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    • 65. 发明专利
    • WIRING FORMATION ON LB FILM
    • JPH05135631A
    • 1993-06-01
    • JP29400591
    • 1991-11-11
    • OKI ELECTRIC IND CO LTD
    • MIYAMOTO HIROOKOYANO TAKESHISAITO MINORUUMIBE KATSUAKIKATO MASAKAZU
    • B05D1/20H01B1/20H01B13/00H01L21/3205
    • PURPOSE:To finely form a wiring on an LB film under ordinary temperature or under ordinary temperature with ordinary pressure by imparting a functional group to become a biotin mark to the surface of the LB film, and forming a biotin pattern on the surface, followed by being combined with avidin. CONSTITUTION:When a wiring is formed on an LB film 2, a functional group to become a mark of biotin 4 is imparted to the surface of the film 2 so as to form a biotin pattern to be combined with the surface of the film 2 through the functional group. Next, avidin 5 having metal colloid is combined with this biotin pattern by using specific combination of avidin 5 with biotin 4 so as to obtain the wiring. In this case, the functional group to become the mark of this biotin 4 is determined to be an amino group or a carboxyl group. Then, since a series of treatments can be under ordinary conducted under ordinary temperature, a desired wiring can be formed while allowing to be also formed cold. Further, since biotin pattern formation can be performed by a present fine pattern making technique such as electron ray exposure, untraviolet ray exposure and X-ray exposure, a desired fine pattern can be obtained.