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81. 发明专利

JP5236071B2 Laser processing method, laser processing equipment and processing control device 有权
公开(公告)号：JP5236071B2
公开(公告)日：2013-07-17
申请号：JP2011510136
申请日：2009-04-24
申请人：三菱電機株式会社
发明人：浩一印藤
IPC分类号： B23K26/382 , B23K26/04 , B23K26/046 , B23K26/067
CPC分类号： B23K26/0673 , B23K26/382

82. 发明专利

JP2013132655A Laser soldering system 审中-公开
标题翻译：激光焊接系统
公开(公告)号：JP2013132655A
公开(公告)日：2013-07-08
申请号：JP2011283763
申请日：2011-12-26
申请人： Miyachi Technos Corp , ミヤチテクノス株式会社
发明人： HIRAMATSU SHIGERU , WAKE KOICHI
IPC分类号： B23K1/005 , B23K26/00 , B23K26/067 , B23K26/073 , B23K26/08 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a laser soldering system capable of improving joining quality by managing the intensity ratio of split laser beams while restraining a rise in manufacturing cost of the laser soldering system by splitting a laser beam using a wedge substrate.SOLUTION: The laser soldering system 10A for irradiating a workpiece W with the laser beam LB oscillated from a laser oscillator 14 to perform soldering includes the wedge substrate 42 splitting the laser beam LB into a plurality of laser beams LB1, LB2; a wedge substrate driving control part 82 controlling the incidence amount of the laser beam LB at the wedge substrate by driving the wedge substrate 42 forward and backward with respect to the laser beam LB; and a laser intensity measuring part 50 for acquiring the intensity of the respective split laser beams LB1, LB2. The wedge substrate driving control part 82 drives the wedge substrate 42 based on the intensity of the respective split laser beams LB1, LB2 acquired by the laser intensity measuring part 50.
摘要翻译：要解决的问题：提供一种激光焊接系统，其能够通过使用楔形基板分割激光束来抑制激光焊接系统的制造成本的上升，同时通过管理分割激光束的强度比来提高接合质量。解决方案：用于从激光振荡器14振荡的激光束LB照射工件W进行焊接的激光焊接系统10A包括将激光束LB分割为多个激光束LB1，LB2的楔形基板42; 楔形基板驱动控制部分82通过相对于激光束LB向前和向后驱动楔形基板42来控制楔形基板处的激光束LB的入射量; 以及用于获取各个分割激光束LB1，LB2的强度的激光强度测量部50。楔形基板驱动控制部82基于由激光强度测量部50获取的各分割激光束LB1，LB2的强度来驱动楔形基板42。

83. 发明专利

JP5217113B2 Bonding method and apparatus for joining a metal plate 有权
公开(公告)号：JP5217113B2
公开(公告)日：2013-06-19
申请号：JP2006142337
申请日：2006-05-23
申请人：新日鐵住金株式会社
发明人：泰則伊藤 , 昭博清水
IPC分类号： B23K26/20 , B23K26/067 , B23K26/08 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus of joining metallic sheet materials and a metal plate which are very advantageous in the quality of welding and productivity. SOLUTION: After cutting the respective edge parts of a first metallic sheet material 1 and a second metallic sheet material 2 with two cutting laser beams which are different in cutting speed and run in the same direction, the edge part 21 of the first metallic sheet material and the edge part 22 of the second metallic sheet material are butted and temporary welding is performed by applying the welding laser beam intermittently in the opposite direction to the cutting laser beam for cutting. A welding laser beam for performing normal welding runs behind the welding laser beam for performing the temporary welding. An apparatus embodied in this invention is provided with two arms which are moved along the weld zone, wherein a cutting torch which emits the cutting laser beam and a welding torch which emits the welding laser beam are provided on the arms one by one. COPYRIGHT: (C)2008,JPO&INPIT

84. 发明专利

JP5196778B2 Irradiation optical system and the irradiation device 有权
公开(公告)号：JP5196778B2
公开(公告)日：2013-05-15
申请号：JP2006333748
申请日：2006-12-11
申请人：キヤノン株式会社
发明人：彰宏西尾
IPC分类号： B23K26/067 , B23K26/06 , B23K26/20 , G02B5/04 , G02B13/24
摘要： PROBLEM TO BE SOLVED: To provide an irradiation apparatus capable of simultaneously conducting irradiation of a plurality of points or continuous annular patterns with a simple structure by using a single light source. SOLUTION: The irradiation apparatus is provided with: an image-formation optical system 11, which makes the light irradiated from a light source 10 form an image; a conical prism 12, which is disposed in the image-formation side of the image-formation optical system 11 and radially deflects the light emitted from the image-formation optical system 11; and a reflecting member 13 radially deflecting the light emitted from the conical prism 12 in the optical axis direction by an internal reflection effect and irradiating an object 14 to be irradiated, which is set on the optical axis, with the deflected light. COPYRIGHT: (C)2008,JPO&INPIT

85. 发明专利

JP5193326B2 Substrate processing apparatus and a substrate processing method 有权
公开(公告)号：JP5193326B2
公开(公告)日：2013-05-08
申请号：JP2011040104
申请日：2011-02-25
申请人：三星ダイヤモンド工業株式会社
发明人：郁祥中谷 , 佑磨岩坪
IPC分类号： B23K26/00 , B23K26/04 , B23K26/067 , B23K26/073 , H01L21/301
摘要： The invention provides a substrate processing device and a substrate processing method, which can conduct short pulse laser processing on the surface of the substrate and the internal part of the substrate without increasing scanning times. The substrate processing device comprises a short pulse laser light source (31), a light path branch part (35) which divide a short pulse laser beam into a first light path side and a second light path side, a pulse selection part (39) which converts repetitive oscillation frequency to make the second light path side to conduct repetitive oscillation of a second frequency smaller than the first frequency, an output adjustment part (36) which adjusts in a manner that the output power of the second light path side is larger than that of the first light path side, a light path synthesis part (46) which forms a synthetic laser beam by overlapping the first and second light path sides, a synthetic laser beam irradiation optical part (48) which comprises an object glass (49) and irradiates the synthetic laser beam towards the substrate, and a scanning mechanism which enables the synthetic laser beam to conduct relative scanning.

86. 发明专利

JP2013071135A Laser beam machining apparatus, and method for machining workpiece using the same 有权
标题翻译：激光加工装置及使用其加工工件的方法
公开(公告)号：JP2013071135A
公开(公告)日：2013-04-22
申请号：JP2011210487
申请日：2011-09-27
申请人： Mitsuboshi Diamond Industrial Co Ltd , 三星ダイヤモンド工業株式会社
发明人： KURIYAMA NORIYOSHI
IPC分类号： B23K26/067 , B23K26/06
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus reducing variation in machining accuracy in the case of carrying out machining in two orthogonal directions even if beam profiles are not isotropic with respect to a traveling direction.SOLUTION: The laser beam machining apparatus includes an optical system having: a splitting means for splitting a laser beam emitted from a laser beam source, into a first split beam and a second split beam; a converting means for rotating the beam profile of the second split beam by 90° with the traveling direction as an axis; an optical path-sharing means for sharing an optical path of the first split beam and an optical path of the second split beam passing through the converting means, as one irradiation optical path that leads to a condensing lens; and a selective intercepting means for selectively intercepting the first split beam and the second split beam between the splitting means and the optical path-sharing means. A workpiece fixed to a stage part can be selectively irradiated with one of two kinds of laser beams having the same beam profile and orthogonal to each other by switching the beam to be intercepted by the selective intercepting means.
摘要翻译：要解决的问题：即使在相对于行进方向不是各向同性的情况下，即使在两个正交方向上进行机械加工的情况下，也能减少加工精度的变化的激光加工装置。解决方案：激光束加工装置包括：光学系统，具有：分离装置，用于将从激光束源发射的激光束分离成第一分束和第二分束; 转换装置，用于以行进方向为轴将第二分割光束的光束轮廓旋转90度; 用于共享第一分束光路和通过转换装置的第二分束光路的光路共享装置，作为通向聚光透镜的一个照射光路; 以及选择性拦截装置，用于选择性地拦截分离装置和光路共享装置之间的第一分割光束和第二分割光束。可以通过切换由选择性拦截装置截取的光束，使具有相同光束轮廓并且彼此正交的两种激光束中的一种被选择性地照射固定到台部的工件。版权所有（C）2013，JPO＆INPIT

87. 发明专利

JP5184775B2 Optical processing equipment 有权
公开(公告)号：JP5184775B2
公开(公告)日：2013-04-17
申请号：JP2006320791
申请日：2006-11-28
申请人：リコー光学株式会社
发明人：貴幸石亀
IPC分类号： G02B27/09 , B23K26/06 , B23K26/067 , B23K26/08
摘要： PROBLEM TO BE SOLVED: To obtain a new optical processing device and a condensing optical system used for the optical processing device. SOLUTION: The condensing optical system condensing luminous flux radiated from a minute light radiation part to be two or more dots and/or one or more lines includes: a first collimating lens CL1 arranged so that divergent luminous flux from the minute light radiation part FO may be parallel beams substantially parallel with an optical axis; a second collimating lens CL2 coaxial to the first collimating lens and condensing luminous flux transmitted through the first collimating lens; and a luminous flux changing optical device FT arranged between the first collimating lens and the minute light radiation part and changing the divergent luminous flux from the light radiation part to one or more luminous fluxes crossing the optical axes of the first and the second collimating lenses. At least either the luminous flux changing optical element FT or the second collimating lens can be displaced in the optical axis direction relative to the first collimating lens CL1. COPYRIGHT: (C)2008,JPO&INPIT

88. 发明专利

JP2013010116A Laser beam machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2013010116A
公开(公告)日：2013-01-17
申请号：JP2011144171
申请日：2011-06-29
申请人： Omron Corp , オムロン株式会社
发明人： ASHIHARA KATSUMITSU
IPC分类号： B23K26/00 , B23K26/06 , B23K26/067 , B23K26/08 , H01S3/00
摘要： PROBLEM TO BE SOLVED: To obtain the signals of received luminous quantity that accurately express the strength and the changes of a machining beam.SOLUTION: A laser light, which is led to a head part 2 from a laser light source 10 through an optical fiber 3, is led to a dichroic mirror 22, and the laser light that is reflected with the dichroic mirror 22 is emitted as a machining beam. A photodiode 23 for monitoring the strength of the machining beam and an optical attenuation filter 24 for attenuating the light to be incident on the photodiode 23 are provided on the optical path of the transmitted light from the mirror 22. The designed transmittance of the dichroic mirror 22 is determined under such condition that a difference between the transmittance of a P wave and an S wave, which is caused by an error of the transmitted light quantity, is within tolerance.
摘要翻译：要解决的问题：获得准确表达加工梁的强度和变化的接收光量的信号。解决方案：将通过光纤3从激光源10引导到头部2的激光被引导到二向色镜22，并且由分色镜22反射的激光是作为加工梁发射。在来自反射镜22的透射光的光路上设置有用于监视加工光束的强度的光电二极管23和用于衰减入射到光电二极管23上的光的光衰减滤光器24.二向色镜的设计透射率在由透射光量的误差引起的P波和S波的透射率之差在容许范围内的条件下被确定。版权所有（C）2013，JPO＆INPIT

89. 发明专利

JP5103054B2 Processing method and laser processing apparatus according to the laser 有权
公开(公告)号：JP5103054B2
公开(公告)日：2012-12-19
申请号：JP2007119497
申请日：2007-04-27
申请人：サイバーレーザー株式会社
发明人：将尚鎌田 , 哲実住吉 , 晋辻川
IPC分类号： B23K26/06 , B23K26/00 , B23K26/067 , B23K26/40 , B23K101/40 , G02F1/37 , H01S3/00
摘要： The invention relates to a method that processes efficiently based on ultrashort pulse comprising the steps of: radiating a first laser ultrashort pulse light and a second laser ultrashort pulse to a processing object, wherein the first laser ultrashort pulse light has a first wavelength close to infrared light; the second laser ultrashort pulse has a second wavelength of a ultraviolet band obtained by converting wavelength from the first laser ultrashort pulse light by a non-linear optical crystal unit. Then a time delay of 100s is endowed to the first laser and the first laser is radiated. Therefore, processing efficiency (proportion of processing quantity related to the radiating energy) can be improved and light quantity penetrating the object by the first laser is reduced so as to reduce damage to the substrate, which improves processing quality.

90. 发明专利

JP2012238012A Light irradiation device and light irradiation method 有权
标题翻译：光照射装置和光照射方法
公开(公告)号：JP2012238012A
公开(公告)日：2012-12-06
申请号：JP2012158964
申请日：2012-07-17
申请人： Hamamatsu Photonics Kk , 浜松ホトニクス株式会社
发明人： MATSUMOTO NAOYA , INOUE TAKU , FUKUCHI NORIO , ITO HARUYASU , TAKIGUCHI MASARU
IPC分类号： G03H1/04 , B23K26/00 , B23K26/06 , B23K26/067 , G03H1/08 , G03H1/16
CPC分类号： B23K26/00 , B23K26/0084 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0661 , B23K26/067 , G03H1/2294 , G03H2001/0094 , G03H2225/32
摘要： PROBLEM TO BE SOLVED: To provide a device and method capable of keeping energy of irradiated laser light substantially constant even when a number or a light condensing area of the laser light beams simultaneously irradiated to a plurality of light condensing positions varies depending on a hologram.SOLUTION: A phase modulation type spatial light modulator 20 receives laser light outputted from a laser light source 10, presents a hologram for modulating a phase of the laser light in each of a plurality of pixels two-dimensionally arranged, and outputs the laser light after the phase modulation. A control part 22 corrects a first hologram by having the spatial light modulator 20 present the first hologram, and performing feedback on the first hologram. Correction of the first hologram is performed by: measuring a strength of the laser light condensed at each light condensing position; forming the first hologram again by an iterative Fourier transform method based on a strength at any reference point of each light condensing position to form a second hologram; and presenting the second hologram to the spatial light modulator.
摘要翻译：要解决的问题：提供一种即使当同时照射到多个聚光位置的激光的数量或聚光区域根据不同的聚光位置而变化时，能够保持照射的激光的能量基本上恒定的装置和方法全息图。解决方案：相位调制型空间光调制器20接收从激光光源10输出的激光，呈现用于调制在二维排列的多个像素中的每一个中的激光的相位的全息图，并输出相位调制后的激光。控制部分22通过使空间光调制器20呈现第一全息图并在第一全息图上执行反馈来校正第一全息图。第一全息图的校正通过以下方式来进行：测量在每个聚光位置处聚集的激光的强度; 通过基于每个聚光位置的任何参考点处的强度的迭代傅立叶变换方法再次形成第一全息图以形成第二全息图; 并将第二全息图呈现给空间光调制器。版权所有（C）2013，JPO＆INPIT

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