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81. 发明专利

JPH0320332A DIORGANOPOLYSILOXANE WITH VINYL GROUP AND DRGANIC EPOXY FUNCTIONAL GROUP 失效
公开(公告)号：JPH0320332A
公开(公告)日：1991-01-29
申请号：JP6943389
申请日：1989-03-23
申请人： RHONE POULENC CHIMIE
发明人： GISUREENU TOORU , JIYANJIYATSUKU RUBURAN
IPC分类号： C08G77/04 , C08G77/14 , C08G77/20 , C08G77/22 , C08G77/42 , C08G77/44

83. 发明专利

JPH02103052A MICROFABRICATION PROCESS 失效
公开(公告)号：JPH02103052A
公开(公告)日：1990-04-16
申请号：JP25649688
申请日：1988-10-12
申请人： SHOWA DENKO KK
发明人： MOTOYAMA TAKUHIKO , MATSUI FUMIO , OWAKI YUKARI
IPC分类号： G03F7/075 , C08G77/42 , C08G77/44 , G03F7/26 , H01L21/302 , H01L21/3065
摘要： PURPOSE:To prepare a semiconductor device having high reliability with improved rate of microfabrication by using a cured film of a specified organopolysiloxane as insulating film. CONSTITUTION:To execute fine processing of a semiconductor device by performing successively a stage for forming a cured organopolysiloxane film obtd. by cocondensing silicone-based oligomers or polymers of a component (A) and (B) on a specified semiconductor substrate, a stage for coating the cured film with a photoresist and forming a desired pattern, a stage for etching the organopolysiloxane cured film using the resist as protective film and forming the desired pattern, and a stage for processing the semiconductor substrate to the desired shape using the cured organopolysiloxane film as protective film by etching, etc. The component (A) is a ladder type silicone oligomer or polymer having a specified mol.wt. of a specified wt.% OH group and alkoxy group. The component (B) is a silicone oligomer or polymer having a specified mol.wt. obtd. by the condensation of a silicone compd. expressed by the general formula I and a silicone compd. expressed by the general formula II.

84. 发明专利

JPH01299827A MTQ/POLYSILOXANE MIXED RESIN, ITS PRODUCTION AND COATING/INJECTION SEALING COMPOSITION CONTAINING THE SAME 失效
公开(公告)号：JPH01299827A
公开(公告)日：1989-12-04
申请号：JP8413889
申请日：1989-04-04
申请人： LOCTITE CORP
发明人： SUCHIIBUN TEI NAKOSU
IPC分类号： C08G77/16 , C08G77/20 , C08G77/42 , C08G77/44 , C08L83/07

85. 发明专利

JPH01252636A PRODUCTION OF CARBOXYALKYL SUBSTITUTED ORGANOPOLYSILOXANE 失效
公开(公告)号：JPH01252636A
公开(公告)日：1989-10-09
申请号：JP4194189
申请日：1989-02-23
申请人： DOW CORNING
发明人： DONII REI JIYUEN
IPC分类号： C08G77/00 , B01J31/02 , C07B61/00 , C07F7/07 , C07F7/18 , C08G77/08 , C08G77/14 , C08G77/22 , C08G77/42 , C08G77/44 , C08G77/60

86. 发明专利

JPH01185382A PREPARATION OF PRESSURE-SENSITIVE SILICONE ADHESIVE 失效
公开(公告)号：JPH01185382A
公开(公告)日：1989-07-24
申请号：JP1031488
申请日：1988-01-20
申请人： SHINETSU CHEMICAL CO
发明人： GOMYO SHIRO , KOBORI TAKAHIDE
IPC分类号： C08L83/04 , C08G77/08 , C08G77/10 , C08G77/44 , C08G81/00 , C09J179/08 , C09J183/00 , C09J183/04 , C09J183/10
摘要： PURPOSE:To easily and economically obtain the title adhesive having high purity and stable quality free from changes in viscosity, by reacting a specified organopolysiloxane with a specified organosiloxane copolymer in the presence of aqueous ammonia as catalyst. CONSTITUTION:An organopolysiloxane of formula I (wherein R is an optionally substituted monovalent hydrocarbon group; m is 1.8-2.1) (e.g., dime thylpolysiloxane) having an average degree of polymerization of 100-10,000 is reacted with an organosiloxane copolymer consisting of siloxane units of formula II (wherein R is an optionally substituted monovalent hydrocarbon group; n is 2.6-3) and siloxane units of the formula SiO2 (e.g., a methylpolysilo xane copolymer) in the presence of aqueous ammonia as catalyst, thus giving an objective pressure-sensitive silicone adhesive. This adhesive can be suitably used for the manufacture of, e.g., a pressure-sensitive adhesive tape and a masking tape.

87. 发明专利

JPS6317290B2 失效
公开(公告)号：JPS6317290B2
公开(公告)日：1988-04-13
申请号：JP50356781
申请日：1981-10-28
申请人： DOW CORNING
发明人： BURIZAADO JON DONARUDO , SUIHAATO TERENSU JON
IPC分类号： C07F7/08 , C08G77/00 , C08G77/06 , C08G77/42 , C08G77/44 , C08L83/00 , C08L83/04 , C09D183/04

88. 发明专利

JPS61108682A Silicone pressure-sensitive adhesive composition 失效
标题翻译：硅胶压敏粘合剂组合物
公开(公告)号：JPS61108682A
公开(公告)日：1986-05-27
申请号：JP24123385
申请日：1985-10-28
申请人： Dow Corning
发明人： GEIRII RETSUKUSU HOUMAN , HARORUDO RUIZU BINSENTO
IPC分类号： C08L83/04 , C08G77/42 , C08G77/44 , C09J183/00 , C09J183/10
CPC分类号： C09J183/10 , C08G77/44

89. 发明专利

JPS61108681A Production of silicone pressure-sensitive adhesive composition 失效
标题翻译：生产硅胶压敏胶粘剂组合物
公开(公告)号：JPS61108681A
公开(公告)日：1986-05-27
申请号：JP24123285
申请日：1985-10-28
申请人： Dow Corning
发明人： JIYON DONARUDO BURIZAADO , TERENSU JIYON SUUIHAATO
IPC分类号： C08L83/04 , C08G77/42 , C08G77/44 , C09J183/00 , C09J183/10
CPC分类号： C08G77/44 , C09J183/10

90. 发明专利

JPS61108627A Soluble polyimidesiloxane precursor and its production 失效
标题翻译：可溶性聚酰胺硅氧烷前体及其生产
公开(公告)号：JPS61108627A
公开(公告)日：1986-05-27
申请号：JP23042884
申请日：1984-11-02
申请人： Chisso Corp
发明人： KUNIMUNE KOICHI , KUTSUZAWA KICHIYA , KONOTSUNE SHIRO
IPC分类号： C08G73/00 , C08G73/10 , C08G77/42 , C08G77/44 , C08G77/455
CPC分类号： C08G73/106 , C08G77/455
摘要： PURPOSE: The titled precursor which has low viscosity in solution, can be easily cured by baking and can be suitably used for the surface protection, insulation, etc., of electronic parts, comprising specified imide/amic acid chain segments connected with each other through a bonding structure and having specified terminal groups.
CONSTITUTION: A soluble polyimidesiloxane precursor comprising imide/amic acid chain segments of formula I connected with each other through a bonding structure of formula II and having a group of formula III as a terminal group [degree of imidation of 50W100%, a ratio of the number of R
2 's and R
3 's ≥0.1, intrinsic viscosity (in N-methyl-2-pyrolidone at a concentration of 0.5g/dl and a temperature of 30°C) of 0.05W5g/dl]. Examples of I are formulas IV and V, R
1 is a tetravalent carboxylic aromatic group, R
2 is a 2W12C aliphatic group or the like, R
3 is -(CH
2 )
1W4 - or the like, R
4 is a 1W6C alkyl or the like, Y
1 and Y
2 are each alkoxy or the like, and m is 1W3.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：在溶液中具有低粘度的标题前体可以通过烘烤容易地固化，并且可以适用于电子部件的表面保护，绝缘等，其包括通过相互连接的指定的酰亚胺/酰胺链段结合结构并具有特定的端基。构成：包含式I的酰亚胺/酰胺酸链段的可溶性聚酰亚胺硅氧烷前体通过式II的键合结构彼此连接并具有作为末端基团的式III基团[酰亚胺化度为50-100％，比例的R 2和R 3'= 0.1的数量，特性粘度（在N-甲基-2-吡咯烷酮中的浓度为0.5g / dl，温度为30℃）为 0.05-5g / dl]。 I的实例是式IV和V，R 1是四价羧酸芳族基团，R 2是2-12C脂族基团等，R 3是 - （CH 2）1-4 - 或者 R 4为1-6C烷基等，Y 1和Y 2分别为烷氧基等，m为1-3。

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