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71. 发明专利

JP2001320198A METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2001320198A
公开(公告)日：2001-11-16
申请号：JP2000142296
申请日：2000-05-10
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HOSODA YUJI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To surely mount an optical waveguide with a mirror surface which tilts to a tip lower surface on a substrate surely and obtain high positioning accuracy in an electronic part mounting device and its mounting method. SOLUTION: Light is cast from a side light source 11 with an optical waveguide 18, having a mirror surface 20 which tilts to a tip lower surface, held by a component holding mechanism 3, light reflected downward from the mirror surface 20 is received by an image input device 8 and an image is generated, the displacement state of the mirror surface 20 is operated based on the image in a control device, and control is carried out so that insertion state between a substrate 5 and the optical waveguide 18 coincides with each other.

72. 发明专利

JP2001157477A POSITION/SPEED CONTROLLER AND STAGE SYSTEM USING IT 失效
公开(公告)号：JP2001157477A
公开(公告)日：2001-06-08
申请号：JP33469399
申请日：1999-11-25
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HOSODA YUJI , FUJII KEN
IPC分类号： G01P3/481 , G01D5/244 , G01D5/245 , G05D13/62 , H02P29/00 , H02P5/00
摘要： PROBLEM TO BE SOLVED: To provide a position/speed controller capable of accurately following to a command speed by effectively removing a noise without largely delaying a response to give an adverse influence to a control. SOLUTION: The position/speed controller comprises a rotational speed detecting means 13 for detecting the rotational speed of a motor 1, and a position detecting means 13 for detecting the position of a part to be driven to control the driving speed and the position of the driven part 3 moving by driving the motor 1. Whether the angle displacement of the rotational shaft of the speed detecting means is existed in a region for generating a noise to the output signal 12 of the speed detecting means or not is decided based on the output signal 16 from the position detecting means, and the noise of the output signal from the speed detecting means is removed based on this decision.

73. 发明专利

JPH0769561A ALIGNING MANIPULATOR FOR ELEVATOR GUIDE RAIL 失效
公开(公告)号：JPH0769561A
公开(公告)日：1995-03-14
申请号：JP21834793
申请日：1993-09-02
申请人： HITACHI LTD , HITACHI BUILDING SYST ENG
发明人： TOMITA MASAMICHI , SAKAI AKIHIKO , HONMA KAZUO , MATSUDA HARUMOTO , KANAYAMA RYOETSU , OTA MASATOSHI
IPC分类号： B66B7/02 , B66B19/00
摘要： PURPOSE:To undertake an automatic guide rail alignment work in a short time and accurately by transmitting reaction from a guide rail to the fixed section thereof at the time of correcting the position and posture of a frame, and supporting the frame with high rigidity. CONSTITUTION:In the state where a rail holding mechanism 3 retains two guide rails at both ends, and a support mechanism 6 below a car 7 supports the aligned and fixed section 23 of the guide rails 10, a detection mechanism 4 continuously measures the displacement of two metal wires 14 at three positions within a horizontal plane. Also, a correction mechanism 5 consists of a control device 37 and a manipulator 48. The control device 37 arithmetically operates the relative displacement and posture of a frame 1 for the metal wires 14 from the horizontal displacement thereof obtained at each point and the vertical displacement of the frame 1. Thereafter, the control device 37 instructs an operation amount to the actuator of the manipulator 48 laid in such a way as suspended from a crosshead 46 as a base end, and controls the position and posture of the frame 1, thereby vertically positioning the rails 10.

74. 发明专利

JPH04275835A PARTS MOUNTING DEVICE 失效
公开(公告)号：JPH04275835A
公开(公告)日：1992-10-01
申请号：JP557991
申请日：1991-01-22
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO
IPC分类号： B23P19/02 , B23P21/00 , H05K13/04
摘要： PURPOSE:To provide an electronic parts mounting machine having a small-sized mounting head, with which mounting can be performed with a high locating preciseness and at a high mounting speed. CONSTITUTION:A two-side mirror 14 is placed aslant below a suction nozzle 3, and the image of a piece of electronic parts 5 being sucked is led to a camera 10 via a reflex surface situated above, while the image of the mounting pattern 7 on a printed circuit board 6 is led to another camera 11 via a reflex surface situated below. When electronic parts are attracted or mounted, the two-side mirror retreats while a nozzle sinks. Otherwise, the nozzle rotates, and the electronic parts are photographed, and at the same time, the mirror stops aslant right over the pattern to photograph it. The image of the pattern is photographed in the condition that the mounting head is situated right above the mounting position, which must be followed by only a small motion of the mounting head for the correction distance, and also the vertical moving distance of suction nozzle can be reduced from conventional arrangement, so that influence of the mechanism accuracy will be lessened. Thus a high accuracy in mounting location is achieved while high mounting speed is maintained.

75. 发明专利

JPH04252100A APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH04252100A
公开(公告)日：1992-09-08
申请号：JP192591
申请日：1991-01-11
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO , IGARASHI SHIGEMI , TAKIZAWA TATSU , FUJISHIRO KEISUKE , HONMA MAKOTO , TOMITA TOMOYA
IPC分类号： G01B11/00 , H05B33/00 , H05K13/02 , H05K13/04 , H05K13/08
摘要： PURPOSE:To obtain an apparatus for rapidly mounting various electronic components on a printed board coping with the large and small components. CONSTITUTION:An image sensor 9 for selectively imaging the image of a small- sized electronic component 5 and the image of a positioning mark 15 by a beam splitter 16 and a shutter 17, and image sensor 10 for imaging a mounting pattern 7 are provided in a mounting head 2, and an image sensor 8 for a large-sized component 4 is secured to a mounting apparatus body. A movable mirror 18 is provided under a suction nozzle 3, and the small-sized component 5 is imaged during conveying. Since the small-sized component 5 can be imaged during the conveyance, it can be mounted at a high speed. Since both the small- sized component 5 and the mark 15 can be imaged by the sensor 9, a simple and inexpensive structure is provided.

76. 发明专利

JPH04105341A METHOD AND EQUIPMENT FOR DETECTING BENDING AND FLOATING OF LEAD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04105341A
公开(公告)日：1992-04-07
申请号：JP22130290
申请日：1990-08-24
申请人： HITACHI LTD
发明人： HONMA MAKOTO , HIRAMOTO SOTOJI , HATA SEIJI , TOMITA MASAMICHI , ISHIBASHI AKIRA
IPC分类号： G01B11/00 , G01B11/24 , G01N21/956 , H01L21/66 , H01L23/50 , H05K13/08
摘要： PURPOSE:To detect the bending and the floating of a lead with high precision by using the same mechanism, and shorten the detection time, by irradiating a lead with an optical cutting beam, imaging the lead part with an image equipment, and detecting the bending or the floating on the basis of three-dimensional data of each lead on the picture image. CONSTITUTION:The leads of a semiconductor device 1 are irradiated with an optical cutting beam 6, and a lead part 12 is imaged by an image equipment 3. On the basis of three-dimensional data of each lead obtained from the optical cutting beam 6 of each lead part 12 on the picture image picked up by the image equipment 3, at least one of the bending or the floating of the lead is detected. For example, the semiconductor device 1 is moved in the visual field of a TV camera 3; the light outputted from a semiconductor laser light source 7 is turned into the optical cutting beam 6 by a lens 8, and projected on the lead part 12 of the semiconductor device 1; the image of the optical cutting beam 6 of the lead part 12 obtained in the above process is picked up by the TV camera 3, and read and stored as picture image data by an image processing equipment 11. The bending and the floating of leads of the semiconductor device 1 are detected through a specified process.

77. 发明专利

JPH03131705A HOLDING ATTITUDE INSPECTING DEVICE FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH03131705A
公开(公告)日：1991-06-05
申请号：JP26895289
申请日：1989-10-18
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , SAKAIRI HIROSHI , OKADA YUKO
IPC分类号： G01B11/00 , B23P21/00 , G01B11/26 , H05K13/04 , H05K13/08
摘要： PURPOSE:To detect abnormality of the holding attitude of the electronic component in a short time by arranging a photodetecting device in the direction of the bisector of an adjacent command angle of the positioned electronic component. CONSTITUTION:A suction nozzle 6 rotates and passes each station while sucking the electronic component 7 in a rectangular prism shape. A positioning device 8 equipped with four claws is installed in a positioning station 3, an ITV camera 6 is placed in an inspection station 4 at 33.5 deg. to the turning radius direction of the suction nozzle 6, and the component 7 is put in its visual field. A projection device 10 is placed on the opposite side of an ITV camera 9 about the suction nozzle 6. The component 7 is positioned in the positioning station 3 with the claws of the positioning device 8 and its attitude is corrected according to eight command angles, i.e. 0, 45, 90, 135, 180, 225, 270, and 315 degrees. In the inspection station 4, a silhouette image of the component 7 is picked up by the ITV camera 9 and an image processor 12 measures the horizontal length.

78. 发明专利

JPS6442200A CENTERING MECHANISM OF CHIP MOUNTER 失效
公开(公告)号：JPS6442200A
公开(公告)日：1989-02-14
申请号：JP19808987
申请日：1987-08-10
申请人： HITACHI LTD
发明人： HAEDA YOSHIO , ITAGAKI MASATO , TOMITA MASAMICHI
IPC分类号： H05K13/04 , H01L21/52 , H01L21/68
摘要： PURPOSE:To center a chip electric component securely by a method wherein the discrepancy angle of the chip electronic component is detected by a visual sensor and the angles of the claws of a centering part are corrected by using the data of the detected results. CONSTITUTION:A chip electronic component 8 is attracted by a vacuum attraction nozzle 3 from an electronic component feeder 2 placed on an S table 1 and the nozzle 3 is raised and transferred by the rotation of a rotary holder 4 to the position of a fixing positioner 40 which centers the chip electronic component and the attracted chip electronic component 8 is centered by claws 9. At that time, after the chip component is attracted by vacuum, the discrepancy of the rotation direction of the chip electronic component is detected by a visual sensor and, in order to facilitate centering of the shifted chip electronic component, the claws for centering are rotated beforehand by detected output signals so as to accommodate the chip electronic component in the center part of the claws. With this constitution, the claws do not fail to accommodate the chip electronic component.

79. 发明专利

JPS63251182A METHOD OF DETECTING POSITION OF BEVEL OF WORKING-LINE START END 失效
公开(公告)号：JPS63251182A
公开(公告)日：1988-10-18
申请号：JP8487087
申请日：1987-04-08
申请人： HITACHI LTD , HITACHI KEIYO ENG
发明人： HIRAI AKIRA , SHIBATA NOBUO , TOMITA MASAMICHI , KAWASAKI KYOICHI , SHIMURA YASUNORI
IPC分类号： B25J13/08 , B23K9/12 , B23K9/127 , B25J9/16 , B25J19/04 , G05B19/18 , G05B19/404 , G05B19/4063

80. 发明专利

JPS62289374A POSITION CONTROL METHOD FOR WELDING ROBOT 失效
公开(公告)号：JPS62289374A
公开(公告)日：1987-12-16
申请号：JP13181986
申请日：1986-06-09
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI
IPC分类号： B23K9/127 , B23K9/12
摘要： PURPOSE:To secure a stable welding state and stabilize the quality by performing the correcting operation of a target position based on the detected plate gap of the material to be welded, correcting the position of a welding torch and performing the positional control of a welding robot. CONSTITUTION:A fixed plate thickness value (t) is stored on each program in advance to a visual control device 5. A groove position and plate gap are detected by a visual sensor 4 at the reproducing motion time. The operation is performed by the visual control device 5 and in case of the calculation being out of the set value the operation is stopped. In case of the arith..metic value being within the set value the welding is performed with correcting the target position. Since the target position of the welding torch can be corrected in this way even in case of the plate gap being caused on the groove part, a stable welding state can always be obtd.

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