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    • 73. 发明专利
    • Semiconductor device and its manufacturing method
    • 半导体器件及其制造方法
    • JP2005011854A
    • 2005-01-13
    • JP2003171268
    • 2003-06-16
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • YAMAMOTO KAZUSHI
    • H01L23/12H01L23/04H01L23/08
    • H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To protect the surface of a lead terminal formed on the bottom of a package body against damage, to restrain an electrical connection failure from occurring when a semiconductor device is mounted on a set apparatus, to make its package body small in size, and to enable the semiconductor device to be stably supported and mounted. SOLUTION: The semiconductor device is equipped with a package body 2 provided with a recess where lead terminals 1 are arranged, and a semiconductor element 3 fixed in the recess of the package body 2; an internal terminal as a part of the lead terminal located inside the recess is connected to the semiconductor element 3; and a part of the lead terminal is arranged on the bottom of the package body to serve as an external terminal 1a. A leg-shaped projection 6 is selectively arranged, at least, on the surfaces of some of the external terminals or on the bottom of the package body. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了保护形成在封装体底部的引线端子的表面免受损坏,以限制当半导体器件安装在固定装置上时发生电连接故障,以使其封装 身体尺寸小,并且能够稳定地支撑和安装半导体器件。 解决方案:半导体器件配备有设置有引线端子1的凹部的封装主体2和固定在封装主体2的凹部中的半导体元件3; 作为位于凹部内部的引线端子的一部分的内部端子连接到半导体元件3; 并且引线端子的一部分布置在封装体的底部上以用作外部端子1a。 至少在一些外部端子或包装体的底部的表面上有选择地设置有腿状的突起6。 版权所有(C)2005,JPO&NCIPI