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1. 发明专利

JP3646500B2 Electronic circuit device 失效
公开(公告)号：JP3646500B2
公开(公告)日：2005-05-11
申请号：JP2385598
申请日：1998-01-20
申请人：株式会社村田製作所
发明人：良嗣堀 , 達弥舟木
IPC分类号： H01L21/60 , H01L23/12 , H05K3/34
CPC分类号： H01L24/81 , H01L2924/14 , H01L2924/19105 , H05K3/3452 , H01L2924/00

3. 发明专利

JPWO2008026335A1 電子部品装置およびその製造方法ならびに電子部品アセンブリおよびその製造方法审中-公开
公开(公告)号：JPWO2008026335A1
公开(公告)日：2010-01-14
申请号：JP2008531967
申请日：2007-03-07
申请人：株式会社村田製作所
发明人：裕樹北山 , 裕樹北山 , 良嗣堀 , 良嗣堀
IPC分类号： H01L23/36
CPC分类号： H01L25/165 , H01L23/36 , H01L23/367 , H01L23/3736 , H01L23/42 , H01L23/4334 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/73253 , H01L2224/83051 , H01L2224/83194 , H01L2224/83801 , H01L2924/01004 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/15724 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/15763 , H01L2924/16152 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , Y10T428/12396 , H01L2924/01026 , H01L2924/01028 , H01L2924/01047 , H01L2924/00014 , H01L2924/014
摘要：電子部品素子に金属板が接合された電子部品装置を、基板に搭載するとき、金属板と基板の金属面とを接合するはんだが、電子部品素子と金属板とを接合するはんだを溶食すると、電子部品素子と金属板との間での接合信頼性が低下する。電子部品素子(22)と金属板(23)とを接合する第1のはんだ(37)の一部によって、電子部品素子(22)の底面(34)の外周に沿って延びる突条(38)を形成する。突条(38)は、金属板(23)とマザーボードとしての基板(32)とを接合する第2のはんだ(53)を堰き止め、電子部品素子(22)と金属板(23)との接合に寄与している第1のはんだ(37)が溶食されることを防止する。

4. 发明专利

JP4059142B2 Method of manufacturing a solder bumped chip 有权
公开(公告)号：JP4059142B2
公开(公告)日：2008-03-12
申请号：JP2003147698
申请日：2003-05-26
申请人：株式会社村田製作所
发明人：良嗣堀
IPC分类号： H01L21/60
CPC分类号： H01L2224/11
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of chips having solder bumps whereby, when forming solder bumps in the chips present in the state of an aggregate substrate, the bump having a large height can be formed in each corner portion of each chip. SOLUTION: The manufacturing method of chips having solder bumps is manufactured by a process for so forming electrodes on an aggregate substrate as to arrange the electrodes rectangularly along the respective sides of each chip, a process for printing solder pastes by using a printing mask having opening portions in the positions corresponding to the respective electrodes, a process for forming solder bumps on the electrodes by subjecting the aggregate substrate having the printed solder pastes to a heat treatment, and a process for so cutting thereafter the aggregate substrate longitudinally and laterally as to manufacture the chips having the solder bumps. Hereupon, the corresponding opening positions of the printing mask to the electrodes of each chip wherefrom the electrodes of its corner portions are excluded are so formed that their widths are made wider than the ones of the electrodes in the nearly orthogonal direction to its electrode arranging direction and their dimensions are made nearly equal to the ones of the electrodes in its electrode arranging direction. Further, the center positions of the two opening portions corresponding to the two electrodes adjacent to each corner portion of each chip are offset in the nearly orthogonal direction to its electrode arranging direction, with respect to the centers of the corresponding electrodes thereto. Moreover, the directions of these offsets are so set as to have the same sense in the circumferential direction of each chip. COPYRIGHT: (C)2005,JPO&NCIPI

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