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81. 发明专利

JP4846572B2 Multilayer printed wiring board 有权
公开(公告)号：JP4846572B2
公开(公告)日：2011-12-28
申请号：JP2006514021
申请日：2005-05-26
申请人： Jsr株式会社 , イビデン株式会社
发明人：俊樹古谷 , 伸一郎岩永 , 宏文後藤 , 隆苅谷
IPC分类号： H05K3/46 , H01L21/60 , H01L23/12 , H01L23/498 , H05K1/02 , H05K3/28 , H05K3/40
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L2224/16 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H05K1/0271 , H05K1/0373 , H05K1/115 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0133 , H05K2201/0367 , H05K2201/068 , H05K2201/10674
摘要： A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

82. 发明专利

JP4654958B2 Method of manufacturing a positive-type radiation-sensitive resin composition, and the transfer film and plating shaped object 有权
标题翻译：空值
公开(公告)号：JP4654958B2
公开(公告)日：2011-03-23
申请号：JP2006099891
申请日：2006-03-31
申请人： Jsr株式会社
发明人：伸一郎岩永 , 健一横山
IPC分类号： G03F7/039 , G03F7/004 , G03F7/40 , H01L21/027

83. 发明专利

JP4640037B2 Positive-type photosensitive insulating resin composition and the cured product 有权
标题翻译：空值
公开(公告)号：JP4640037B2
公开(公告)日：2011-03-02
申请号：JP2005240038
申请日：2005-08-22
申请人： Jsr株式会社
发明人：淳史伊藤 , 伸一郎岩永 , 宏文後藤 , 健一横山 , 克巳猪俣
IPC分类号： G03F7/023 , G03F7/004

84. 发明专利

JP4403627B2 Method of manufacturing a positive-type radiation-sensitive resin composition and plating shaped object 有权
公开(公告)号：JP4403627B2
公开(公告)日：2010-01-27
申请号：JP2000090853
申请日：2000-03-29
申请人： Jsr株式会社
发明人：淳史伊藤 , 克太田 , 伸一郎岩永
IPC分类号： G03F7/039 , C08J5/18 , C08L29/10 , C08L101/02 , G03F7/004 , G03F7/033 , G03F7/38 , G03F7/40 , G03F7/42 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition giving a pattern free of cracking even in plating and even by washing and drying after plating, capable of precisely forming a thick plated/shaped body such as a bump or wiring and excellent also in sensitivity, resolution, etc., and a method for producing the plated/shaped body using the composition. SOLUTION: The positive type radiation sensitive resin composition contains (A) a polymer having an acid dissociable functional group which is dissociated by an acid to form an acidic functional group, (B) a poly(vinyl lower alkyl ether), (C) a component which generates the acid when irradiated and (D) an organic solvent. The composition is also used as a positive type radiation sensitive resin film. The plated/shaped body is produced through a step for carrying out electroplating using a pattern formed on a substrate from the composition or the resin film as a template.

85. 发明专利

JP4258889B2 Diazodisulfone compounds and radiation-sensitive resin composition 有权
公开(公告)号：JP4258889B2
公开(公告)日：2009-04-30
申请号：JP13922299
申请日：1999-05-19
申请人： Jsr株式会社
发明人：英一小林 , 伸一郎岩永 , 健一横山 , 勇王
IPC分类号： C07C317/28 , C07D317/72 , C07D319/08 , C08K5/41 , C08L25/18 , G03F7/004

86. 发明专利

JP4218675B2 Semiconductor device fabrication for the radiation-sensitive resin composition 有权
标题翻译：空值
公开(公告)号：JP4218675B2
公开(公告)日：2009-02-04
申请号：JP2005325737
申请日：2005-11-10
申请人： Jsr株式会社
发明人：伸一郎岩永 , 晴生岩沢 , 徹梶田 , 充史諏訪
IPC分类号： G03F7/004 , G03F7/039 , H01L21/027

87. 发明专利

JP4186237B2 Method of manufacturing a hydroxystyrene esters 失效
公开(公告)号：JP4186237B2
公开(公告)日：2008-11-26
申请号：JP14454997
申请日：1997-05-20
申请人： Jsr株式会社
发明人：伸一郎岩永 , 和雄河口
IPC分类号： B01J31/04 , C07C67/24 , C07B61/00 , C07C69/157
CPC分类号： Y02P20/52

88. 发明专利

JP4103270B2 Conductive paste composition, methods of use thereof, and a circuit board 有权
公开(公告)号：JP4103270B2
公开(公告)日：2008-06-18
申请号：JP31067599
申请日：1999-11-01
申请人： Jsr株式会社
发明人：英明増子 , 伸一郎岩永 , みのり近藤 , 里美長谷川
IPC分类号： H01B1/22 , H05K1/09 , C08F20/26 , C08K3/00 , C08K5/00 , C08K7/16 , C08L63/00 , C08L101/00 , C08L101/06 , C09D5/24 , C09D7/12 , C09D17/00 , C09D133/14 , C09D157/10 , C09D187/00
CPC分类号： Y02P20/582
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste composition, its using method and a circuit board using it, suitable for forming bump electrodes or the like and superior in coatability and anti-sag property during thermosetting. SOLUTION: This conductive paste composition contains (A) a conductive powder, (B) an epoxy group-containing polymer having units derived from compounds having an ethylenic double bond and an epoxy group in one molecule, with a weight average molecular weight within a range of 10,000 to 500,000, (C) a thermosetting resin, and (D) a solvent.

89. 发明专利

JP4062713B2 Positive-type radiation-sensitive resin composition 失效
公开(公告)号：JP4062713B2
公开(公告)日：2008-03-19
申请号：JP4981198
申请日：1998-03-02
申请人： Jsr株式会社
发明人：英一小林 , 伸一郎岩永 , 健一横山 , 勇王
IPC分类号： G03F7/004 , H01L21/027 , G03F7/039
摘要： PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition having a high transmission factor and a small sublimation property against KRF light, stable under the existence of trace base, having high resolution and high sensitivity, and capable of controlling line width with good accuracy by containing a specific radiation-sensitive acid forming agent and an alkali-insoluble or alkali- slightly soluble resin having an acid dissociation protective group and becoming alkali-soluble when the acid dissociation protective group is dissociated. SOLUTION: This positive radiation-sensitive resin composition contains a radiation-sensitive acid forming agent expressed by a formula I and an alkali- insoluble or alkali-slightly soluble resin having an acid dissociation protective group and becoming alkali-soluble when the acid dissociation protective group is dissociated. In the formula I, R and R are a monovalent organic group, and one of them has ester bond (-COO-) or an alcoholic hydroxyl group. This resin contains a repeating unit expressed by a formula II or III, where R -R indicate a hydrogen atom or a methyl group, R indicates a straight chain or branch alkyl group having carbon atoms of 1-4, and R indicates a straight chain or branch alkyl group having carbon atoms of 1-6 or a cyclic alkyl group having carbon atoms of 5-8.

90. 发明专利

JP4026220B2 Radiation-sensitive resin composition 失效
公开(公告)号：JP4026220B2
公开(公告)日：2007-12-26
申请号：JP8806598
申请日：1998-03-17
申请人： Jsr株式会社
发明人：伸一郎岩永 , 克巳猪俣 , 将宏秋山
IPC分类号： G03F7/022 , H01L21/027 , G03F7/023
摘要： PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition having high resolution and good focus allowance and a rectangular resist pattern profile and restrained from occurrence of pattern defects after development by incorporating an alkali-soluble novolak resin and the quinonediazidosulfonic acid ester compound of a specified phenol compound. SOLUTION: The radiation sensitive resin composition contains the alkali- soluble novolak resin and the quinonediazidosulfonic acid ester compound of the phenol compound represented by formula I and/or II in which each of R1 -R9 is an H atom or a hydroxy or alkoxy or hydroxyalkoxy group; at least one of each group of R1 -R3 , R4 -R6 , and R7 -R9 is a hydroxyalkoxy group; each of A1 -A8 is an alkyl group; and each of B1 -B4 is, independently, an H atom or an alkyl group. The alkali-soluble novolak resin has an average molecular weight of, preferably, 2,000-20,000 in terms of polystyrene.

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