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    • 80. 发明专利
    • METHOD FOR FORMING ELECTRODE ON CERAMIC
    • JPH05101973A
    • 1993-04-23
    • JP24559991
    • 1991-09-25
    • MATSUSHITA ELECTRIC IND CO LTD
    • IZUMI YASUHIROTAKADA KAZUNORIKONDO SHIGEOTAGI HIROMITSU
    • C04B41/90H01G4/12
    • PURPOSE:To dispense with a step of removing electrodes and prevent the quality of a component from being deteriorated by forming the electrodes with an activating process using a catalyst and an electroless plating after dissolving the organic metal layer on a ceramic surface in advance for removal so that the layer is in the shape of the electrodes. CONSTITUTION:A substrate 1 is dipped into an ethanol solution of zinc acetate for coating. Then, a heat treatment is provided in an Ar gas atmosphere to form an organic metal layer 2 containing zinc acetate as its main component on the surface of the base. Then, the peripheral end face 3 of the substrate 1 is dipped into an oxalic acid aqueous solution to remove a part of the organic metal layer 2. In continuation, the substrate 1 is activated by a palladium chloride solution. Then, the substrate 1 is dipped into an electroless plating solution to deposit a metallic copper on its surface chemically. The metallic copper is further deposited in a greater thickness by an electrolysis in an electrolytic plating solution to form metallic copper electrodes 4. There is no need for removing the unwanted electrode part by means of any mechanical grinding, hence making it possible to prevent the quality, characteristics, etc., of the component from being deteriorated.