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1. 发明专利

JP2017092020A モジュール用コネクタ审中-公开
公开(公告)号：JP2017092020A
公开(公告)日：2017-05-25
申请号：JP2016120833
申请日：2016-06-17
申请人：山一電機株式会社 , Yamaichi Electronics Co Ltd
发明人： SASAKI TAKAMITSU , OYA MASAAKI
IPC分类号： H01R12/51 , H01R13/24
摘要：【課題】本発明は、モジュールの上ケースに取り付けられた端子と、モジュールの下ケースに搭載されたモジュール基板の接続方法を改善し、小型化、取り付け性改善、及び、低コスト化を可能とするモジュール用コネクタを提供することを目的とする。【解決手段】モジュール用コネクタは、コネクタ嵌合時に、多芯ケーブル10に電気的に接続された複数のケーブル側コンタクト端子112に電気的に接触されるコネクタ接触部1012a、ばね性を有するばね部1012b、及び、モジュール基板1022に電気的に接触して固定される基板接続部1012cを有し、コネクタ接触部1012aと基板接続部1012cの間にばね部1012bが配置されるように一体に形成される複数のケース側コンタクト端子1012と、モジュール側ケース1021に固定されるモジュール基板1022に設けられる複数のコンタクト接触用パッド1023とを備える。【選択図】図7

2. 发明专利

JP2014160655A Semiconductor socket 有权
标题翻译：半导体插座
公开(公告)号：JP2014160655A
公开(公告)日：2014-09-04
申请号：JP2014013539
申请日：2014-01-28
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： KUDO YASUYUKI , OYA MASAAKI
IPC分类号： H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor socket capable of easily mounting/demounting a semiconductor element with high workability.SOLUTION: A main body 2 includes a formed guide groove 31 gradually inclining downward to the inside in the slide direction of cover members 3A, 3B that slides to the inside of the main body 2. Each of cover members 3A, 3B includes a guided unit 41 moving along the guide groove 31. The cover members 3A, 3B further include: a pressing unit 71 disposed upward an IC chip 81 of a housing unit 11 at a standby position, for depressing the top face of the IC chip 81 of the housing unit 11 at a stationary position to press the IC chip 81 to a terminal 12; and a locking craw 44 for latching a latch block inside part 32b of the main body 2 by the disposition at the stationary position, to limit the movement of the cover members 3A, 3B not to slide the direction of the standby position.
摘要翻译：要解决的问题：提供一种能够容易地安装/拆卸具有高加工性的半导体元件的半导体插座。解决方案：主体2包括沿着盖部件3A的滑动方向向内逐渐向内倾斜的成形引导槽31， 3B，其滑动到主体2的内部。每个盖构件3A，3B包括沿着引导槽31移动的引导单元41.盖构件3A，3B还包括：设置在IC芯片81上方的按压单元71 在待机位置处的壳体单元11用于将壳体单元11的IC芯片81的顶面在静止位置按压以将IC芯片81按压到端子12; 以及锁定抓取器44，用于通过在静止位置的配置来将主体2的部分32b内的闩锁块锁定，以限制盖构件3A，3B的运动，而不使待机位置的方向滑动。

3. 发明专利

JP2013206602A Dust proof shutter mechanism, detachable connector including dust proof shutter mechanism, and memory card connector including dust proof shutter mechanism 审中-公开
标题翻译：防尘切换机构，可拆卸连接器，包括防尘切换机构，以及包含防尘切换机构的存储卡连接器
公开(公告)号：JP2013206602A
公开(公告)日：2013-10-07
申请号：JP2012071884
申请日：2012-03-27
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： AOKI MASARU , ONO TOMIO , AMANO HIROSHI
IPC分类号： H01R13/52
摘要： PROBLEM TO BE SOLVED: To provide a dust proof shutter member capable of reducing excessive insertion/removal force for opening/closing a shutter member.SOLUTION: A shutter member 10 formed of a resin film comprises: a fixed part fastened to the lower face of an inner peripheral part of a front part of a shell part 6; and a movable part connected to the fixed part in an elastically displaceable manner, and has a cross-sectional shape with a predetermined thickness and a substantially L-shape.
摘要翻译：要解决的问题：提供能够减少用于打开/关闭活门构件的过度的插入/取下力的防尘挡板构件。解决方案：由树脂膜形成的挡板构件10包括：固定部分，固定到下表面外壳部6的前部的内周部; 以及以可弹性位移方式连接到固定部分的可移动部件，并且具有预定厚度和大致L形的横截面形状。

4. 发明专利

JP2013195282A Contact probe, semiconductor element socket provided with contact probe, and method for manufacturing contact probe 审中-公开
标题翻译：联系人探头，提供联系人探针的半导体元件插座和制造联系人探针的方法
公开(公告)号：JP2013195282A
公开(公告)日：2013-09-30
申请号：JP2012063903
申请日：2012-03-21
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： MATSUZAWA HIROSHI , IKEGAMI YUKI , SUZUKI TAKESHI , SUZUKI KATSUMI
IPC分类号： G01R1/067 , G01R1/073 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a contact probe having a plunger whose outside shape is less distorted, a semiconductor element socket provided with the contact probe, and a method for manufacturing the contact probe.SOLUTION: A pair of projections 35 that projects inward in a radial direction is provided on the inner peripheral surface of a through hole 15 of a plunger 12 included in a contact probe 11. A coil spring 17 contacts the projections 35 at one end part so as to press an upper contactor 13 toward an electrode part 72 of a semiconductor element 73. For the plunger 12, an outer peripheral surface part corresponding to a part provided with the projections 35 in the inner peripheral surface of the through-hole 15 is flat.
摘要翻译：要解决的问题：为了提供具有外部形状变形较小的柱塞的接触探针，设置有接触探针的半导体元件插座和用于制造接触探针的方法。解决方案：一对突起35，其向内突出径向方向设置在接触探针11中包括的柱塞12的通孔15的内周面上。螺旋弹簧17在一端部与突起35接触，以将上接触器13压向电极部分 72为半导体元件73.对于柱塞12，与贯通孔15的内周面上设有凸部35的部分对应的外周面部分是平坦的。

5. 发明专利

JP2013175400A Ic card connector 有权
标题翻译： IC卡连接器
公开(公告)号：JP2013175400A
公开(公告)日：2013-09-05
申请号：JP2012040048
申请日：2012-02-27
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： TAGUCHI KAZUTAKA
IPC分类号： H01R13/631 , G06K17/00 , H01R12/72
摘要： PROBLEM TO BE SOLVED: To easily insert/eject a relatively narrow IC card, among a plurality of IC cards of which the shapes are different from one another, without using an actuator which regulates an erroneous inserting operation of a predetermined IC card.SOLUTION: A Duo card 30 inserted through a card accommodation section 18 is engaged, in a chamfered part 303, to a card guide section 131 provided at a position corresponding to the vicinity of a boundary between a card accommodation section 10 and the card accommodation section 18 on a side wall 13, and is then brought into slide contact with an inner peripheral surface of a side wall 11 on one side face of the Duo card 30 and brought into slide contact with an inner peripheral part of the side wall 13 on another side face of the Duo card 30. Therefore, a contact pad 304 of the duo card 30 is positioned to a contact part of a contact terminal 6.
摘要翻译：要解决的问题：在不使用调节预定IC卡的错误插入操作的致动器的情况下，在形状彼此不同的多个IC卡中容易地插入/排出相对较窄的IC卡。解决方案：通过卡片容纳部分18插入的二重卡30在倒角部分303中被接合到设置在与卡容纳部分10和卡片容纳部分18之间的边界附近的位置处的卡引导部分131上侧壁13，然后与Duo卡30的一个侧面上的侧壁11的内周表面滑动接触，并且在另一侧面上与侧壁13的内周部分滑动接触因此，二重卡30的接触垫304定位在接触端子6的接触部分上。

6. 发明专利

JP2013151638A Coverlay film, flexible wiring board, and production method therefor 审中-公开
标题翻译：覆盖膜，柔性布线板及其生产方法
公开(公告)号：JP2013151638A
公开(公告)日：2013-08-08
申请号：JP2012170818
申请日：2012-08-01
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKAO SATOSHI , SEKINE NORIAKI , YAMAGUCHI YUKIO
IPC分类号： C09J7/02 , C09J109/06 , C09J125/10 , C09J171/00 , H05K1/03 , H05K3/28 , H05K3/38
CPC分类号： H05K3/281 , C08L71/12 , C09J7/22 , C09J7/30 , C09J125/10 , C09J2203/326 , C09J2425/00 , C09J2471/00
摘要： PROBLEM TO BE SOLVED: To provide a coverlay film having excellent adhesion relative to a substrate material in a flexible wiring board and being excellent in transfer characteristics of an electric signal such as a high frequency wave.SOLUTION: A coverlay film is configured such that an adhesion layer 12 is formed on one side (for example, a rear side) of a cover film-shaped base material 11; the adhesion layer 12 is formed on the cover film-shaped base material 11 by adhering the layer to or applying the layer onto the cover film-shaped base material 11. Alternately, to a rear side of the adhesion layer 12, further a release material layer 13 is adhered; the cover film-shaped base material 11 has an elastic modulus larger than the adhesion layer 12 and preferably has a dielectric constant of 3.5 or less; the adhesion layer 12 contains a synthetic resin containing oligophenylene ether and a styrene-butadiene-based elastomer; and the release material layer 13 is not particularly limited so long as the release material layer 13 can be peeled without impairing the shape of the adhesion layer 12.
摘要翻译：要解决的问题：提供一种在柔性布线板中相对于基板材料具有优异粘附性的覆盖膜，并且具有优异的电信号如高频波的传递特性。解决方案：覆盖膜被构造成使得粘合层12形成在覆盖膜状基材11的一侧（例如，背面）上; 通过将该层粘附到该覆盖膜状基材11上或将该层施加到该覆盖膜状基材11上而在该覆盖膜状的基材11上形成粘合层12.或者，在粘合层12的后侧，层13被粘附; 覆盖膜状基材11具有比粘合层12大的弹性模量，优选介电常数为3.5以下; 粘合层12含有含有低聚苯醚和苯乙烯 - 丁二烯类弹性体的合成树脂; 剥离材料层13没有特别限制，只要能够剥离剥离材料层13而不损害粘合层12的形状即可。

7. 发明专利

JP2013137983A Card connector 有权
标题翻译：卡连接器
公开(公告)号：JP2013137983A
公开(公告)日：2013-07-11
申请号：JP2012071891
申请日：2012-03-27
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： TAKAI YOSUKE , OYA MASAAKI
IPC分类号： H01R13/64 , G06K17/00 , H01R12/72
CPC分类号： H01R13/64 , G06K7/0021 , G06K13/085 , H01R27/00
摘要： PROBLEM TO BE SOLVED: To provide a card connector capable of guiding smooth attachment and detachment of an IC card and achieving low height of an IC card connector.SOLUTION: When a SD card is loaded on a card housing part 12A, a second lock part 10fb of a lock member 10FA is unlocked, and when the SD card is further inserted, a first lock part 10fa unlocked of the lock member is pushed up from between the locking step part 16e of a slide block 16 and the inner peripheral part of a side-wall 12RW by the end part of the SD card in a traveling direction thereof and is sled from an entry position to a waiting position in the side wall by further pushing the SD card after the end part of the SD card in the traveling direction thereof is contacted with the guide surface 16Sa of the slide block. When another card is loaded on the housing part 12A, the end part of the inserted another card in a traveling direction thereof is guided to a normal position toward a contact terminal 18ai by the guide surface of the locked slide block and a guide surface 16Sb.
摘要翻译：要解决的问题：提供能够引导IC卡的平滑安装和拆卸并实现IC卡连接器的低高度的卡连接器。解决方案：当SD卡被装载在卡壳部分12A上时，第二锁定部分锁定构件10FA的10fb被解锁，并且当进一步插入SD卡时，锁定构件解锁的第一锁定部10fa从滑动块16的锁定台阶部16e和第一锁定构件10的内周部分侧板12RW通过SD卡的行进方向的端部，并且通过在SD卡的端部之后沿着行进方向进一步推动SD卡，从入口位置滑动到侧壁中的等待位置其与滑块的引导表面16Sa接触。当另一卡被装载在壳体部分12A上时，插入的另一个卡的行进方向的端部被锁定的滑动块的引导表面和引导表面16Sb引导到接触端子18ai的正常位置。

8. 发明专利

JP2013120065A Contact probe and semiconductor element socket including the same 有权
标题翻译：接触探头和半导体元件插座，包括它们
公开(公告)号：JP2013120065A
公开(公告)日：2013-06-17
申请号：JP2011266645
申请日：2011-12-06
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SUZUKI KATSUMI , SUZUKI TAKESHI
IPC分类号： G01R1/067 , G01R1/073 , G01R31/26 , H01R13/24
CPC分类号： G01R1/06722 , H01R13/2421 , H01R2201/20
摘要： PROBLEM TO BE SOLVED: To provide a contact probe capable of reducing a calorific value by reducing conductor resistance of the contract probe, and to provide a semiconductor element socket including the contact probe.SOLUTION: A contact probe 10 includes: a first plunger 12 whose tip has an upper contact 14 with which an electrode part of a semiconductor element is brought into contact; a second plunger 13 having a lower contact 15 with which an electrode part of a substrate for inspection is brought into contact; and a coil spring 18 for energizing the first plunger 12 and the second plunger 13 in mutually separating directions. At least the first plunger 12 and the second plunger 13 has a three-layer plating layer composed of a ground layer 22, an intermediate layer 23 and a most-surface layer 24 formed on the surface of a base material 21, the volume resistivity of the intermediate layer 23 is smaller than that of the most-surface layer 24, and the hardness of the most-surface layer 24 is higher than that of the intermediate layer 23.
摘要翻译：要解决的问题：提供能够通过降低合同探针的导体电阻来降低发热量的接触探针，并提供包括接触探针的半导体元件插座。接触探针10包括：第一柱塞12，其尖端具有上接触件14，半导体元件的电极部分与之接触; 具有下接触件15的第二柱塞13，用于检查的基板的电极部分与其接触; 以及用于在相互分离的方向上使第一柱塞12和第二柱塞13通电的螺旋弹簧18。至少第一柱塞12和第二柱塞13具有由形成在基材21的表面上的接地层22，中间层23和最表面层24构成的三层镀层，其体积电阻率中间层23比最表面层24小，最表面层24的硬度高于中间层23的硬度。（C）2013，JPO＆INPIT

9. 发明专利

JP2013093233A Card connector 审中-公开
标题翻译：卡连接器
公开(公告)号：JP2013093233A
公开(公告)日：2013-05-16
申请号：JP2011235087
申请日：2011-10-26
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： KIKUCHI KOJI
IPC分类号： H01R12/73 , G06K17/00
摘要： PROBLEM TO BE SOLVED: To downsize a card connector by minimizing a dead space in a card housing generated due to a card detection switch.SOLUTION: In a case where a memory card 22 is inserted into a card housing 10A, when the abutting end 20E of a movable terminal 20 is pressed by an end of the memory card 22 in a direction in which a movable contact part 20MC is separated from the fixed contact part 24C of a fixed terminal 24 within a flat section 10BA, the card detection switch is turned from an on state to an off state which expresses the completion of mounting the memory card 22.

10. 发明专利

JP2013073062A Optical module 审中-公开
标题翻译：光学模块
公开(公告)号：JP2013073062A
公开(公告)日：2013-04-22
申请号：JP2011212492
申请日：2011-09-28
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： KURODA TOSHITAKA , YOSHIDA SATORU , ITO TOSHIYASU
IPC分类号： G02B6/42
CPC分类号： G02B6/4281 , G02B6/4278
摘要： PROBLEM TO BE SOLVED: To provide an optical module that does not deteriorate in transmission characteristics even in high speed transmission and is capable of slimming down.SOLUTION: An optical module at least includes: an optical connector; a flexible wiring board including an optical semiconductor for converting between an optical signal and an electrical signal, a semiconductor for driving the optical semiconductor, and a semiconductor for amplifying a signal from the optical semiconductor; and a cover member for storing the flexible wiring board. The optical semiconductor is linearly arranged along the longer direction of the flexible wiring board. The flexible wiring board is folded so as to have an upper stage part, a vertical part, and a lower stage part. The optical semiconductor, semiconductor for driving the optical semiconductor, and semiconductor for amplifying a signal from the optical semiconductor are arranged at the vertical part of the flexible wiring board. The optical connector is arranged to have a right angle against the vertical part of the flexible wiring board to be longitudinally disposed corresponding to the linear arrangement of the optical semiconductors arranged at the vertical part of the flexible wiring board.
摘要翻译：要解决的问题：提供即使在高速传输中也不会劣化传输特性并且能够减薄的光学模块。解决方案：光学模块至少包括：光学连接器; 包括用于在光信号和电信号之间转换的光半导体的柔性布线板，用于驱动光半导体的半导体和用于放大来自光半导体的信号的半导体; 以及用于存储柔性布线板的盖构件。光学半导体沿着柔性布线板的较长方向线性排列。柔性布线板被折叠成具有上部部分，垂直部分和下部部分。光学半导体，用于驱动光学半导体的半导体和用于放大来自光学半导体的信号的半导体被布置在柔性布线板的垂直部分。光连接器被布置成与柔性布线板的垂直部分具有相对于布置在柔性布线板的垂直部分处的光半导体的线性布置纵向布置的直角。版权所有（C）2013，JPO＆INPIT

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