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    • 83. 发明专利
    • Heat storage-type exhaust treatment device
    • 热存储型排气处理装置
    • JP2008157486A
    • 2008-07-10
    • JP2006343848
    • 2006-12-21
    • Mazda Motor Corpマツダ株式会社
    • NIIHARA YOSHIMI
    • F23G7/06F23L15/02
    • Y02E20/348
    • PROBLEM TO BE SOLVED: To efficiently perform an operation corresponding to fluctuation of throughput of a treated gas by one heat storage-type exhaust treatment device. SOLUTION: A plurality of heat storage chambers 23A-23F and a plurality of combustion devices 22A-22C are disposed in a single treatment chamber 20 having an inflow port 31A and an outflow portion 32A. Inflow-side opening portions 35 of the heat storage chambers 23A-23F are independently controlled to be opened and closed by valve elements 37, and outflow-side opening portions 36 are independently controlled to be opened and closed by valve elements 38, so that a treated gas flowing state from the inflow port 31A to the outflow port 32A is switched to a first flow state from the heat storage chambers 23A-23C to the heat storage chambers 23D-23F through the combustion devices 22A-22C and a second flow state in the inverse order every prescribed period. The number of heat storage chambers 23A-23C, the number of heat storage chambers 23D-23F and the number of combustion devices 22A-22C through which the treated gas passes, are respectively increased according to the increase of the throughput of the treated gas. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:通过一个蓄热型排气处理装置有效地进行与处理气体的通过量的波动相对应的操作。 解决方案:在具有流入口31A和流出部32A的单个处理室20中设置多个蓄热室23A-23F和多个燃烧装置22A-22C。 蓄热室23A-23F的流入侧开口部35独立地由阀元件37进行开闭,流出侧开口部36被独立地控制,由阀元件38打开和关闭, 从流入口31A到流出口32A的处理气体流动状态通过燃烧装置22A-22C从蓄热室23A-23C切换到第一流动状态,并转换到第二流动状态 每个规定期间的逆序。 随着处理气体的生产量的增加,蓄热室23A-23C的数量,蓄热室23D-23F的数量和处理气体通过的燃烧装置22A-22C的数量分别增加。 版权所有(C)2008,JPO&INPIT
    • 89. 发明专利
    • Reflow soldering device
    • REFLOW焊接设备
    • JP2008042070A
    • 2008-02-21
    • JP2006216866
    • 2006-08-09
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KIMURA HIROSHIHATTORI SHUJI
    • H05K3/34B23K1/00B23K1/008B23K31/02B23K101/42F23C3/00F23D14/12F23L15/02F27B9/04F27B9/06F27B9/36F27D7/06F27D17/00
    • Y02E20/348
    • PROBLEM TO BE SOLVED: To provide a reflow soldering device capable of raising the reflow soldering quality by reducing the heating cost, so as to reduce energy consumption in the reflow soldering device and to reduce the running cost, shortening the starting time of the reflow soldering device, so as to eliminate power supply in the reflow soldering device not in use and to reduce the waste of energy.
      SOLUTION: The reflow soldering device includes: a transporting part 1 for transporting a wiring board 4 with an electronic component mounted thereon via cream solder; a heating part 2 for heating the wiring board; and an inactive gas supplying part 3 for supplying inactive gas 19 to the heating part 2. A tube heater 5 using a gas combustion system is used for the heating part 2.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种能够通过降低加热成本而提高回流焊接质量的回流焊接装置,从而降低回流焊接装置的能量消耗并降低运行成本,缩短起动时间 回流焊接装置,以消除不使用的回流焊接装置中的电源,并减少能量的浪费。 回流焊接装置包括:输送部件1,用于通过膏状焊料将其上安装有电子部件的布线板4输送; 用于加热布线板的加热部2; 以及用于将惰性气体19供给到加热部2的无效气体供给部3.使用气体燃烧系统的管加热器5用于加热部2.版权所有(C)2008,JPO&INPIT