B3/04 , B08B3/12 , B65G49/02 , C23F1/08 , G02B1/10
摘要： PROBLEM TO BE SOLVED: To provide a device for wet treatment, which is small in size and requires a small occupied area of a device, capable of treating a treated object uniformly with a small quantity of treatment liquid, and treating the treated object continuously without degrading throughput.
SOLUTION: A supply port 11, and a discharge port 12 of wet treatment liquid 5 are provided on a tubular member 1, and a stay part 33 of the treatment liquid 5 is formed in a clearance in the member. A liquid level contacting with the atmosphere on an outer periphery of the stay part 33 is controlled to be in a predetermined position by adjusting a pressure of the treatment liquid 5 in the stay part 33 by using a pressure adjusting means. The treated object 2 is sequentially conveyed to the stay part 33, and is carried out after the wet treatment.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种尺寸小且需要小的占用面积的湿处理装置，能够用少量的处理液均匀地处理被处理物体，并且连续地处理被处理物体而没有降低吞吐量解决方案：在管状构件1上设置有供给口11和湿式处理液5的排出口12，处理液5的滞留部33在构件上形成间隙。通过使用压力调节装置调节停留部33中的处理液5的压力，将与支撑部33的外周面的大气接触的液面控制在规定位置。处理对象物2依次传送到滞留部33，在湿处理后进行。

9. 发明专利

JP2014217122A 高分子アクチュエータデバイスシステム及びその製造方法有权
标题翻译：聚合物致动器装置系统及其制造方法
公开(公告)号：JP2014217122A
公开(公告)日：2014-11-17
申请号：JP2013090831
申请日：2013-04-24
申请人：アルプス電気株式会社 , Alps Electric Co Ltd
发明人： MIMORI KENICHI
IPC分类号： H02N11/00
CPC分类号： H02N11/00
摘要：【課題】高分子アクチュエータの封止を確実に行うことができる高分子アクチュエータデバイスシステム及びその製造方法を提供することを目的とする。【解決手段】高分子アクチュエータデバイスシステムS11は、電解質層11と電解質層11の厚さ方向の両面に設けられた一対の電極層12とを有した高分子アクチュエータ13と、高分子アクチュエータ13と併設された接続部材17と、接続部材17の厚さ方向の両面と接するように配置され、一対の電極層12のそれぞれと電気的に接続された1対の端子部材19と、高分子アクチュエータ13と端子部材19と接続部材17とを全体的に包み込むように被覆する封止部材15と、を備え、端子部材19が、接続部材17に対応する部分にパッド電極部19pを有し、封止部材15には、パッド電極部19pに対応する部分に貫通孔15hが設けられていることを特徴としている。【選択図】図4
摘要翻译：要解决的问题：提供一种能够可靠地密封聚合物致动器的聚合物致动器装置系统和用于制造聚合物致动器装置系统的方法。解决方案：聚合物致动器装置系统S11包括：聚合物致动器13，其包括电解质层11和电解质层11的厚度方向的两面设置的一对电极层12; 以及与聚合物致动器13一起设置的连接构件17; 一对端子构件19，被设置为与连接构件17的厚度方向的两个表面接触并且电连接到该对电极层12中的每一个; 以及密封构件15，其被覆盖，使得聚合物致动器13，端子构件19和连接构件17被完全包围。每个端子构件19在对应于连接构件17的部分处具有焊盘电极部分19p，并且密封构件15在对应于焊盘电极部分19p的部分处设置有通孔15h。

10. 发明专利

JP2012123168A Fiber array element and method for manufacturing fiber array element 审中-公开
标题翻译：纤维阵列元件和制造纤维阵列元件的方法
公开(公告)号：JP2012123168A
公开(公告)日：2012-06-28
申请号：JP2010273512
申请日：2010-12-08
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： MIMORI KENICHI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To solve such a problem that the known fiber array element requires an optical fiber array substrate with V-shaped groove for disposing optical fibers in parallel, thereby becoming impossible to miniaturize the fiber array element.SOLUTION: This fiber array element includes: a plastic optical fiber array disposed with a plurality of optical fibers, in parallel, that have perpendicular end faces to the extending direction; and a resin mirror section integrally formed so as to come into contact with the end face of the plastic optical fiber array and having a mirror surface capable of reflecting light emitted from the end faces of the plurality of optical fibers.

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