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81. 发明专利

JP4587732B2 Surface acoustic wave device 有权
公开(公告)号：JP4587732B2
公开(公告)日：2010-11-24
申请号：JP2004220060
申请日：2004-07-28
申请人：京セラ株式会社
发明人：佳史山形 , 裕子横田 , 淳弘飯岡
IPC分类号： H03H9/25 , H01L41/09 , H01L41/18 , H03H9/72
CPC分类号： H03H9/1085 , H01L2224/16225 , H03H9/02574 , H03H9/02614 , H03H9/02952 , H03H9/02984 , H03H9/0576 , H03H9/059 , H03H9/1092 , H03H9/72 , H03H9/725

82. 发明专利

JP2010187373A Composite substrate and elastic wave device using the same 审中-公开
标题翻译：使用该复合基板和弹性波形装置
公开(公告)号：JP2010187373A
公开(公告)日：2010-08-26
申请号：JP2010005401
申请日：2010-01-14
申请人： Ngk Insulators Ltd , 日本碍子株式会社
发明人： SUZUKI KENJI
IPC分类号： H03H9/145 , H03H9/17
CPC分类号： H03H9/02574 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H03H9/02015 , H03H9/02559 , H03H9/059 , H03H9/1085 , H03H9/173 , H03H9/174 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a composite substrate which is utilized for an elastic wave device and is excellent in heat resistance.
SOLUTION: The composite substrate 10 includes a piezoelectric substrate 12 composed of lithium tantalate (LT) capable of propagating an elastic wave, a support substrate 14 composed of silicon joined to the piezoelectric substrate 12 in a (111) orientation plane, and an adhesive layer 16 to join both substrates 12 and 14.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于弹性波装置并且耐热性优异的复合基板。＆lt; P＆gt;解决方案：复合基板10包括由能够传播弹性波的钽酸锂（LT）构成的压电基板12，在（111）取向平面中与压电基板12接合的由硅构成的支撑基板14，以及粘合层16，以连接两个基底12和14。版权所有：（C）2010，JPO＆INPIT

83. 发明专利

JPWO2008114490A1 弾性表面波デバイス有权
公开(公告)号：JPWO2008114490A1
公开(公告)日：2010-07-01
申请号：JP2008533809
申请日：2008-02-29
申请人：パナソニック株式会社
发明人：和紀西村 , 和紀西村 , 島村　徹郎 , 徹郎島村
IPC分类号： H03H9/25 , H03H9/64
CPC分类号： H03H9/725 , H03H9/0576 , H03H9/1078 , H03H9/1085
摘要：弾性表面波デバイスは、ベース基板と、ベース基板の表面に実装された第1と第2の弾性表面波フィルタと、ベース基板の表面に設けられて第1と第2の弾性表面波フィルタとを覆う封止体とを備える。第1と第2の弾性表面波フィルタは、第1と第2の圧電基板をそれぞれ有する。第2の圧電基板は第1の圧電基板に空隙部を介して離れている。この弾性表面波デバイスは弾性表面波フィルタ間のインターモジュレーションを低減する。

84. 发明专利

JP4412123B2 Surface acoustic wave device 有权
公开(公告)号：JP4412123B2
公开(公告)日：2010-02-10
申请号：JP2004263026
申请日：2004-09-09
申请人：エプソントヨコム株式会社
发明人：康秀小野澤
IPC分类号： H03H9/25 , H03H3/08 , H03H9/72
CPC分类号： H03H9/059 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16225 , H01L2924/15174 , H01L2924/16195 , H03H3/02 , H03H9/1078 , H03H9/1085 , Y10T29/42 , H01L2924/00014
摘要： An SAW chip (11) where ones are balanced signal terminals and the others are unbalanced signal terminals is mounted on a mounting board (12) in a flip chip manner, and the mounting board (12) and a surface of the SAW chip are covered with resin (19). At that time, grounds of first and second SAW filters in the SAW chip (11) are connected together and an annular pattern (14) is formed so as to surround a signal pattern of the SAW chip (11) on the mounting board (12) on which the SAW chip (11) is mounted, and the annular electrode (14) is connected to a ground pattern.

85. 发明专利

JP4368930B2 Surface acoustic wave device 有权
公开(公告)号：JP4368930B2
公开(公告)日：2009-11-18
申请号：JP2008329986
申请日：2008-12-25
申请人：パナソニック株式会社
发明人：浩輝佐藤 , 佳宏冨田 , 慶治大西
IPC分类号： H03H9/145 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/312 , H01L41/337 , H03H9/02 , H03H9/10
CPC分类号： H03H9/02984 , H03H9/0222 , H03H9/02566 , H03H9/02574 , H03H9/02629 , H03H9/02669 , H03H9/02834 , H03H9/1071 , H03H9/1085 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135
摘要： A surface acoustic wave element includes a laminated substrate where a first substrate made of a piezoelectric material is laminated over a second substrate made of a material different from that of the first substrate, and at least one pair of comb-shaped electrodes formed on one main plane of the first substrate. A step or a notch is formed on the periphery of the laminated substrate on the side of the first substrate.

86. 发明专利

JP2009147914A Surface acoustic wave filter and surface acoustic wave duplexer 审中-公开
标题翻译：表面声波滤波器和表面声波复用器
公开(公告)号：JP2009147914A
公开(公告)日：2009-07-02
申请号：JP2008265982
申请日：2008-10-15
申请人： Panasonic Corp , パナソニック株式会社
发明人： MITANI DAISUKE , FUJIWARA SHIROJI , NAKAMURA HIROYUKI , HARUBE TOORU
IPC分类号： H03H9/145 , H03H9/25 , H03H9/64 , H03H9/72
CPC分类号： H03H9/02559 , H03H9/0576 , H03H9/1085 , H03H9/6483 , H03H9/725
摘要： PROBLEM TO BE SOLVED: To improve filtering characteristics of a surface acoustic wave filter.
SOLUTION: The surface acoustic wave filter includes: a first terminal 1 at the input side; a second terminal 2 at the output side; a plurality of resonators 3 electrically connected between the first and the second terminals 1 and 2; and a piezoelectric substrate 5 provided on the upper surfaces of the first and second terminals 1, 2 and the plurality of resonators 3. The piezoelectric substrate 5 has a thickness that is not thicker than 0.2 mm.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提高表面声波滤波器的滤波特性。声表面波滤波器包括：输入侧的第一端子1; 输出侧的第二端子2; 电连接在第一和第二端子1和2之间的多个谐振器3; 以及设置在第一和第二端子1,2的上表面上的压电基片5和多个谐振器3.压电基片5的厚度不大于0.2mm。版权所有（C）2009，JPO＆INPIT

87. 发明专利

JP3931767B2 Surface acoustic wave device, a communication device 有权
公开(公告)号：JP3931767B2
公开(公告)日：2007-06-20
申请号：JP2002251950
申请日：2002-08-29
申请人：株式会社村田製作所
发明人：輝久柴原 , 裕一高峰
IPC分类号： H03H9/145 , H03H9/00 , H03H9/25 , H03H9/64
CPC分类号： H03H9/0038 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/16195 , H01L2924/181 , H03H9/0057 , H03H9/02748 , H03H9/059 , H03H9/1071 , H03H9/1078 , H03H9/1085 , H03H9/14532 , H03H9/14547 , H03H9/14576 , H03H9/14582 , H03H9/14588 , H03H9/14597 , H01L2924/00012 , H01L2224/81

88. 发明专利

JP2007020073A Electronic component and its manufacturing method 有权
标题翻译：电子元件及其制造方法
公开(公告)号：JP2007020073A
公开(公告)日：2007-01-25
申请号：JP2005201697
申请日：2005-07-11
申请人： Nippon Dempa Kogyo Co Ltd , 日本電波工業株式会社
发明人： TSUDA TOSHIMASA , ABE SEIJI , SAKAI MINORU , SAKAIRI NATSUHIKO
IPC分类号： H03H9/25 , H01L21/60 , H01L23/02 , H01L23/28 , H03H3/08
CPC分类号： H03H9/1085 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05144 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014 , H03H3/08 , H03H9/02937 , H03H9/059 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To provide an electronic component which is excellent in humidity resistance, ensures electrical connection between electrodes and air-tightness to a sealed area including a vibrating part and further suppresses a large size. SOLUTION: The electronic component includes a vibrating part, a piezoelectric element comprising a first electrode and a wiring board comprising a second electrode on one side of a piezoelectric substrate, wherein the electronic component comprises a vamp provided on one side of the first electrode and the second electrode and connected to another side of the first electrode and the second electrode, an annular first metal layer surrounding the vibrating part, and soldering which is provided along with said first metal layer and of which a fixed phase line temperature is lower than that of the bump with a region, wherein the vibrating part is disposed, as an air-tight space by sealing the first metal layer and the wiring board. Thus, humidity permeation into the air-tight space and outward spreading of the soldering are suppressed and a bump melting and spreading space can be saved. Moreover, electrical connection between electrodes and sealing of the disposing region can be performed in other steps, thereby obtaining high air-tightness. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供耐湿性优异的电子部件，确保电极之间的电连接和包括振动部分的密封区域的气密性，并进一步抑制大尺寸。解决方案：电子部件包括振动部件，压电元件，包括第一电极和布线板，其包括在压电基板的一侧上的第二电极，其中电子部件包括设置在第一电极的一侧上的波峰电极和第二电极，并且连接到第一电极和第二电极的另一侧，围绕振动部分的环形第一金属层，以及与所述第一金属层一起设置并且固定相线线路温度较低的焊接比通过密封第一金属层和布线板的具有通过密封第一金属层和布线板的气密空间设置振动部的区域的突起的凸起。因此，抑制了进入气密空间的湿气渗透和焊接的向外扩散，并且可以节省凸块熔化和扩展空间。此外，电极之间的电连接和布置区域的密封可以在其他步骤中进行，从而获得高气密性。版权所有（C）2007，JPO＆INPIT

89. 发明专利

JP2006042008A Surface acoustic wave element and communication apparatus 有权
标题翻译：表面声波元件和通信装置
公开(公告)号：JP2006042008A
公开(公告)日：2006-02-09
申请号：JP2004220060
申请日：2004-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： YOKOTA HIROKO , YAMAGATA YOSHIFUMI , IIOKA ATSUHIRO
IPC分类号： H03H9/25 , H01L41/09 , H01L41/18 , H03H9/72
CPC分类号： H03H9/1085 , H01L2224/16225 , H03H9/02574 , H03H9/02614 , H03H9/02952 , H03H9/02984 , H03H9/0576 , H03H9/059 , H03H9/1092 , H03H9/72 , H03H9/725
摘要： PROBLEM TO BE SOLVED: To solve a problem that an isolation characteristic is insufficient in a surface acoustic wave element, in which a transmitter-side filter and a receiver-side filter are formed on the same piezoelectric substrate. SOLUTION: In the surface acoustic wave element: a transmitting side filter area 12 and a receiving side filter area 14 which are respectively provided with oscillation electrodes 3, input pad parts 5, 7 and output pad parts 6, 8 are formed on one main surface of a first substrate 2 consisting of a piezoelectric substance; one main surface of a second substrate 21 consisting of a material having a dielectric constant smaller than that of the first substrate 2 is joined with the other main surface of the first substrate; and a conductive layer 22 is formed on the whole surface of the other main surface of the second substrate 21. Consequently parasitic capacitor formed between the input pad part 5 of the transmitting side filter area 12 and the output pad part 8 of the receiving side filter area 13 can be reduced by reducing the effective dielectric constant of the substrates and the isolation characteristic can be improved. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了解决在同一压电基板上形成有发送侧滤波器和接收侧滤波器的表面声波元件的隔离特性不足的问题。解决方案：在声表面波元件中，分别设置有振荡电极3，输入焊盘部分5,7和输出焊盘部分6,8的发射侧滤波器区域12和接收侧滤波器区域14形成在由压电体构成的第一基板2的主表面; 第二基板21的一个主表面由第一基板的另一个主表面与第一基板2的介电常数小的材料组成。并且在第二基板21的另一个主表面的整个表面上形成导电层22.因此，形成在发送侧滤波器区域12的输入焊盘部分5和接收侧滤波器的输出焊盘部分8之间的寄生电容器可以通过降低基板的有效介电常数来减小区域13，并且可以提高隔离特性。版权所有（C）2006，JPO＆NCIPI

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