会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 61. 发明专利
    • BOILING COOLING DEVICE
    • JPH02152263A
    • 1990-06-12
    • JP30656588
    • 1988-12-02
    • MITSUBISHI ELECTRIC CORP
    • KAMEDA TAKUTERAGUCHI NOBUYUKI
    • H01L23/44
    • PURPOSE:To obtain a compact, lightweight boiling-cooling device at a low manufacturing cost as it requires a limited quantity of refrigerants by forming an insulation sheet or layer between a stack and the base of a vessel and removing the refrigerants which remain at the lower part of the stack. CONSTITUTION:An insulating sheet 10 is disposed between a stack 3 and the base of a vessel 1. This configuration reduces refrigerants at the lower part of the stack 3 to a minimum. As the stack 3 is located at the lowest part of the vessel, its location makes the height of the vessel low. Since the insulating sheet insulates an electrically charged part completely from a grounding part, the installation of the insulating sheet makes it possible to remove the insulating space between a heating substance and the vessel; besides, it lowers the housing positions of the stack to the lowest part of the vessel and then a limited quantity of the refrigerants is required to be housed. A compact, lightweight cooling device having a low vessel is thus obtained.
    • 62. 发明专利
    • SEMICONDUCTOR DEVICE WITH COOLING APPARATUS
    • JPH01233747A
    • 1989-09-19
    • JP6143388
    • 1988-03-14
    • MITSUBISHI ELECTRIC CORP
    • KAMEDA TAKU
    • H01L25/11H01L23/427H01L23/46
    • PURPOSE:To easily exchange a semiconductor element by a method wherein a part between a through hole part of a mounting plate and a heat pipe is sealed by laying a flexible sealing body in order to prevent dust, rainwater or the like from penetrating into a control apparatus box from the outside. CONSTITUTION:At a flexible sealing body 31 where a bellows has been formed and which is composed of a rubber material, a brim part on one end is bonded to a through hole 14a of a mounting plate 14 by using an adhesive or the like and the other end is closely put into a heat pipe 3. When a semiconductor element 1 becomes defective and is to be exchanged, a locking bolt 13 is loosened; an interval (A) between a metal block 2 and another metal block 2 is widened; the defective element 1 is taken out as shown by an arrow and is replaced with a new element 1. Although the pipe 3 is shifted inside the through hole 14a, the sealing body 31 is bent freely, and no trouble is caused. By this setup, it is prevented that dust, rainwater or the like penetrates into a control apparatus box from the outside; the element 1 can be exchanged easily.
    • 66. 发明专利
    • CONTROLLER FOR ELECTRIC VEHICLE
    • JPH0471303A
    • 1992-03-05
    • JP18629890
    • 1990-07-11
    • MITSUBISHI ELECTRIC CORP
    • KAMEDA TAKU
    • H02M5/45B60L9/24
    • PURPOSE:To reduce the weight and to simplify the structure by employing a unit constituted of a main circuit arm comprising two semiconductor elements connected in series for formation of a converter and an inverter, containing each unit in a container having same shape and then connecting the unit. CONSTITUTION:Two semiconductor elements 5, 5 are connected in series to constitute a main circuit arm 6 and a single unit 17 is constituted of main circuit arms 6 for two phases. AC voltage collected 2 from an overhead line 3 is transformed through two transformers 1 thence fed to the units 17 in a converter 4, and then DC outputs from the units 17 are connected in parallel and fed to an inverter 7. The inverter 7 comprises a single unit 17 identical to that in the converter 4 and a unit 19 including the main circuit arm 6 and an overcurrent protective circuit 9, and the inverter 7 produces three-phase VVVF power U-W for driving an induction motor 8. The units 17, 19 are contained in identical containers 18. According to the constitution, wiring is simplified, component can be employed commonly resulting in reduction of the size and the weight.
    • 67. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0376256A
    • 1991-04-02
    • JP21352389
    • 1989-08-18
    • MITSUBISHI ELECTRIC CORP
    • KAMEDA TAKU
    • H01L23/40
    • PURPOSE:To decrease a device of this design in maximum external shape and to improve a cooler in utilization factor so as to make the device small and lightweight by a method wherein two or more semiconductor elements electrically connected in parallel are arranged in parallel, and the semiconductor elements are pressure-welded as sandwiched between a pair of coolers provided at both the sides of the elements concerned. CONSTITUTION:GTO 1 and GTO 2 and DF 1 an DF 2 are arranged in parallel in two stages. Coolers, 16A, 16B, and 16C, are so structured to collectively cool the semiconductor elements 1 and 2 arranged in parallel. That is, the DF 1 and the GTO 2 electrically connected together in parallel are collectively pinched with the coolers 16A and 16B, and the DF 2 and the GTO 2 electrically connected together in parallel are collectively pinched with the coolers 16B and 16C to be cooled. Therefore, a clamping device 10 is formed in a two-stage structure, bolts 11 can be reduced in length by a certain value correspondent to the two-stage structure concerned, and an enough pressure-welding force can be obtained. A device of this design can be lessened in maximum external shape as an inverter device.
    • 68. 发明专利
    • VAPORIZATION COOLING APPARATUS OF ELECTRIC EQUIPMENT
    • JPS62160747A
    • 1987-07-16
    • JP247286
    • 1986-01-09
    • MITSUBISHI ELECTRIC CORP
    • KAMEDA TAKU
    • H01L23/44
    • PURPOSE:To improve heat radiation and to prevent the expansion and contraction of a tank drum, by forming the tank drum made of a thin plate in a zigzagging shape, thereby increasing the contact surface with refrigerant. CONSTITUTION:In a tank 7, a tank drum 7b, which is made of a thin plate, whose outer surface has a zigzagging shape 7a, is horizontally arranged. Both ends of the tank drum 7b are closed with end plates 7c. The tank drum 7b is formed by drawing a circular cylinder. The temperature of a liquid phase part 3a is increased with the heat of a semiconductor 4, which emits the heat, and the liquid is boiled. The stream of the liquid-phase part 3a, whose temperature is increased, is regulated with a guide plate 12, and convection is generated effectively. Vaporized flon gas 3 becomes a vapor phase 3b and rises up in the tank 7. Heat is absorbed by the flon 3. The heat is radiated from the approximately entire surface of the tank drum 7b in the zigzagging shape 7a. Thus the cooling efficiency can be enhanced. The expansion and contraction of the tank drum in the zigzagging shape 7a can be prevented by attaching the both end parts of the guide plate 12 to both end plates.