专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明专利

JP2014153996A Sheet, method for manufacturing sheet, contact relaxing sheet, and method for transferring rfid inlay and thin film layer to adherend 审中-公开
标题翻译：片材，制造方法，接触放置片和用于传输RFID嵌入层和薄膜层的方法
公开(公告)号：JP2014153996A
公开(公告)日：2014-08-25
申请号：JP2013024350
申请日：2013-02-12
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KAMO KAZUYUKI , TAKANE NOBUAKI
IPC分类号： G06K19/00 , G06K19/07 , G06K19/077 , G09F3/00 , G09F3/02 , G09F3/10
摘要： PROBLEM TO BE SOLVED: To provide: a sheet capable of sticking a human skin without using an adhesive and safe for a human body; a method for manufacturing the sheet very easy to stick a human skin and hardly conspicuous and uncomfortable when stuck; and a method for transferring a thin film layer of the sheet to an adherend.SOLUTION: A sheet comprises an RFID inlay, a thin film layer, a dissoluble support layer and a permeable base material. A flat surface size of the thin film layer is larger than that of the RFID inlay. A method for manufacturing the sheet comprises steps of: forming the thin film layer; forming the dissoluble support layer on the thin film layer; and forming the permeable base material on the dissoluble support layer. A method for transferring the thin film layer comprises steps of: contacting the thin film layer to confront with an adherend; permeating and passing a solution capable of dissolving the dissoluble support layer from the side of the permeable base material; and removing the permeable base material.
摘要翻译：要解决的问题：提供：能够粘贴人体皮肤而不使用粘合剂并且对人体安全的片材; 用于制造片材的方法非常容易粘附人皮肤，并且在卡住时几乎不显眼和不舒适; 以及将片材的薄膜层转印到被粘物的方法。解决方案：片材包括RFID嵌体，薄膜层，可溶性支撑层和可渗透的基底材料。薄膜层的平坦表面尺寸大于RFID嵌体的平坦表面尺寸。制造薄片的方法包括以下步骤：形成薄膜层; 在薄膜层上形成可溶性载体层; 以及在所述可溶性支撑层上形成所述可渗透基材。用于转移薄膜层的方法包括以下步骤：使薄膜层与被粘物接触; 渗透并通过能够从可渗透基材一侧溶解可溶性载体层的溶液; 并除去渗透性基材。

72. 发明专利

JP2014153808A Circuit board for non-contact type ic card or non-contact type ic tag, and the non-contact type ic card or the non-contact type ic tag 有权
标题翻译：用于非接触式IC卡或非接触式IC标签的电路板，以及非接触式IC卡或非接触式IC标签
公开(公告)号：JP2014153808A
公开(公告)日：2014-08-25
申请号：JP2013021308
申请日：2013-02-06
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KISE YOSHITAKA , TAZAKI KOJI , SUGANO MASAO , NARUSE KENZO
IPC分类号： G06K19/077 , B42D25/305 , G06K19/07 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a circuit board for a non-contact type IC card or a non-contact type IC tag, and the like on which any one selected from two kinds of IC chips or more different in bump positions and internal capacitance can be optionally mounted, and further, which can obtain a resonant frequency optimum for communication operation to be performed by each IC chip.SOLUTION: The circuit board for the non-contact type IC card or the non-contact IC tag includes: an insulation substrate; an antenna circuit; a confronting terminal section that is parallely arranged at a part of the antenna circuit, and corresponds to bump positions of two types of IC chips or more; and a capacitor pattern section that is disposed in parallel with the confronting terminal section at the part of the antenna. The capacitor pattern section includes: a conductive tape that is disposed on one surface side of the insulation substrate; and one piece of a plane surface pattern B that is disposed on the other surface side of the insulation substrate so as to overlap the conductive tape on the one surface side thereof, when viewed in a plane view.
摘要翻译：要解决的问题：提供一种用于非接触型IC卡或非接触型IC标签的电路板等，其中从两种IC芯片中选择两种或更多不同的凸起位置和内部电容可以可选地安装，并且进一步可以获得由每个IC芯片执行的通信操作的最佳谐振频率。解决方案：用于非接触型IC卡或非接触IC标签的电路板包括：绝缘基质; 天线电路; 平行布置在天线电路的一部分的面对的端子部分，并且对应于两种类型的IC芯片的凸起位置或更多; 以及电容器图案部，其与所述天线的所述部分处于相对的端子部并列配置。电容器图案部分包括：导电带，其设置在绝缘基板的一个表面侧上; 以及一块平面图案B，其设置在绝缘基板的另一个表面侧上，以便在平面图中观察时与导电带在其一个表面侧上重叠。

73. 发明专利

JP2014152253A Adhesive sheet for an image display device, method for manufacturing an image display device, and image display device 有权
标题翻译：用于图像显示装置的粘合片，用于制造图像显示装置的方法和图像显示装置
公开(公告)号：JP2014152253A
公开(公告)日：2014-08-25
申请号：JP2013023314
申请日：2013-02-08
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MANSEI YOICHIRO , YAMAZAKI KOJI , NAKAMURA TOMOYUKI , NAKAMURA HAJIME , SUZUKI TAKESHI , IMAIZUMI JUNICHI , TAKAHASHI HIROAKI
IPC分类号： C09J7/02 , C09J175/06 , C09J175/16 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for an image display device possessing an adhesive layer excellent in terms not only of the padding capacity of a level difference formed atop an adhesion target but also of surface flatness, having an appropriate permittivity value, and excellent in terms also of visual recognizability.SOLUTION: The provided adhesive sheet for an image display device includes an adhesive layer including: a compound possessing a polycarbonate-urethane chain formed from a polycarbonate diol and a polydiisocyanate; and a linear polymer including no polycarbonate-urethane chain. The haze of the adhesive layer is 1.5% or less.
摘要翻译：要解决的问题：提供一种用于图像显示装置的粘合片，其具有不仅在粘合目标上形成的水平差的填充能力，而且具有适当介电常数值的表面平坦度的优异的粘合剂层，以及所提供的用于图像显示装置的粘合片包括粘合剂层，其包括：具有由聚碳酸酯二醇和聚二异氰酸酯形成的聚碳酸酯 - 氨基甲酸酯链的化合物; 和不含聚碳酸酯 - 氨基甲酸酯链的直链状聚合物。粘合剂层的雾度为1.5％以下。

74. 发明专利

JP2014148653A Curable resin composition and electronic component device 有权
标题翻译：可固化树脂组合物和电子元件装置
公开(公告)号：JP2014148653A
公开(公告)日：2014-08-21
申请号：JP2013019771
申请日：2013-02-04
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NAKAMURA SHINYA , KIGUCHI KAZUYA , HAGIWARA HIROKUNI , FURUSAWA FUMIO , HASHIMOTO SHINTARO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in both heat resistance after curing and moldability.SOLUTION: The curable resin composition contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) a maleimide compound. The curing accelerator (C) contains a compound represented by a general formula (I-1). (In the formula (I-1), Rto Rare each independently a C1-C18 hydrocarbon group; at least one of Rto Ris a C1-C18 aliphatic hydrocarbon group; two or more of Rto Rmay be bonded to each other to form a cyclic structure; Rto Rare each independently a hydrogen atom, a hydroxyl group, or a C1-C18 organic group; and two or more of Rto Rmay be bonded to each other to form a cyclic structure.)
摘要翻译：要解决的问题：提供固化后的耐热性和成型性优异的固化性树脂组合物。溶解性：固化性树脂组合物含有（A）环氧树脂，（B）酚醛树脂，（C）固化促进剂，和（D）马来酰亚胺化合物。固化促进剂（C）含有通式（I-1）表示的化合物。（式（I-1）中，Rto Rare各自独立地为C1-C18烃基; Rto至少为一个为C1-C18脂族烃基; RtoRmay中的两个或更多个彼此结合形成环状 Rto Rare各自独立地为氢原子，羟基或C1-C18有机基团; Rto Rmay中的两个或更多个彼此键合以形成环状结构。）

75. 发明专利

JP2014146685A Led mounting substrate 审中-公开
标题翻译： LED安装基板
公开(公告)号：JP2014146685A
公开(公告)日：2014-08-14
申请号：JP2013014271
申请日：2013-01-29
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： SHIOZAWA TOMONORI
IPC分类号： H05K3/28 , H01L33/60
CPC分类号： H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED mounting substrate capable of securing reflectance because blackening is less likely to occur even when a white solder resist formed on a surface of an LED wiring board comes into contact with a metal and the like while maintaining a degree of freedom on a circuit design of the LED wiring board.SOLUTION: An LED mounting substrate comprises: an insulating substrate; a conductor pattern formed on one surface of the insulating substrate and including a mounting terminal for mounting an LED element and a connection terminal connected to the LED element; a conductor pattern formed on the other surface of the insulating substrate; and a two-layered solder resist formed on the one surface of the insulating substrate and on the conductor pattern on this one surface and including an opening on the mounting terminal and the connection terminal. The two-layered solder resist is formed with a white solder resist containing a slip agent as an upper layer.
摘要翻译：要解决的问题：提供一种能够确保反射率的LED安装基板，即使当形成在LED布线板的表面上的白色阻焊剂与金属等接触时，也可能发生黑化，同时保持一定程度的LED布线板的电路设计的自由度。解决方案：LED安装基板包括：绝缘基板; 导体图案，形成在所述绝缘基板的一个表面上，并且包括用于安装LED元件的安装端子和连接到所述LED元件的连接端子; 形成在所述绝缘基板的另一个表面上的导体图案; 以及形成在绝缘基板的一个表面上并且在该一个表面上的导体图案上的包括安装端子和连接端子上的开口的两层阻焊剂。双层阻焊剂由含有滑爽剂作为上层的白色阻焊剂形成。

76. 发明专利

JP2014141679A Connection method of circuit member and connection structure of circuit member 有权
标题翻译：电路成员的连接方法和电路组件的连接结构
公开(公告)号：JP2014141679A
公开(公告)日：2014-08-07
申请号：JP2014045370
申请日：2014-03-07
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： TOMISAKA KATSUHIKO , TAKETAZU JUN
IPC分类号： C09J7/02 , C09J5/06 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J171/10 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H05K3/323 , C09J9/02 , C09J171/00 , H01L24/29 , H01L24/83 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R13/03 , H05K3/361 , H05K2203/1189 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a connection method of a circuit member in which low resistance electric connection can be obtained to COG mounting and COF mounting, and panel warpage after mounting a liquid crystal driving IC to a glass panel for a liquid crystal display can be sufficiently prevented.SOLUTION: A connection method of a circuit member is that a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are disposed so that the first connection terminal and the second connection terminal may counter together, an adhesive film is included between the first connection terminal and the second connection terminal that have been disposed to counter together, performed by heat compression, thereby the first connection terminal and the second connection terminal that have been disposed to counter together are electrically connected, and the connection method of a circuit member is that the adhesive film is the adhesive film in which a conductive adhesive layer including a conductive particle and an insulating adhesion layer are laminated, and the insulating adhesion layer and the conductive adhesive layer satisfy a prescribed requirement.
摘要翻译：要解决的问题：为了提供可以获得COG安装和COF安装的低电阻电连接的电路构件的连接方法，以及将液晶驱动IC安装到液晶显示器的玻璃面板之后的面板翘曲可充分防止。解决方案：电路部件的连接方法是具有第一连接端子和具有第二连接端子的第二电路部件的第一电路部件设置成使得第一连接端子和第二连接端子可以在一起在第一连接端子和第二连接端子之间，通过热压缩而被布置成相互对置的粘合膜，由此已经被设置为反接在一起的第一连接端子和第二连接端子电连接，并且电路部件的连接方法是粘合膜是粘合剂其中层压有包括导电颗粒和绝缘粘附层的导电粘合剂层，并且绝缘粘合层和导电粘合剂层满足规定的要求。

77. 发明专利

JP2014135344A Wiring board manufacturing method 审中-公开
标题翻译：接线板制造方法
公开(公告)号：JP2014135344A
公开(公告)日：2014-07-24
申请号：JP2013001728
申请日：2013-01-09
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAMOTO TEPPEI , NISHIDA TAKANORI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can reduce material cost by reducing a margin to be removed by cutting in a coreless technique and which has high workability.SOLUTION: A wiring board manufacturing method comprises: a process (1) of laminating a prepreg and a copper foil C on both sides of a three-layer peelable copper foil in which physically peelable copper foils B are arranged on both sides of a copper foil A to be a supporting material to form a laminate with the supporting member; a process (2) of forming an interlayer connection hole which penetrates from the copper foil C to the copper foil B of the laminate with the supporting material; and a process (3) of performing copper plating on the interlayer connection hole of the laminate with the supporting material and on the copper foil B to form interconnection for connecting the copper foil C and the copper foil B and a conductor layer having the copper foil C and copper plating.
摘要翻译：要解决的问题：提供一种线路板制造方法，其可以通过在无芯技术中切割而减少要去除的余量而降低材料成本，并且具有高的可加工性。解决方案：一种线路板制造方法，包括：工艺（1）在三层可剥铜箔的两面层叠预浸料和铜箔C，其中物理上可剥离的铜箔B布置在铜箔A的两侧作为支撑材料以与支撑构件形成层压体 ; 形成从所述铜箔C向所述层叠体的铜箔B与所述支撑材料贯通的层间连接孔的工序（2）以及在具有支撑材料的层叠体的层间连接孔上和铜箔B上进行铜电镀的工序（3），以形成用于连接铜箔C和铜箔B的互连和具有铜箔的导体层 C和镀铜。

78. 发明专利

JP2014133901A Polypropylene-based resin composition 审中-公开
标题翻译：基于聚丙烯的树脂组合物
公开(公告)号：JP2014133901A
公开(公告)日：2014-07-24
申请号：JP2014091755
申请日：2014-04-25
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： INOUE TAKASHI , FURUTA MOTONOBU
IPC分类号： C08L23/12 , C08K5/14 , C08L61/10 , C08L101/02
摘要： PROBLEM TO BE SOLVED: To provide a polypropylene-based resin composition excellent in high speed impact resistance.SOLUTION: The polypropylene-based resin composition is provided by blending (A) a polypropylene resin, (B) an alkylphenol resin, (C) a thermoplastic resin having a functional group capable of reacting with phenol, and (D) a radical initiator.
摘要翻译：要解决的问题：提供高抗冲击性优异的聚丙烯类树脂组合物。溶解性：聚丙烯类树脂组合物通过（A）聚丙烯树脂，（B）烷基酚树脂，（C）具有能够与苯酚反应的官能团的热塑性树脂和（D）自由基引发剂。

79. 发明专利

JP2014131049A Organic electronic material, ink composition containing the same, and organic thin film, organic electronic element, organic electroluminescent element, lighting device, and display device formed therewith 有权
标题翻译：有机电子材料，含有它们的墨水组合物，有机薄膜，有机电子元件，有机电致发光元件，照明装置和形成的显示装置
公开(公告)号：JP2014131049A
公开(公告)日：2014-07-10
申请号：JP2014004107
申请日：2014-01-14
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： FUNYU SHIGEAKI , ISHIZUKA KENICHI , HOSHI YOSUKE
IPC分类号： H01L51/50 , C07D305/06 , C08G61/12 , H05B33/02
CPC分类号： H01L51/0035 , C08G61/12 , C08G61/124 , C08G2261/132 , C08G2261/135 , C08G2261/1424 , C08G2261/1644 , C08G2261/312 , C08G2261/3162 , C08G2261/3241 , C08G2261/411 , C08G2261/76 , C09D11/52 , H01L51/0043 , H01L51/5056 , H01L51/5088
摘要： PROBLEM TO BE SOLVED: To provide an organic electroluminescent element capable of being easily multilayered, capable of being used even in a substrate, such as a resin, that cannot be processed at high temperatures, the organic electroluminescent element having excellent luminous efficiency and emission lifetime than conventional ones.SOLUTION: An organic electroluminescent element comprises a hole transport layer that is a layer comprising an organic thin film prepared by using an organic electronic material. The organic electronic material contains an oligomer or a polymer having at least one polymerizable substituent and a number average molecular weight of 3,000 or more. The polymer or oligomer has a structure which branches into three or more directions, and in which, when a chain having the highest degree of polymerization among chains in one molecule is designated as the main chain, side chains having an equal degree of polymerization to the main chain or side chains having a lower degree of polymerization than the main chain and at least one or more polymerized units, are linked to the main chain. The polymer or oligomer includes a predetermined structure as a unit serving as the starting point for forming the branched structure.
摘要翻译：要解决的问题：为了提供能够容易地多层化的有机电致发光元件，能够甚至在高温下不能加工的树脂等树脂中使用，具有优异的发光效率和发光寿命的有机电致发光元件。有机电致发光元件包括空穴传输层，空穴传输层是包含通过使用有机电子材料制备的有机薄膜的层。有机电子材料含有具有至少一个可聚合取代基和数均分子量为3,000以上的低聚物或聚合物。聚合物或低聚物具有分支为三个或更多个方向的结构，并且当将一个分子中的链中具有最高聚合度的链称为主链时，具有与具有比主链低的聚合度和至少一个或多个聚合单元的主链或侧链与主链连接。聚合物或低聚物包含作为形成分支结构的起点的单元的预定结构。

80. 发明专利

JP2014126509A Length displacement amount measuring apparatus 审中-公开
标题翻译：长度位移测量装置
公开(公告)号：JP2014126509A
公开(公告)日：2014-07-07
申请号：JP2012284840
申请日：2012-12-27
申请人： Hitachi Chemical Techno Service Co Ltd , 日立化成テクノサービス株式会社 , Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： HAYAKAWA TOMOTAKA , OMIWA NATSUMI , HIRANE KOICHI , FURUYA HIROSHI
IPC分类号： G01N25/16
摘要： PROBLEM TO BE SOLVED: To provide a length displacement amount measuring apparatus capable of precisely measuring the temperature variation in liquid.SOLUTION: The length displacement amount measuring apparatus includes: a closed container 1 that has a recess 4 for supporting a specimen and circulates a heat medium 2 in a sealed space around the recess; a test liquid 6 injected into the recess 4; and a measuring machine for measuring the length of the specimen. The closed container 1 is made of transparent glass. Both of the heat medium 2 and test liquid 6 are water.
摘要翻译：要解决的问题：提供一种能够精确地测量液体温度变化的长度位移量测量装置。解决方案：长度位移量测量装置包括：密闭容器1，其具有用于支撑试样并使热量循环的凹部4 介质2在凹部周围的密封空间中; 注入到凹部4中的测试液体6; 以及用于测量样品长度的测量机。密闭容器1由透明玻璃制成。热介质2和测试液体6都是水。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式