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1. 发明专利

JP2014218714A Ｓｎ合金めっき装置およびＳｎ合金めっき方法有权
标题翻译： Sn合金镀层装置和Sn合金镀层方法
公开(公告)号：JP2014218714A
公开(公告)日：2014-11-20
申请号：JP2013099722
申请日：2013-05-09
申请人：株式会社荏原製作所 , Ebara Corp
发明人： SHIMOYAMA TADASHI , ARAKI YUJI , TAMURA MASAMICHI , MIYAGAWA TOSHIKI
IPC分类号： C25D21/14 , C25D17/00 , C25D21/12 , C25D21/18
CPC分类号： C25D21/18 , C25D3/60 , C25D17/002 , C25D17/10
摘要：【課題】めっき液中のSnイオン濃度の調整を容易に行うことができるSn合金めっき装置を提供する。【解決手段】Sn合金めっき装置は、Sn合金めっき液中に不溶性アノード2と基板Wとを浸漬させるめっき槽1と、Snアノード70が配置されるアノード室66とカソード74が配置されるカソード室68とを隔離するアニオン交換膜78を有するSn溶解槽62と、アノード室66およびカソード室68に純水を供給する純水供給機構102と、アノード室66およびカソード室68にメタンスルホン酸を含むメタンスルホン酸溶液を供給するメタンスルホン酸溶液供給機構103と、アノード室66で生成された、Snイオンおよびメタンスルホン酸を含むSn補充液をめっき槽1に供給するSn補充液供給機構82とを備えている。【選択図】図1
摘要翻译：要解决的问题：提供一种能够容易地调节镀液中Sn离子浓度的Sn合金镀覆装置。溶液：Sn合金镀覆装置包括：不溶性阳极2和基材W浸渍在Sn合金中的镀槽1 电镀液; 具有阴极交换膜78的Sn溶解槽62，阴离子交换膜78分离设置有Sn阳极70的阳极室66和阴极74配置的阴极室68; 纯水供给机构102，其向阳极室66和阴极室68提供纯水; 向阳极室66和阴极室68供给含有甲磺酸的甲磺酸溶液的甲磺酸溶液供给机构103; 以及在阳极室66中产生的含有Sn离子的Sn补充液和甲磺酸的Sn补充液供给机构82。

2. 发明专利

JP2013237894A Plating apparatus and plating solution management method 有权
标题翻译：电镀设备和电镀解决方案管理方法
公开(公告)号：JP2013237894A
公开(公告)日：2013-11-28
申请号：JP2012111115
申请日：2012-05-15
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ARAKI YUJI , SHIMOYAMA TADASHI
IPC分类号： C25D21/14 , C25D21/12
CPC分类号： C25D21/22 , C25D3/30 , C25D3/60 , C25D17/001 , C25D17/008 , C25D21/12 , C25D21/14
摘要： PROBLEM TO BE SOLVED: To allow use of a plating solution for a longer period of time by performing plating while controlling a concentration of free acid in the plating solution within a preferable range.SOLUTION: A plating apparatus includes: a plating bath 10 for retaining a plating solution therein, the substrate W being immersed in the plating solution in a position opposite to an insoluble anode 12; a plating solution dialysis line 48 for circulating the plating solution by extracting the plating solution from the plating bath 10 and returning the plating solution to the plating bath 10; a dialysis cell 42 provided in the plating solution dialysis line 48 and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer 62 connected to the plating bath 10 to measure a concentration of free acid in the plating solution; and a controller 70 for controlling a flow rate of the plating solution flowing through the plating solution dialysis line 48 based on the analysis value of the concentration of the free acid measured by the free acid concentration analyzer 62.
摘要翻译：要解决的问题：通过在优选的范围内将电镀液中的游离酸的浓度控制在一定范围内，通过进行电镀而允许使用电镀液更长时间。解决方案：电镀设备包括：镀浴10，用于保持电镀溶液，将基板W浸渍在与不溶性阳极12相反的位置的电镀液中; 电镀液透析线48，用于通过从镀浴10中提取电镀溶液并使电镀液返回到电镀槽10来循环电镀液; 设置在所述电镀液透析线48中，并且通过使用阴离子交换膜透析从所述电镀液中除去游离酸的透析池42; 与镀液10连接的游离酸浓度分析仪62，测定电镀溶液中游离酸的浓度; 以及控制器70，用于基于由游离酸浓度分析仪62测量的游离酸浓度的分析值来控制流过电镀液透析线48的电镀液的流量。

3. 发明专利

JP2009046724A Energizing belt for anode holder, and anode holder 有权
标题翻译：阳极支架和阳极支架的能量带
公开(公告)号：JP2009046724A
公开(公告)日：2009-03-05
申请号：JP2007213521
申请日：2007-08-20
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YAHAGI MITSUTOSHI , ABE KENICHI , ARAKI YUJI , MINAMI YOSHIO , NAGAYUMI TOMOYASU
IPC分类号： C25D17/12
CPC分类号： C25D17/12
摘要： PROBLEM TO BE SOLVED: To provide an energizing belt for an anode holder, which can surely energize an anode, can easily replace the anode, and can enhance an efficiency of an operation period of time in changing the anode, and to provide the anode holder.
SOLUTION: This energizing belt for the anode holder is used in a device for an anode holder 10 that is used in a plating apparatus in which a substrate (W) and an anode 5 are vertically arranged so as to face to each other in a plating bath 44, and that feeds an electric power to the anode 5, and is made of a belt 1 which can contact with a peripheral surface of the anode 5 and holds the anode 5.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够确定地对阳极通电的阳极保持器的通电带，可以容易地更换阳极，并且可以提高改变阳极的操作时间的效率，并且提供阳极座。解决方案：用于阳极保持器的激励带用于阳极保持器10的装置中，阳极保持器10用于电镀装置中，其中基板（W）和阳极5垂直布置成彼此面对在电镀槽44中，并且向阳极5供电，并且由能够与阳极5的外周表面接触并保持阳极5的带1制成。版权所有（C）2009 ，JPO＆INPIT

4. 发明专利

JP2014148755A Plating apparatus 有权
标题翻译：电镀设备
公开(公告)号：JP2014148755A
公开(公告)日：2014-08-21
申请号：JP2014084513
申请日：2014-04-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YAHAGI MITSUTOSHI , ABE KENICHI , ARAKI YUJI , MINAMI YOSHIO , NAGAYUMI TOMOYASU
IPC分类号： C25D17/12 , C25D17/00 , C25D17/06 , C25D21/00
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which facilitates replacement of an anode and allows improvement of safety of anode replacement and efficiency of an operation time.SOLUTION: A plating apparatus comprises a substrate holder 18 for holding a substrate, an anode holder for holding an anode, a substrate attachment/detachment part 30 for attaching the substrate to the substrate holder 18 and detaching from the substrate holder 18, a temporary storage place 70 for taking out the anode holder out of the apparatus, a plating vessel 44 which is located between the substrate attachment/detachment part 30 and the temporary storage place 70, arranges the substrate holder holding a substrate and the anode holder holding an anode so as to face each other and carries out a plating treatment and a transporter 52 which can carry the substrate holder and the anode holder between the substrate attachment/detachment part 30 and the temporary storage place 70.
摘要翻译：要解决的问题：提供一种有助于阳极更换的电镀设备，并且可以提高阳极更换的安全性和操作时间的效率。电镀设备包括用于保持基板的基板保持器18，用于保持基板的阳极保持器保持阳极，用于将衬底附着到衬底保持器18并与衬底保持器18分离的衬底附接/拆卸部30，用于将阳极保持器从设备中取出的临时存储位置70，电镀槽44 位于基板安装/拆卸部30和临时存放位置70之间的布置保持基板的基板保持架和保持阳极的阳极保持架相互相对并进行电镀处理，并且能够承载衬底保持器和衬底附接/拆卸部件30与临时存储位置70之间的阳极保持器。

5. 发明专利

JP2014118578A Sn ALLOY PLATING APPARATUS AND METHOD 有权
标题翻译： Sn合金镀层装置及方法
公开(公告)号：JP2014118578A
公开(公告)日：2014-06-30
申请号：JP2012272168
申请日：2012-12-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SHIMOYAMA TADASHI , FUJIKATA JUNPEI , ARAKI YUJI , TAMURA MASAMICHI , MIYAGAWA TOSHIKI
IPC分类号： C25D17/00 , C25D21/10 , C25D21/12 , C25D21/14 , C25D21/18
CPC分类号： C25D21/14 , C25D3/30 , C25D5/003 , C25D17/001 , C25D17/002 , C25D17/008 , C25D21/10 , C25D21/18
摘要： PROBLEM TO BE SOLVED: To relatively easily administrate a Sn alloy plating solution, and further, to simplify an apparatus.SOLUTION: A Sn alloy plating apparatus includes: an anion exchange membrane 54 which partitions the inside of a plating tank 16 into a cathode chamber 12 holding a Sn alloy plating solution Q in its inside and having a substrate W arranged in a state of being immersed in the Sn alloy plating solution and an anode chamber 14 holding an anolyte E containing Sn ions and an acid for forming a complex with divalent Sn ions in its inside and having a Sn anode 32 arranged in a state of being immersed in the anolyte; and an electrolytic solution supply line 24 for supplying an electrolytic solution containing the acid into the anode chamber. The electrolytic solution is supplied into the anode chamber through the electrolytic solution supply line so that the concentration of Sn ions of the anolyte in the anode chamber is a predetermined value or higher and that the concentration of the acid is prevented from becoming lower than a permissible value, and an increased amount of the anolyte according to the supply of the electrolytic solution in the anode chamber is supplied to the Sn alloy plating solution.
摘要翻译：要解决的问题：相对容易地管理Sn合金电镀液，并且进一步简化设备。解决方案：一种Sn合金电镀设备包括：阴极交换膜54，其将镀槽16的内部分隔成阴极室 12在其内部保持Sn合金电镀液Q，并且具有以浸渍在Sn合金电镀液中的状态配置的基板W，以及保持含有Sn离子的阳极电解液E的阳极室14和与二价形成络合物的酸 Sn离子在其内部并且具有以浸渍在阳极电解液中的状态布置的Sn阳极32; 以及用于将含有酸的电解液供给到阳极室的电解液供给管线24。电解液通过电解液供给线供给到阳极室，阳极室中的阳极电解液的Sn离子的浓度为规定值以上，防止酸浓度变得低于容许浓度价值，并且根据阳极室中的电解液的供应量将阳极电解液的量增加到Sn合金电镀液。

6. 发明专利

JP2012136765A Electroplating method 有权
标题翻译：电镀方法
公开(公告)号：JP2012136765A
公开(公告)日：2012-07-19
申请号：JP2010291656
申请日：2010-12-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ARAKI YUJI , SAITO NOBUTOSHI , FUJIKATA JUNPEI
IPC分类号： C25D5/18 , C25D21/12 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/522
CPC分类号： C25D5/18 , C25D11/024
摘要： PROBLEM TO BE SOLVED: To shorten the time for plating by filling a plated film with efficient plating using a higher average current value during plating and also allow ideal filling of the plated film to be performed.SOLUTION: A substrate having a through hole formed inside thereof is immersed in a plating solution and disposed in the plating tank. A pair of immersed anodes are disposed in the plating solution in the plating tank at a position facing each other on the front and rear surfaces of the substrate disposed in the plating solution. A plurality of plating processes are performed on the front and rear surfaces of the substrate for a prescribed period of time by supplying pulsed currents between the front surface of the substrate and one of the anodes which is disposed in a position facing the front surface of the substrate, and between the rear surface of the substrate and the other anode which is disposed in a position facing the rear surface of the substrate. A reverse electrolyzing process is performed by supplying currents in a direction opposite to current direction during plating process between the front surface of the substrate and one of the anodes which is disposed facing the front surface, and between the rear surface of the substrate and the other anode which is disposed facing the rear surface.
摘要翻译：要解决的问题：通过在电镀期间使用更高的平均电流值来有效地电镀填充电镀膜来缩短电镀时间，并且还可以理想地填充要执行的电镀膜。解决方案：将具有在其内部形成有通孔的基板浸入镀液中并设置在镀槽中。一对浸渍的阳极被布置在电镀槽中的电镀溶液中，在布置在电镀溶液中的基板的前表面和后表面上彼此相对的位置。通过在衬底的前表面和设置在与衬底的前表面相对的位置中的一个阳极之间提供脉冲电流，在衬底的前表面和后表面上进行多次电镀处理基板，并且在基板的后表面和设置在面向基板的后表面的位置中的另一个阳极之间。通过在基板的前表面与面向前表面的一个阳极之间以及基板的后表面与另一个之间的电镀工艺期间沿与电流方向相反的方向提供电流来进行反向电解处理阳极，其设置成面向后表面。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2012062570A Substrate holder and plating device 有权
标题翻译：基板支架和镀层装置
公开(公告)号：JP2012062570A
公开(公告)日：2012-03-29
申请号：JP2011148077
申请日：2011-07-04
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUJIKATA JUNPEI , ARAKI YUJI , KIMURA MASAAKI
IPC分类号： C25D17/08 , C25D7/12 , H01L21/288 , H01L21/683
CPC分类号： C25D17/001 , C25D17/06
摘要： PROBLEM TO BE SOLVED: To provide a substrate holder in which maintainability, especially replacement of sealing members or the like, can be improved.SOLUTION: The substrate holder includes: a fixed holding member 54 and a movable holding member 58 which detachably hold a substrate W by holding an outer periphery of the substrate W therebetween; and an inner sealing member 66 and an outer sealing member 68 which are attached to the movable holding member 58 and which, when the substrate W is held by the movable holding member 58 and the fixed holding member 54, seal between the movable holding member 58 and the outer periphery of the substrate W and between the movable holding member 58 and the fixed holding member 54, respectively. The inner sealing member 66 and the outer sealing member 68 are attached to the movable holding member 58 by being held between a sealing holder 62 and a fixing ring 70 attached to the sealing holder 62.
摘要翻译：要解决的问题：提供一种能够提高可维护性，特别是更换密封构件等的基板保持器。解决方案：衬底保持器包括：固定保持构件54和可移动保持构件58，其通过将衬底W的外周保持在其中而可拆卸地保持衬底W; 以及内部密封构件66和外部密封构件68，其附接到可动保持构件58，并且当基板W被可动保持构件58和固定保持构件54保持时，在可动保持构件58 以及基板W的外周分别与可动保持部件58和固定保持部件54之间。内部密封构件66和外部密封构件68通过保持在密封保持器62和附接到密封保持器62的固定环70之间而附接到可动保持构件58.版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2017115170A めっき装置及びめっき方法审中-公开
公开(公告)号：JP2017115170A
公开(公告)日：2017-06-29
申请号：JP2015248373
申请日：2015-12-21
申请人：株式会社荏原製作所 , Ebara Corp
发明人： SHIMOYAMA TADASHI , ARAKI YUJI , NAGAI MIZUKI , FUJIKATA JUNPEI , NAKADA TSUTOMU
IPC分类号： C25D21/10 , C25D3/38 , C25D7/12 , C25D17/00 , C25D17/10 , C25D21/00 , C25D21/14
摘要：【課題】めっき液に添加された添加剤の分解及び変質を抑制するめっき装置及びめっき方法を提供する。【解決手段】本発明によるめっき装置は、めっき液Q1を保持し、不溶解アノード22を収容するアノード槽20と、添加剤を含むめっき液Q2を保持し、基板Wを収容するカソード槽30と、アノード槽20に保持されるめっき液Q1とカソード槽30に保持されるめっき液Q2とを分離する抵抗体42と、カソード槽30に保持されるめっき液Q2を撹拌するパドル32と、を備える。不溶解アノード22と基板Wとは、抵抗体42を介して対向するように配置される。パドル32は、抵抗体42と基板Wとの間に配置される。【選択図】図1

9. 发明专利

JP2014053594A Electroplating method and electroplating device of through hole 有权
标题翻译：电镀方法和通孔电镀装置
公开(公告)号：JP2014053594A
公开(公告)日：2014-03-20
申请号：JP2013156314
申请日：2013-07-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SHIMOYAMA TADASHI , ARAKI YUJI , KURIYAMA FUMIO , FUJIKATA JUNPEI
IPC分类号： H05K3/40 , C25D5/18 , C25D7/00 , C25D7/12 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/522 , H05K3/42
CPC分类号： C25D5/18 , C25D5/02 , C25D5/10 , C25D17/001 , C25D21/10 , C25D21/12 , H01L21/2885 , H01L21/76898
摘要： PROBLEM TO BE SOLVED: To provide an electroplating method capable of filling a through hole surely with a metal film, having no void inside, in shorter time, even if the through hole has a relatively large diameter of about 150-300 μm.SOLUTION: A first stage plating for substantially reducing the diameter of a through hole by forming a metal film of uniform thickness in the through hole, a second stage plating for closing the central part of the through hole with the metal film formed therein, by using a PR pulse current repeating a forward current and a reverse current alternately, in which the forward current value is made smaller than the current value of a plating current used for metal deposition in the first stage plating, and a third stage plating for completing the filling of the through hole with a metal film, by raising the current value of a plating current used for metal deposition equal to or higher than the forward current value of a PR pulse used in the second stage plating, are performed continuously.
摘要翻译：要解决的问题：即使通孔具有约150-300μm的相对大的直径，提供一种能够在更短的时间内确保地用金属膜填充通孔的电镀方法，其中内部没有空隙。通过在通孔中形成均匀厚度的金属膜来大幅度减小通孔的直径的第一阶段电镀，通过使用PR来封闭通孔的中心部分的金属膜的第二阶段电镀脉冲电流交替地重复正向电流和反向电流，其中使正向电流值小于用于第一级电镀中的金属沉积的电镀电流的电流值，以及用于完成第一级电镀的填充的第三级电镀通过提高用于金属沉积的电镀电流的电流值等于或高于在第二级pla中使用的PR脉冲的正向电流值的通孔连续执行。

10. 发明专利

JP2012107343A Anode holder, and plating apparatus 有权
标题翻译：阳极灯座和电镀设备
公开(公告)号：JP2012107343A
公开(公告)日：2012-06-07
申请号：JP2012040902
申请日：2012-02-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YAHAGI MITSUTOSHI , ABE KENICHI , ARAKI YUJI , MINAMI YOSHIO , NAGAYUMI TOMOYASU
IPC分类号： C25D17/12 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide an anode holder that reliably allows an anode to be energized, facilitates replacement of the anode and improves the efficiency of operation time in replacing the anode.SOLUTION: The anode holder 10 includes: an anode holder base 11 for storing the anode 5; and an anode mask 13 that is mounted on the front surface side of the anode holder base 11 and partially covers the anode 5.

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