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    • 81. 发明专利
    • Vapor growth device
    • 蒸气生长装置
    • JP2008047597A
    • 2008-02-28
    • JP2006219383
    • 2006-08-11
    • Nuflare Technology Inc株式会社ニューフレアテクノロジー
    • SUZUKI KUNIHIKOMORIYAMA YOSHIKAZU
    • H01L21/205C23C16/44
    • PROBLEM TO BE SOLVED: To provide a new vapor growth device with significantly improved safety.
      SOLUTION: The vapor growth device is provided with: a first channel which supplies gas required for film-formation so as to form a film on a wafer stored in a chamber 103 by a vapor growth method; a second channel which supplies cleaning gas into the chamber in order to clean inside the chamber; and a third channel for exhausting the gas in the chamber. A fourth channel is provided in parallel with the third channel. A gas storage having almost the same atmosphere as that in the chamber is connected to the fourth channel. An exhaust pump is connected to one side of the gas storage. A gas measuring device for measuring a gas atmosphere in the gas storage is connected to the other side of the gas storage.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种具有显着提高的安全性的新型蒸汽增长装置。 气相生长装置设置有:第一通道,其提供成膜所需的气体,以便通过气相生长法在存储在室103中的晶片上形成膜; 第二通道,其将净化气体供应到所述室中以在所述室内部进行清洁; 以及用于排出腔室中的气体的第三通道。 第四通道与第三通道并联设置。 具有与室中几乎相同气氛的气体储存器连接到第四通道。 排气泵连接到气体储存器的一侧。 用于测量气体存储器中的气体气氛的气体测量装置连接到气体存储器的另一侧。 版权所有(C)2008,JPO&INPIT
    • 82. 发明专利
    • Cleaning method of exhausting portion in vapor-phase growth apparatus
    • 蒸汽相生长装置中排气部分的清洗方法
    • JP2008021829A
    • 2008-01-31
    • JP2006192459
    • 2006-07-13
    • Nuflare Technology Inc株式会社ニューフレアテクノロジー
    • SUZUKI KUNIHIKOITO HIDEKI
    • H01L21/205C23C16/44
    • PROBLEM TO BE SOLVED: To provide a cleaning method of an exhausting portion (the vicinity of the pressure control valve of the valve of a vapor-phase growth apparatus), in the vapor-phase growth apparatus wherein the automatic control of its pressure control valve can be performed by the pressure of its chamber.
      SOLUTION: In the vapor-phase growth apparatus, the control of the cleaning of reactive byproducts 110 stuck to the vicinity of the pressure control valve of a valve 105 is so determined by the angle of the pressure control valve which is caused by the change of the quantity of the reactive byproducts 110 as to complete the cleaning, when the angle of the pressure control valve becomes nearly equal to the angle of it having before a film formation.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供在气相生长装置中的排气部分(气相生长装置的阀的压力控制阀附近)的清洁方法,其中对其进行自动控制 压力控制阀可以通过其室的压力进行。 解决方案:在气相生长装置中,粘附在阀105的压力控制阀附近的反应性副产物110的清洁的控制是由压力控制阀的角度决定的,压力控制阀由 当压力控制阀的角度几乎等于其在成膜之前的角度时,反应性副产物110的量的改变以完成清洁。 版权所有(C)2008,JPO&INPIT
    • 83. 发明专利
    • DEPOSITION DEVICE
    • JP2010225731A
    • 2010-10-07
    • JP2009069602
    • 2009-03-23
    • NUFLARE TECHNOLOGY INC
    • SUZUKI KUNIHIKOYAJIMA MASAMIIKETANI NAOHISA
    • H01L21/205C23C16/458
    • PROBLEM TO BE SOLVED: To reliably inhibit entry of reaction gas of a rotating mechanism 7 in a deposition device that supplies a deposition chamber 1, containing a susceptor for placing a substrate with the reaction gas, and forms a film on a surface of the substrate, to whose upper end a supporting member for a susceptor is connected, and has a rotary shaft 6 extending downward through a through-hole 1c opened at the bottom wall 1a of the deposition chamber, and a rotating mechanism for the rotary shaft arranged below the deposition chamber. SOLUTION: The rotating mechanism 7 has a bearing 9 arranged with a cylinder-shaped pressing member 8 installed between the bottom surface of bottom wall 1a of the deposition chamber 1 and itself, and a drive source 10 arranged down below the bearing 9. While there are formed on the pressing member 8 an annular distribution chamber 13 and an inlet 14 for introducing a purging gas into the distribution chamber 13 from one place around its periphery, there are formed two or more nozzle holes 15 for spouting the purge gas from the distribution chamber 13 to a clearance gap between the pressing member 8 and the rotary shaft 6 by having an clearance in a circumferential direction. COPYRIGHT: (C)2011,JPO&INPIT
    • 85. 发明专利
    • Control device for liquid level position
    • JP2004030367A
    • 2004-01-29
    • JP2002187299
    • 2002-06-27
    • Denso Corp株式会社デンソー
    • SUZUKI KUNIHIKOSAKAI HIROMI
    • G05D9/02
    • PROBLEM TO BE SOLVED: To provide a control device for liquid level position which requires no motive power to adjust the liquid level of test fluid and prevents the test liquid from being volatilized resulting from heating, an environment from becoming worse owing to volatilization, and the test fluid from being oxidized by coming into contact with oxygen.
      SOLUTION: A port 43 is opened at a predetermined position which is installed as the liquid level of the test fluid in a storage part 20. When the liquid level of the test fluid becomes higher than the port 43, the port 43 is closed to stop supplying nitrogen from the storage part 20 to a liquid tank 30, so the pressure in the storage part 20 rises and the test fluid reflows to the liquid tank 30. When the liquid level position of the test fluid becomes lower than the port 43, on the other hand, the port 43 is opened to supply nitrogen from the storage part 20 to the liquid tank 30, so the pressure in the liquid tank 30 rises to supply the test fluid to the storage part 20. Consequently, the liquid level position of the test fluid can be adjusted to the constant position by pressure balance of nitrogen without any motive power.
      COPYRIGHT: (C)2004,JPO
    • 87. 发明专利
    • FLOW RATE INSPECTION METHOD AND ITS DEVICE
    • JP2004011452A
    • 2004-01-15
    • JP2002162584
    • 2002-06-04
    • DENSO CORP
    • SAKAI HIROMISUZUKI KUNIHIKO
    • F02M37/08F02M65/00F04B51/00F04D15/00
    • PROBLEM TO BE SOLVED: To provide a flow inspection method requiring no air purging process and a shorter period for inspection and allowing highly accurate measurement of a flow rate, and its device. SOLUTION: A fuel pump 2 is depressurized prior to the measurement of the flow rate of a test fluid discharged from the fuel pump 2, as an inspected object. A complicated-shape fluid flow path formed in the fuel pump 2 is therefore depressurized and the test fluid stored in a tank 41 at the atmospheric pressure is filled in the depressurized fluid flow path. As a result, the residence of air in the form of air bubbles in the fluid flow path is avoided and no air purging process is required, permitting the measurement of the discharge flow rate to be started together with the energization of the fuel pump 2. Since the residence of air in the fluid flow path is avoided, the degradation of the measurement accuracy of the flow rate due to the generation of the air bubbles is prevented. Furthermore, the test fluid is supplied from the tank 41 to the fuel pump 2 with a pressure difference, and so no motive power is required. COPYRIGHT: (C)2004,JPO
    • 89. 发明专利
    • ROTATION DETECTING APPARATUS
    • JP2000321093A
    • 2000-11-24
    • JP12863999
    • 1999-05-10
    • DENSO CORP
    • WATANABE YUSUKESEKO MAKOTOSUZUKI KUNIHIKOYASUDA TOSHIYA
    • G01P1/02G01B7/00G01B7/30G01D5/14G01D5/245G01P3/488
    • PROBLEM TO BE SOLVED: To enhance the cost property, the mass productivity and the reliability of a rotation detecting apparatus. SOLUTION: A circuit board 17 is installed inside a sensor housing 11. Circuit components such as a capacitor 18, a resistance 19 and the like are mounted on the circuit board 17. A flexible printed interconnection 21 is connected by an anisotropic conductive film 22 to the tip part of the circuit board 17. In addition, a Hall IC 23 is connected by an anisotropic conductive film 24 to the tip part of the flexible printed interconnection 21. The Hall IC 23 is arranged on the front side of a bias magnet 20. By this constitution, since the Hall IC 23, the flexible printed interconnection 21 and the circuit board 17 are connected by the anisotropic conductive films 24 and 22, their connecting operation can be performed by a heating and compression bonding method which is excellent in mass productivity, and the productivity of this rotation detecting apparatus can be enhanced. In addition, since a mold molding operation is not required, it is possible to solve a problem that the soldered part of the circuit components is melted and disconnected due to heat in the mold molding operation.