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71. 发明专利

JPH01129984A METHOD FOR REMOVING OXIDE FILM ON CU-SN TYPE COPPER-BASED ALLOY 失效
公开(公告)号：JPH01129984A
公开(公告)日：1989-05-23
申请号：JP28692587
申请日：1987-11-13
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , TSUNO RIICHI , YUJI TAKEO
IPC分类号： C23G1/10 , H01L21/48
摘要： PURPOSE:To perfectly remove an oxide film formed on the surface of a Cu-Sn type copper-based alloy by annealing by successively washing the surface of the alloy with a pickling soln. contg. sulfuric acid and hydrogen peroxide each at a specified concn. and a pickling soln. contg. sulfuric acid and acidic ammonium fluoride each at a specified concn. CONSTITUTION:When an oxide film formed on the surface of a Cu-Sn type copper-based alloy by annealing is removed by washing with acidic solns., the surface of the alloy is first washed with a primary pickling soln. contg. 10-50vol.% sulfuric acid and 0.5-3vol.% hydrogen peroxide at about 20-30 deg.C for about 5 sec. The washed surface is then washed with water and further washed with a secondary pickling soln. contg. 10-50vol.% sulfuric acid and >=10g/l acidic ammonium fluoride. The oxide film formed on the surface of the alloy is perfectly removed and surface properties ensuring satisfactory workability and adhesion to plating are obtd.

72. 发明专利

JPS6417841A LEAD FRAME MATERIAL FOR SEMICONDUCTOR 失效
公开(公告)号：JPS6417841A
公开(公告)日：1989-01-20
申请号：JP17439287
申请日：1987-07-13
申请人： KOBE STEEL LTD
发明人： OZAKI RYOICHI , TSUNO RIICHI , SOEDA MASUMITSU , MIYATO MOTOHISA
IPC分类号： C22F1/08 , C22F1/00 , H01L23/50
摘要： PURPOSE:To permit direct joining of a bonding wire made of an Au wire or Cu wire by plating a Cu alloy contg. a very small amt. of Ag on the surface of a lead frame of a semiconductor, working it at the specific reduction in area and thereafter applying said alloy to stress relief annealing. CONSTITUTION:The plated layer of a Cu-Ag alloy contg. >0.005wt.% Ag is formed on the surface of the titled material made of copper alloy to >=0.5mum thickness. Said layer is rolled at >=5% reduction in area and is thereafter applied to the stress relief annealing at least for >=5sec at 200-500 deg.C, by which the voids in the Cu-Ag layer on the surface are reduced, a hydrogen gas is removed and the local stress generated at the time of rolling is removed. In this way, the lead frame material which has excellent heat resistance, does not soften at the time of stress relief annealing of a base metal after working and at the time of wire bonding of an Au wire, has stabilized joining ability at the time of bonding and has no peeling of solder even in an outer lead can be obtd.

73. 发明专利

JPS6365748B2 失效
公开(公告)号：JPS6365748B2
公开(公告)日：1988-12-16
申请号：JP21076785
申请日：1985-09-24
申请人： KOBE STEEL LTD
发明人： MYATO MOTOHISA , YUJI TAKEO , TSUNO RIICHI
IPC分类号： C22F1/08 , C22C9/04 , H01L23/50

74. 发明专利

JPS63297530A COPPER ALLOY FOR SEMICONDUCTOR LEAD FRAME 失效
公开(公告)号：JPS63297530A
公开(公告)日：1988-12-05
申请号：JP12975987
申请日：1987-05-28
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , TSUNO RIICHI
IPC分类号： C22C9/00 , H01L23/48
摘要： PURPOSE:To produce the titled copper alloy having high strength and high electric conductivity by incorporating specific ratios of Fe, P, Sn, Ag and Zn to Cu. CONSTITUTION:The copper alloy contg., by weight, 0.12-0.20% Fe, >0.04- =55kgf/mm tensile strength and about >=75% IACS electric conductivity and is useful as the lead frame of a surface packaging type semiconductor integrated circuit such as PLCC, SOP, etc.

75. 发明专利

JPS63169056A LEAD FRAME MATERIAL 失效
公开(公告)号：JPS63169056A
公开(公告)日：1988-07-13
申请号：JP28087
申请日：1987-01-05
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , SOEDA MASUMITSU , TSUNO RIICHI , OZAKI RYOICHI
IPC分类号： H01L23/50
摘要： PURPOSE:To stabilize weldability on wire-bonding of a gold wire, by disposing a high-purity copper layer of 0.5mum or more in thickness on a surface of an iron-nickel group alloy. CONSTITUTION:A high-purity copper layer of 0.5mum or more in thickness is disposed on a surface of an iron-nickel group alloy. This copper layer is formed into a soft metal copper material to have internal porosity smaller than a plating material. Therefore, oxidation-proof and corrosion-proof properties in this copper layer are made approximately identical with those in pure copper, and wire-bonding performance of this copper layer is stabilized when a gold wire is pressed thereon by heating under a reducing atmosphere. Further, when the copper layer on the surface of the iron-nickel group alloy is thereafter annealed at a specific temperature, H2 gases and impurities and the like contained on plating are removed and diffused together with reduction of voids, so that surface quality of the layer can be stabilized.

76. 发明专利

JPS6353958A LEAD FRAME MATERIAL 失效
公开(公告)号：JPS6353958A
公开(公告)日：1988-03-08
申请号：JP19774686
申请日：1986-08-23
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , SOEDA MASUMITSU , TSUNO RIICHI , OZAKI RYOICHI , KAMATA KUNIO , TOKUNAGA HIROMOTO
IPC分类号： H01L23/50 , B32B7/02 , B32B15/01
摘要： PURPOSE:To connect a gold wire directly to a lead frame with high reliability and certainty by arranging a high-purity copper layer of 0.5mum or more thickness at the surface of a lead frame material for a semiconductor. CONSTITUTION:A copper layer of high purity and more than 0.5mum in thickness is prepared at the surface of a lead frame material for a semiconductor. such an arrangement decreases voids in the copper layer as well as a local stress developed during H2-gas removal and a skin pass of a base metal. What is more, this arrangement reduces the maximum surface roughness from 0.8-1.0mum to 0.4mum. It is this possible to connect a gold wire directly with the lead frame with high reliability and certainty.

77. 发明专利

JPS62116757A Manufacture of tubular material for casting mold for electromagnetic agitation and continuous casting of steel 失效
标题翻译：铸造用于铸造模具的电磁材料的制造和钢的连续铸造
公开(公告)号：JPS62116757A
公开(公告)日：1987-05-28
申请号：JP25629785
申请日：1985-11-15
申请人： Kobe Steel Ltd
发明人： MIYATO MOTOHISA , YUJI TAKEO , TSUNO RIICHI
IPC分类号： B22D11/04 , B21C23/00 , B22D11/057 , B22D11/059 , C22C9/06 , C22F1/08
摘要： PURPOSE: To smoothly carry out the high-speed continuous casting of steel and to improve the productivity by subjecting a Cu alloy ingot having a regulated composition to hot extrusion, cold working and heat treatment each under specified conditions so as to provide electric conductivity fit for electromagnetic agitation to the resulting material for a casting mold and to prevent the softening and deformation of the casting mold.
CONSTITUTION: A Cu alloy ingot consisting of, by weight, 0.4W2.0% Ni, 0.1W0.4% Si, 0.05W1.0% Zn, 0.02W0.1% Mn, 0.001W0.1% in total of one or more among Mg, Cr, Zr and Ti and the balance Cu with inevitable impurities is hot extruded. At this time, the ingot is heated at ≥200°C/hr heating rate and hot extruded. It is then cooled from ≥600°C at ≥5°C/sec cooling rate, cold worked at 5W30% reduction of area and subjected to annealing at 600W800°C and cooling at ≥5°C/sec cooling rate twice or more to obtain the titled material for a casting mold.
COPYRIGHT: (C)1987,JPO&Japio
摘要翻译：目的：为了顺利进行钢的高速连续铸造，并且通过在规定的条件下对具有规定组成的Cu合金锭进行热挤压，冷加工和热处理，以提供导电性，以提供导电性对所得到的铸模材料进行电磁搅拌，并防止铸模的软化和变形。构成：Cu合金锭，以重量计含有0.4-2.0％的Ni，0.1-0.4％的Si，0.05-1.0％的Zn，0.02-0.1％的Mn，0.001-0.1％的Mg，Cr中的一种或多种，Zr和Ti，余量为不可避免的杂质Cu被热挤压。此时，锭子以> = 200℃/小时的加热速率加热并热挤压。然后从> = 600℃冷却> 5℃/秒冷却速度，冷加工面积减少5-30％，并在600-800℃退火并在> = 5℃冷却 ℃/秒冷却速度两次以上，得到用于铸模的标题材料。

78. 发明专利

JPS6286151A MANUFACTURE OF WIRE ROD FOR LEAD FOR PIN GRID ARRAY IC 失效
公开(公告)号：JPS6286151A
公开(公告)日：1987-04-20
申请号：JP21076785
申请日：1985-09-24
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , YUJI TAKEO , TSUNO RIICHI
IPC分类号： C22F1/08 , C22C9/04 , H01L23/50
摘要： PURPOSE:To increase the heat conductivity and strength of a wire rod and to facilitate the wetting of the wire rod with silver solder by carrying out process annealing at a prescribed temp. during the cold drawing of an alloy consisting of prescribed percentages of Ni, Co, Si, Zn, Cr and Cu. CONSTITUTION:An alloy ingot consisting of, by weight, 1-5% Ni, 0.2-1% Co, 0.2-1.5% Si, 0.05-5% Zn, 0.002-0.5% Cr and the balance Cu is hot extruded and cold drawn. During the cold drawing, process annealing is carried out once or more at 550-800 deg.C.

79. 发明专利

JPS622025B2 失效
公开(公告)号：JPS622025B2
公开(公告)日：1987-01-17
申请号：JP21079884
申请日：1984-10-08
申请人： KOBE STEEL LTD
发明人： MYATO MOTOHISA , TSUNO RIICHI
IPC分类号： C25D5/50 , C22F1/00 , C22F1/08 , C22F1/10 , C23C30/00

80. 发明专利

JPS61177344A LEAD MATERIAL FOR CERAMIC PACKAGED IC 失效
公开(公告)号：JPS61177344A
公开(公告)日：1986-08-09
申请号：JP1843185
申请日：1985-02-01
申请人： KOBE STEEL LTD
发明人： MIYATO MOTOHISA , YUJI TAKEO , TSUNO RIICHI
IPC分类号： H01L23/48 , C22C9/06 , H01L23/495
摘要： PURPOSE:To obtain the titled lead material causing no cracking of a ceramic board during cooling after silver brazing and having high strength, electric conductivity and heat conductivity by providing a specified composition consisting of Ni, Co, Si, Zn, Sn, Cr and Cu. CONSTITUTION:This lead material for ceramic packaged IC consists of, by weight, 1.0-5.0% Ni, 0.2-1.0% Co, 0.2-1.5% Si, 0.05-5.0% Zn, 0.1-2.0% Sn, 0.001-0.5% Cr and the balance Cu with inevitable impurities. Though the lead material has a high coefft. of thermal expansion not close to the coefft. of thermal expansion of ceramics, a ceramic board is not cracked during cooling after silver brazing at about 800-900 deg.C. The lead material has superior strength, repeated bendability, electric conductivity, heat conductivity, solderability and resistance to stripping under heating by soldering even after brazing. The grain size of the lead material is

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