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1. 发明专利

JP2010130001A Radiation bed 审中-公开
标题翻译：辐射床
公开(公告)号：JP2010130001A
公开(公告)日：2010-06-10
申请号：JP2009142876
申请日：2009-06-16
申请人： Kuei-Fang Chen , 桂芳陳
发明人： CHEN KUEI-FANG
IPC分类号： H01L33/64 , H01L23/12 , H01L23/38
CPC分类号： H01L33/641 , H01L25/167 , H01L33/645 , H01L2224/48091 , H01L2924/01068 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a radiation bed which includes a low-cost structure and ensures more effective conduction of heat produced from an electronic component mounted thereon to a metal plate as compared with the conventional structure. SOLUTION: The radiation bed for mounting an electronic component includes the metal plate on which a first area and a second area are formed independently on its one surface, an dielectric layer which is formed only on the surface of the second area, and first and second conductive layers which are formed on the surface of the dielectric layer. In addition, the radiation bed includes the metal plate on which first area and second area are formed independently on its one surface each other, an first dielectric layer which is formed only on the surface of the second area, the first conductive layer which is formed on the first area, and the second conductive layer which is formed on the first dielectric layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：与常规结构相比，提供一种包括低成本结构的辐射床，并且确保从安装在其上的电子部件产生的热量更有效地传导到金属板。解决方案：用于安装电子部件的辐射床包括在其一个表面上独立地形成有第一区域和第二区域的金属板，仅形成在第二区域的表面上的电介质层，以及形成在电介质层的表面上的第一和第二导电层。另外，辐射床包括在其一个表面上独立地形成有第一区域和第二区域的金属板，仅形成在第二区域的表面上的第一介电层，形成的第一导电层在第一区域上形成的第二导电层和形成在第一介电层上的第二导电层。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2012089869A Heat radiation base 审中-公开
标题翻译：热辐射基
公开(公告)号：JP2012089869A
公开(公告)日：2012-05-10
申请号：JP2011269739
申请日：2011-12-09
申请人： Kuei-Fang Chen , 桂芳陳
发明人： CHEN KUEI-FANG
IPC分类号： H01L23/36 , H01L33/64
CPC分类号： H01L33/641 , H01L25/167 , H01L33/645 , H01L2224/48091 , H01L2924/01068 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a heat radiation base which has an inexpensive structure and transmits heat generated from electronic components mounted thereon to a metal plate more effectively compared to a conventional heat radiation base.SOLUTION: A heat radiation base for mounting an electronic component 3 is composed of a metal plate 4 having a first area 411 and a second area 412 formed on a surface thereof so as to be independent of each other, an insulation layer 5 formed on only a surface of the second area, and a first conductive layer 61 and a second conductive layer 62 which are formed on a surface of the insulation layer.
摘要翻译：要解决的问题：与传统的散热基座相比，提供一种具有廉价结构并将安装在其上的电子部件产生的热量更有效地传递到金属板的散热基座。解决方案：用于安装电子部件3的散热基座由金属板4构成，金属板4具有形成在彼此独立的第一区域411和形成在其表面上的第二区域412，绝缘层5 仅形成在第二区域的表面上，以及形成在绝缘层的表面上的第一导电层61和第二导电层62。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2008193092A Light emitting diode chip support and utilization method thereof 审中-公开
标题翻译：发光二极管芯片支持及其利用方法
公开(公告)号：JP2008193092A
公开(公告)日：2008-08-21
申请号：JP2008023639
申请日：2008-02-04
申请人： Han-Yu Chang , Kuei-Fang Chen , Mei-Yuh Luo , 涵郁張 , 美育羅 , 陳桂芳
发明人： CHEN KUEI-FANG , LUO MEI-YUH , CHANG HAN-YU
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L33/64 , H01L2224/48091 , H01L2224/48463 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an LED chip support, with no bottlenecks for heat transmission from the LED chip to a sub-mount, and with excellent heat dissipation properties; and an LED module having the LED chip support. SOLUTION: The LED chip support that supports the LED chip of the LED module or an LED apparatus is formed of a submount, a thermal conductive and electrical conductive layer covering the top surface of the submount, bonded to the mounting surface of the LED chip, and passing working current of the LED chip, and a thermal conductive electrical insulative layer existing between the top surface of the submount and the bottom surface of the thermal conductive and electrical conductive layer. As a result, the heat dissipation properties of the LED module or LED apparatus are improved. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种LED芯片支持，没有瓶颈从LED芯片到副安装座的传热，并具有优良的散热性能; 以及具有LED芯片支撑的LED模块。解决方案：支持LED模块或LED装置的LED芯片的LED芯片支架由覆盖基座的顶表面的基座，导热和导电层形成，该导电和导电层结合到 LED芯片和LED芯片的通过工作电流，以及存在于基座的顶表面和导热和导电层的底表面之间的导热电绝缘层。结果，提高了LED模块或LED装置的散热特性。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007234571A Illumination apparatus having heat dissipating function 审中-公开
标题翻译：具有散热功能的照明装置
公开(公告)号：JP2007234571A
公开(公告)日：2007-09-13
申请号：JP2006196118
申请日：2006-07-18
申请人： Kuei-Fang Chen , 桂芳陳
发明人： CHEN KUEI-FANG
IPC分类号： F21V29/00 , F21V29/02 , F21Y101/02
CPC分类号： F21V29/677 , F21V29/004 , F21V29/006 , F21V29/02 , F21V29/71 , F21V29/75 , F21V29/763 , F21V29/85 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide an illumination apparatus having an excellent heat dissipating function. SOLUTION: This illumination apparatus has a heat sink which has a circuit mounting side equipped with a heat conductive insulating film thereon. A lighting device has a printed circuit, and a lighting unit having a light emitting diode. The printed circuit is provided on the circuit mounting side of the heat sink, and in thermal contact with the heat conductive insulating film. The light emitting diode has a chip die shape, and is electrically connected to the printed circuit through wires, and is in thermal contact with the heat conductive insulating film. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的散热功能的照明装置。解决方案：该照明装置具有散热器，其具有在其上配备有导热绝缘膜的电路安装侧。照明装置具有印刷电路和具有发光二极管的照明单元。印刷电路设置在散热器的电路安装侧，并与导热绝缘膜热接触。发光二极管具有芯片形状，并且通过导线与印刷电路电连接，并与导热绝缘膜热接触。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007129213A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007129213A
公开(公告)日：2007-05-24
申请号：JP2006282669
申请日：2006-10-17
申请人： Kuei-Fang Chen , 桂芳陳
发明人： CHEN KUEI-FANG
IPC分类号： H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： F21V19/0035 , F21K9/00 , F21L4/08 , F21S4/28 , F21V19/004 , F21V19/0045 , F21V21/34 , F21V29/004 , F21V29/73 , F21V29/75 , F21V29/763 , F21Y2115/10
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting assembly that can overcome the foregoing drawbacks of prior art. SOLUTION: The light-emitting assembly is configured to include a heat sink 2 including a base wall 22 and two opposing holding walls 21 that extend upright from the base wall and define two holding conduits 25, respectively; a mounting seat 32 having two mutually opposite wings 322, each extending in a direction opposite to the other within the holding conduit; and a light-emitting device 31 that is mounted on the mounting seat 32 in between the wings 322 and has a bottom wall 317 extending through the mounting seat 32 to abut against the base wall 22 of the heat sink 2. Each of the holding walls 21 has an upper wall 211 for closing the top side of each of the holding conduits 25, and each of the wings 322 of the mounting seat 32 is provided with an elastic protrusion 329 that elastically abuts against the upper wall 211 of each of the holding wall 21. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以克服现有技术的上述缺点的发光组件。解决方案：发光组件被构造为包括散热器2，散热器2包括底壁22和两个相对的保持壁21，其分别从基壁延伸并限定两个保持导管25; 安装座32具有两个相互相对的翼322，每个翼322在保持导管内沿相反方向延伸; 以及安装在翼部322之间的安装座32上的发光装置31，并且具有延伸穿过安装座32的底壁317以抵靠散热器2的底壁22.每个保持壁 21具有用于封闭每个保持导管25的顶侧的上壁211，并且安装座32的每个翼322设置有弹性突起329，弹性突起329弹性地抵靠每个保持管25的上壁211 （C）2007，JPO＆INPIT

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