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    • 69. 发明专利
    • CONTINUOUS PLATING DEVICE
    • JPH06287736A
    • 1994-10-11
    • JP10015393
    • 1993-04-05
    • MITSUBISHI HEAVY IND LTD
    • MIHARA KAZUMASAFUJIOKA HIRONORIMIZUTA KEIJI
    • C23C2/20C23C2/24
    • PURPOSE:To prevent unequal plating thicknesses and to improve the quality of a plated thin strip with a device for correcting the C camber of the steel strip in a plating liquid film wiping section to be used for continuous plating equipment and coating equipment for the steel strip. CONSTITUTION:The metallic thin strip 1 transported by passing the inside of the plating liquid is injected with the high-velocity gas jets from gas jet nozzles 3 for wiping the plating films near these nozzles 3, by which the excess plating liquid of the plating films sticking to the surfaces of the thin strip 1 is scrapped off. A C camber deformation is generated in the thin strip 1 near the nozzles 3 for wiping. This warpage quantity is detected by sensors 4 for detecting the warpage quantity arranged right above the nozzles 3. The magnetic forces of magnets 2, 2 for correcting the camber deformation are acted on the direction where the camber in this section is eliminated and the magnitude thereof, by which the camber of the thin strip 1 is corrected. Consequently, the specified distances between the nozzles 3 for wiping and the thin strip 1 are set constant in the width direction of the thin strip. The wiping effect is thus uniformized in the width direction and the plating films having the uniform thicknesses are realized.