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    • 71. 发明专利
    • METHOD AND DEVICE FOR CONTROLLING BAND SAW IN BAND SAW MACHINE
    • JPH08243837A
    • 1996-09-24
    • JP8443695
    • 1995-03-06
    • SAITO SEIKI KK
    • SAITO MINORU
    • B23D55/00B23D59/04
    • PURPOSE: To prevent generation of metal fatigue and thermal expansion in a band saw due to a repeated load, by pressing a curve protruding side to a sinking side to reset the band saw to a linear shape by an external pressure acting in a side face of the band saw, relating to curving an adjacent part to a cut object of the band saw in a side face direction. CONSTITUTION: When a band saw 5 is curved to the right (left end face is sunk right end face is protruded), a detector 11a, increasing a distance to a sinking left side face of the band saw 5 longer than at linear shape time, generates an electric signal of level, in accordance with this distance, output. This output signal is given to an adjusting valve 16c in a curve protruding right side face of the band saw 5, to increase a pressure of fluid 15 higher than a fixed pressure of the fluid 15 in a sinking side so as to press a curve right protruding side of the band saw 5 to the left. In this way, the band saw 5 is reset to a straight line condition, also to be positioned without coming into contact within a clearance 13 between control units 12a, 12b, so as to fill inside the periphery and a hole 8 with the fluid 15.
    • 73. 发明专利
    • MANUFACTURE OF WAFER
    • JPH071442A
    • 1995-01-06
    • JP14769493
    • 1993-06-18
    • SHINETSU CHEMICAL CO
    • FUJIMURA YORITOSHIBANO YUKIO
    • B24B27/06B23D59/04B24B49/14B28D1/02B28D1/22B28D5/04H01L21/304
    • PURPOSE:To obtain a highly accurate wafer of little surface undulation and thickness irregularity by suppressing the temp. rise of an abrasive grain slurry by controlling the temp. in the close vicinity of the surface of the roller of a wire saw for cutting an ingot. CONSTITUTION:An abrasive grain slurry 12 controlled in its temp. is allowed to directly flow to a roller 2 and the temp. control of the slurry 12 is performed directly under the roller 2 by a temp. sensor 5. When the temp. rise of the abrasive grain slurry 12 caused by the generation of heat in an ingot 3 and a wire saw 1 is detected by the sensor 5, the abrasive grain slurry 12 cooled by a heat exchanger 10 is immediately supplied from a slurry tank 6 by a slurry supply pump 8 and rapid temp. control can be performed without generating a time lag. In the case of ON/OFF control, when a cooled slurry supply valve 15 is turned ON/OFF little by little, the temp. control directly under the roller 2 is extremely reduced in temp. change rate as compared with the temp. control in the slurry tank 6 and the deflection of the roller is stabilized and cutting accuracy is enhanced.