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71. 发明专利

JPH0726365A MATERIAL-FLYING DEVICE, THIN FILM FORMING DEVICE AND METHOD FOR CLEANING MATERIAL-FLYING DEVICE 失效
公开(公告)号：JPH0726365A
公开(公告)日：1995-01-27
申请号：JP19539093
申请日：1993-07-12
申请人： SONY CORP
发明人： KAKINUMA MASAYASU , AIURA MIKIO , KAMAGAMI KAZUYOSHI , HAYASHI HIROSHI
IPC分类号： C23C14/00 , G11B5/85 , H01F41/20
摘要： PURPOSE:To easily clean off and handle a deposited flying metal by freely attachably and detachably providing a bolt and a flying metal deposition preventing piece on the ceiling wall of the deposition preventing plate surrounding a vaporization source generating the flying metal. CONSTITUTION:A vaporization source 3 of a Co-Ni alloy, etc., arranged in a deposition preventing plate 5 is irradiated with an electron beam, heated and vaporized, and the generated flying metal is supplied from a window 5a and deposited on a base film 14 traveling on a cooling roll 2 to form a thin film. In this material-flying device of the thin film forming device, a bolt 10A and plural bolts 10B piercing the through-hole 6C are fastened to the inner wall surface with nuts 11 at the upper part in the deposition preventing plate 5, and a flying metal deposition preventing piece 9 is fixed to the bolt 10A. The piece 9 consists, for example, of a stationary part 9b fixed detachably to the inner wall surface and a masking part 9a suspended from the inner wall surface toward the vaporization source. The deposited flying metal layers 12 and 13 in the deposition preventing plate 5 are cleaned off by loosening the nuts 11 and extracting the bolts 10A and 10B from the through-hole 5C.

72. 发明专利

JPH06174199A CONNECTING DEVICE FOR LIQUID CIRCULATING PIPE 失效
公开(公告)号：JPH06174199A
公开(公告)日：1994-06-24
申请号：JP35350092
申请日：1992-12-14
申请人： SONY CORP
发明人： KAKINUMA MASAYASU , ISHIKAWA HIROYUKI , KIN YASUNORI
IPC分类号： F17D1/08 , F16L55/07
摘要： PURPOSE:To prevent liquid from leaking out and scattering by constituting a device such that residual fluid in a fluid circulating pipe can be extruded to a tank side by blowing compressed air after closing an opening/closing valve in each fluid circulating pipe when detached a connector provided in each connecting end of the paired fluid circulating pipes. CONSTITUTION:In the case of applying to a device for performing delivery of cooling water, when separated a supply side unit P of cooling water from a receiving side unit Q of cooling water, first solenoid valves 5, 6, 12, 13 are closed, to stop circulating the cooling water. Next, solenoid valves 25, 26 of cooling water residual discharge pipes 23, 24 are opened, and also opening a solenoid valve 22 of a compressed air blow pipe 19. In this way, compressed air from a compressed air source 20 is blown into a water supply pipe 8 and a drain pipe 9, left with liquid, through connectors 21, 18 and check valves 16, 17, and the residual liquid is extruded toward the supply side P to flow out into a tank 27 via the residual liquid discharge pipes 23, 24. And then, the solenoid valves 22, 25, 26 are closed to respectively separate connectors 3, 10; 4, 11; 21, 18.

73. 发明专利

JPH06108251A METHOD AND DEVICE FOR CLEANING ROTATING DRUM 失效
公开(公告)号：JPH06108251A
公开(公告)日：1994-04-19
申请号：JP28248792
申请日：1992-09-28
申请人： SONY CORP
发明人： ISHIKAWA HIROYUKI , KAKINUMA MASAYASU , KIN YASUNORI , KATO YOSHIKATSU
IPC分类号： B24C1/00 , C23C14/00 , C23C14/56 , G11B5/85
摘要： PURPOSE:To efficiently remove vapor-deposited materials stuck to the surface of a rotating drum in a vapor-deposition tape generating device. CONSTITUTION:The cleaning device for rotating drum which removes vapor- deposited materials stuck to the surface of a rotating drum 1 in the vapor deposition tape generating device is provided with a vapor-deposited material removing means 15 which is in close contact with the surface of the rotating drum 1 and is moved on this surface throughout in the breadthwise direction while following it, and this vapor-deposited material removing means 15 is pressed to the surface of the rotating drum from the direction opposite to the growing direction of a vapor deposition layer formed by stuck vapor-deposited materials. The vapor-deposited material removing means 15 deeply bites into the vapor deposition layer to increase the quantity of vapor-deposited materials removed by one operation, and the work efficiency is improved.

74. 发明专利

JPH05156437A VAPOR DEPOSITION DEVICE 失效
公开(公告)号：JPH05156437A
公开(公告)日：1993-06-22
申请号：JP34926691
申请日：1991-12-06
申请人： SONY CORP
发明人： KAKINUMA MASAYASU
IPC分类号： C23C14/52
摘要： PURPOSE:To enable the long-term continuous use of the vapor deposition device and to facilitate cleaning of a peep window. CONSTITUTION:A table 29 is freely rotatably provided concentrically on a rotary slit plate 25 of an electronic flash scope 21 and 6 pieces of holes 30 are provided concentrically on the table 29. Glass plates 31 are attachably and detachably mounted to the respective holes 30. The glass plates 31 are positioned concentrically on the peep window 33. The table 29 is rotated and the peep window 33 is shielded with the fresh glass plate 31 when one of the glass plates 31 is stained.

75. 发明专利

JP2000323567A METHOD OF FORMING ELECTRODE AND FUNCTIONAL FILM OBTAINED THEREBY 失效
公开(公告)号：JP2000323567A
公开(公告)日：2000-11-24
申请号：JP12604899
申请日：1999-05-06
申请人： SONY CORP
发明人： KAKINUMA MASAYASU , KAWASHIMA TOSHITAKA , ISHIKAWA HIROKAZU
IPC分类号： H01L21/302 , H01L21/3065 , H01L21/3213 , H01L21/768
摘要： PROBLEM TO BE SOLVED: To provide an electrode formation method which can surely connect a functional film requiring conductivity with an external conductive member, and a functional film obtained thereby. SOLUTION: A base material 11, which has a functional film being a work, is carried to below a vacuum vessel 14 by carriage means and is positioned in a processing position. After positioning of the base material 11, the vacuum vessel 14 is lowered, and an opening 18 sticks fast to the region of an SiO2 film 13 to be removed. In this condition, an exhaust valve 16 is opened to evacuate the inside of the vacuum vessel 1. Then, when the interior of the vacuum vessel 14 comes to a prescribed vacuum level, a gas inlet valve 17 is opened to introduce CF4 gas into the vacuum vessel 14 for etching. Then, a metallic layer formed at the removal section of the SiO2 film 13 by the same processing.

76. 发明专利

JP2000313957A SPUTTERING CATHODE AND SPUTTERING SYSTEM 失效
公开(公告)号：JP2000313957A
公开(公告)日：2000-11-14
申请号：JP12009699
申请日：1999-04-27
申请人： SONY CORP
发明人： OMI MOTOSUKE , KAKINUMA MASAYASU , KAWASHIMA TOSHITAKA
IPC分类号： H01L21/203 , C23C14/35
摘要： PROBLEM TO BE SOLVED: To provide a sputtering cathode in which the region of a magnetic flux parallel to the face of a target is widen without increasing its scale, the utilizing effeiciency of the target is improved, and film formation can be executed at a high speed with high efficiency and high uniformity and to provide a sputtering system. SOLUTION: In a cathode housing 6, the back sides of a target 4 and a backing plate 5 are deposited with inner circumferential magnets 10 and outer circumferential magnets 11. In this depositing constitution, the cylindrical inner circumferential magnets 10 are deposited slantly to the inside and the cylindrical outer circumferential magnets 11 to the outside by plural pieces on the circumference, and they are fitted to a magnet fitting board. The surfaces of the edge parts of the mutual magnetic poles of the inner circumferential magnets 10 and the outer circumferential magnets 11 have reverse polarity. The magnetic flux goes out from the inner circumferential magnet 10, once widens, goes out from the surface of the target 4, again widens and progresses toward the outer circumferential magnet 11.

77. 发明专利

JP2000311882A LOCAL VACUUM TREATING APPARATUS 失效
公开(公告)号：JP2000311882A
公开(公告)日：2000-11-07
申请号：JP12063299
申请日：1999-04-27
申请人： SONY CORP
发明人： KAKINUMA MASAYASU , KAWASHIMA TOSHITAKA
IPC分类号： H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To obtain a local vacuum treating apparatus with a structure, where a stable vacuum treatment can be performed to a material to be worked, the cycle time for vacuum treatment is also comparatively short, and is simple in the structure. SOLUTION: A material 1 to be worked is positioned at a prescribed position, and after that an inert gas is introduced from an inert gas inlet vent 6 into a vacuum bath 3 and in a state that the air pressure in the tank 3 is increased higher than the atmospheric pressure, an arm 13 of a valve part 10 is rotated in the counterclockwise direction by 90 degrees centered around a fulcrum shaft 12 to make a valve body 11 separate from an aperture 2, the bath 3 is descendingly moved to the position of the material 1 to shut the aperture 1 with the material 1, and after that, etching of the projected region part of the aperture 2 on the material 1 is performed. Then, in a state in which inert gas is introduced from the vent 6 into the tank 3 and the air pressure in the tank 3 is increased higher than the atmospheric pressure, the arm 13 is rotated in the clockwise direction by 90 degrees, and the valve body 11 is closely adhered uniformly to an O-ring 7 to shut the aperture 2. For this, the surface of an electrode part 5 is not oxidized by oxygen in the atmosphere.

78. 发明专利

JP2000017437A DEPOSITION APPARATUS 失效
公开(公告)号：JP2000017437A
公开(公告)日：2000-01-18
申请号：JP18637298
申请日：1998-07-01
申请人： SONY CORP
发明人： ISHIKAWA HIROKAZU , KAKINUMA MASAYASU
IPC分类号： C08J7/06 , C23C14/10 , C23C14/54 , C23C14/56
摘要： PROBLEM TO BE SOLVED: To provide a deposition apparatus capable of depositing an adhesive layer having sufficient adhesive power and good transmittance by maintaining a low partial pressure of the moisture in a deposition chamber. SOLUTION: This apparatus has a cooling drum 7 for cooling a roll film 5 by bringing the film into contact with the surface in the central part of a sputtering chamber 3. A roll chamber 9, an SiOx deposition chamber 11 and a monitor chamber 13 are arranged on the circumference of the drum 7. A sputtering cathode 27 is arranged in the SiOx deposition chamber 11 and a pump 29 for moisture, such as cryogenic panel, for powerfully discharging the moisture is arranged in the deposition chamber 11, by which the partial pressure of the moisture in the deposition chamber 11 is maintained low. The absorption of the light of the SiOx film after the deposition is moistored by an in-situ transmitted light monitor 35 and the value (x) of the SiOx film is judged from the transmittance of the light of the SiOx film. An oxygen flow rate is regulated by an MFC 33 in such a manner that the value of (x) attains a desired value. As a result, the adhesive layer having the sufficient adhesive power and the good transmittance may be deposited on the substrate.

79. 发明专利

JPH11329231A FILM ATTACHING DEVICE 失效
公开(公告)号：JPH11329231A
公开(公告)日：1999-11-30
申请号：JP12584798
申请日：1998-05-08
申请人： SONY CORP
发明人： KAKINUMA MASAYASU
IPC分类号： H01J9/20
摘要： PROBLEM TO BE SOLVED: To provide a film attaching device capable of lowering the cost of production and precisely attaching the film. SOLUTION: This film attaching device has an object feeding part for feeding the object, a film feeding part for feeding a film FM attached to the object, and a film attaching part having a film holding part holding the film FM fed from the film feeding part and attaching it to the object. Here, the film feeding part is composed of an unwind part wound with separator tape attached with the film FM by an adhesive, a cutting part 72 cutting only the film FM or the film FM and the adhesive fed from the unwind part, and a take-up part taking up the separator tape fed from the cutting part 72.

80. 发明专利

JPH0919900A FILM CUTTING DEVICE 失效
公开(公告)号：JPH0919900A
公开(公告)日：1997-01-21
申请号：JP19590995
申请日：1995-07-07
申请人： SONY CORP
发明人： OMI MOTOSUKE , OWADA YOSHIAKI , KAKINUMA MASAYASU
IPC分类号： B26F3/12
摘要： PROBLEM TO BE SOLVED: To provide a film cutting device which does not require repolishing works for the cutter, does not produce dust such as splash from machining, and can cut various films. SOLUTION: A cutting device concerned is to cut a film F into the specified dimensions. wherein the configuration comprises a wire W, a heating means 10 to heat the wire for cutting the film F, a wire feeding means 20 for feeding the wire, and a film feeding means 30 to feed the film F to the wire W.

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