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    • 76. 发明专利
    • Resin composition containing aromatic polyisocyanate compound, bisphenol type epoxy resin and imidazole compound, and highly heat-resistant isocyanurated cured product using the same
    • 含有芳香族聚异氰酸酯化合物的环氧树脂组合物,双酚型环氧树脂和咪唑化合物,以及使用其的高耐热异氰酸酯固化产物
    • JP2013095772A
    • 2013-05-20
    • JP2011237019
    • 2011-10-28
    • Nippon Steel & Sumikin Chemical Co Ltd新日鉄住金化学株式会社
    • YOKOYAMA NAOKI
    • C08G18/20
    • C08G18/2027C08G18/003C08G18/7664C08G2105/02
    • PROBLEM TO BE SOLVED: To settle the problem that, in a resin composition comprising an aromatic polyisocyanate compound (A), a bisphenol type epoxy resin (B) and an imidazole compound (C), when heating and curing the liquid resin composition having a high isocyanate ratio of ≥2 mole ratio of isocyanate groups to epoxy groups, foams are present in the cured products, and when preparing the resin composition, a gelled body is sometimes generated.SOLUTION: It is found that, in the case of providing a resin composition in which the mole ratio of isocyanate groups to epoxy groups is ≥2, preferably in a range of ≥2 and ≤15, and the compounding rate of (C) relative to the total weight of (A)+(B)+(C) is in a range of 0.2-0.8 wt.%, by stir-mixing (C) and (B), adding (A), stir-mixing again, and vacuum-degassing to prepare, a highly heat-resistant isocyanurated cured product having a glass transition temperature of ≥250°C, forming no gel and containing no bubble in the cured product can be obtained by heat-curing the resin composition.
    • 解决的问题为了解决在包含芳族多异氰酸酯化合物(A),双酚型环氧树脂(B)和咪唑化合物(C)的树脂组合物中,当加热和固化液体树脂 异氰酸酯基与环氧基的异氰酸酯比率高于2摩尔%的组合物,固化物中存在泡沫体,制备树脂组合物时有时产生凝胶体。 解决方案:发现在提供异氰酸酯基与环氧基的摩尔比≥2,优选在≥2和≤15的范围内的树脂组合物的情况下,( (A)+(B)+(C)的总重量相对于(A)+(B)+(C)的总重量在0.2-0.8重量%的范围内,通过搅拌(C)和(B) 再次进行真空脱气,制备玻璃化转变温度≥250℃的高耐热异氰脲酸固化产物,在固化物中不形成凝胶,不产生气泡,可以通过热固化树脂组合物 。 版权所有(C)2013,JPO&INPIT