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    • 85. 发明专利
    • EASY OPEN PACK AND METHOD OF ITS FORMATION
    • JPH03133770A
    • 1991-06-06
    • JP21488790
    • 1990-08-14
    • GRACE W R & CO
    • ANDOREA PII BONJIYAANASUTEIIBUN WAIATSUTO
    • B65B61/06B32B7/06B65B11/50B65B61/02B65D75/30B65D77/20B65D77/38
    • PURPOSE: To delaminate film layers at a portion where a bond strength is low, and make a support harder than a first and a second films by projecting the first and the second films laterally beyond the support to seal both the films and making the bond strength between two layers of the first film close to an interface between the films lower than the bond strength between the films. CONSTITUTION: A bottom of a tray 5 is molded with, for example, an HDPE and covered with an underlying film 1. An overlaid film 6 having a twin-layer structure covers an upper portion of the tray 5 and forms a vacuum skin pack in which an article is set on the tray. Further, the overlaid film 6 is projected laterally and connected to the underlying film 1 at an upper portion of a sealed part S, where the two films are projected beyond the rim of the tray. The film 6 has a lower layer (seal layer 6b) and can be easily sealed to an upper portion 3 of the underlaying film 1. In order that the upper portion 3 of the underlaying film 1 can be reliably raptured at an adjacent part of the corner of the rim of the tray 5, the thickness of the upper portion 3 of the underlying film 1 is much thinner than that of a lower portion 2 of the underlying film (that is, a weak point 4 is formed in the vicinity of a bond between the underlying film 1 and the film 6).