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    • 62. 发明专利
    • CONNECTION STRUCTURE FOR HIGH FREQUENCY TRANSMISSION LINE
    • JP2000114801A
    • 2000-04-21
    • JP27618698
    • 1998-09-29
    • KYOCERA CORP
    • KORIYAMA SHINICHINANJIYOU HIDEHIRO
    • H01P1/02H01P3/08
    • PROBLEM TO BE SOLVED: To provide a connection structure for a line suppressing reflection of signals at the connecting part of two high frequency transmission lines in different transmission directions. SOLUTION: This structure is provided on the surface of a dielectric substrate 2 or the inside and composed of high frequency transmission lines such as microstrip lines, triplate lines or coplanar lines provided with signal conductor lines 3 (3a and 3b) having prescribed line width and a ground layer 4 to connect two signal conductor lines 3a and 3b arranged in the same plane in which signal transmitting directions have a prescribed angle. In this case, inside corner parts 5a and 5b and outside corner parts 6a and 6b at the terminal parts of two signal conductor lines 3a and 3b orthogonally crossing in the signal transmitting directions are connected to each other by a conductor line 9 for connection with two linearly connected line segments 7 and 8 as line edge. Thereby, the reflection of signals at the connecting part of two high frequency transmission lines in different transmission directions can be suppressed especially in the high frequency area higher than 10 GHz.
    • 63. 发明专利
    • STRUCTURE FOR MOUNTING WIRING BOARD FOR HIGH FREQUENCY
    • JPH11312856A
    • 1999-11-09
    • JP11821298
    • 1998-04-28
    • KYOCERA CORP
    • KITAZAWA KENJIKORIYAMA SHINICHI
    • H05K1/18H01L21/60H01L23/12
    • PROBLEM TO BE SOLVED: To provide a structure for mounting a wiring board which is capable of transmitting high-frequency signals at a low transmission loss, without deteriorating the characteristics and is superior in transmission property, while preventing reflection of signals on the mounting part. SOLUTION: This wiring board for high frequency is provided with a dielectric substrate 2, a semiconductor element 5 for high frequency mounted on its surface, a first signal transmission line 7 which is formed on the surface of the dielectric substrate 2 and is connected with the semiconductor element 5, and a second signal transmission line 8 formed on the rear surface of the dielectric substrate 2, and it is formed by connecting the first signal transmission line 7 with the second signal transmission line 8. Further, the wiring board for high frequency is mounted to the wiring layer 12 of an outer circuit substrate 10 by means of a connecting part formed at the termination part of the second signal transmission line 7. In this case, a region 11 formed of material having a permittivity lower than that of the dielectric substrate and outer circuit substrate is provided on the surface of the outer circuit substrate 10 immediately below the joint part of the first and second signal transmission lines 7 and 8.
    • 64. 发明专利
    • MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE FOR HIGH FREQUENCY
    • JPH11260948A
    • 1999-09-24
    • JP6107598
    • 1998-03-12
    • KYOCERA CORP
    • KITAZAWA KENJIKORIYAMA SHINICHI
    • H01L23/04H01L23/02H01L23/12H01P3/08H01P5/02H05K1/02H05K1/18
    • PROBLEM TO BE SOLVED: To obtain the mounting structure of a wiring board, wherein the transmission loss of a high-frequency signal is less, transmission can be performed with less characteristic deterioration, the reflection and the like of the signal at the mounted part are suppressed and the transmission characteristics are excellent. SOLUTION: A semiconductor element 5 for high frequency is mounted in the inside of a cavity 4 formed of a dielectric substrate 2 and a cap body 3. On the surface of the dielectric substrate 2 in the cavity 4, a first signal transmission line 7, which is electrically connected to the semiconductor element 6, and a second signal transmission line 8 at the back surface of the dielectric substrate 2 are formed. A semiconductor package 1 for high frequency formed by connecting the first signal transmission line 7 and the second signal transmission line 8 is mounted on a wiring layer 12 of an outer circuit substrate 10 through the connecting part formed on the second signal transmission line 8 in this mounting structure. In this case, a cavity part 11 is provided at the surface of the outer circuit board 10 neighboring the connecting region, which is formed of the first signal transmission line 7 and the second signal transmission line 8 in the package 1.
    • 65. 发明专利
    • PACKAGE FOR HIGH-FREQUENCY ELEMENT
    • JPH11214580A
    • 1999-08-06
    • JP972198
    • 1998-01-21
    • KYOCERA CORP
    • KITAZAWA KENJIKORIYAMA SHINICHI
    • H01L23/12H01L23/02H01L23/04H01L23/52H01P5/02H01P5/107
    • PROBLEM TO BE SOLVED: To provide a package for a high-frequency element, the lid body of which dose not cause characteristic impedance mismatching, etc., and which has a superior hermetically sealing characteristic and transmission characteristic. SOLUTION: A dielectric substrate 7 is buried in the surface of the metallic substrate 1 of a heat sink, etc., having a high-frequency element 2 mounting section, with the surface of the substrate 1 crossing the bonding spots of a lid body which is bonded to the surface so as to form a cavity for airtightly sealing the element 2, and a first high-frequency transmission line, such as the microstrip line 10, etc., connected to the element 2 is formed on the surface of the substrate 7 in the cavity. Then a second high-frequency transmission line, such as the dielectric waveguide, etc., is formed in the outside area of the cavity and electromagnetically coupled with the first transmission line. In addition, a third high-frequency transmission line, such as the microstrip line 14, etc., is formed on the surface of the dielectric substrate 1 on the outside of the cavity and electromagnetically coupled with the second transmission line.
    • 66. 发明专利
    • HIGH FREQUENCY PACKAGE AND CONNECTION STRUCTURE THEREOF
    • JPH11135660A
    • 1999-05-21
    • JP30092697
    • 1997-10-31
    • KYOCERA CORP
    • KORIYAMA SHINICHIKITAZAWA KENJI
    • H01L23/12H01L23/02H01L23/04H01P5/107H03F3/60
    • PROBLEM TO BE SOLVED: To provide a high frequency package which can be connected at all times at high accuracy with a waveguide having an open end, while sustaining airtightness in a cavity and a connection structure thereof. SOLUTION: This high frequency package A1 comprises a dielectric substrate 1, a cavity 3 for containing a high frequency element 4, a cover 2, and a high frequency transmission line 5 formed on the surface of the dielectric substrate 1 in the cavity 3 and having one end connected with the high frequency element 4 and a termination part 5a. The high frequency package A1 is connected with a waveguide B1, having an open end B' through a connection structure. The package A1 has a ground layer 7 provided in the dielectric substrate 1 or on the side thereof, where the transmission line 5 is not formed with an opening 6 which is made at a position facing the termination part 5a of the transmission line 5. The guide pin 13 of a waveguide B1 is inserted into a positioning hole 10 and connected electrically at a position, where the opening 6 of the ground layer 7 comes at the center of the waveguide B1 so that the ground layer 7 forms the termination wall of the waveguide B1.
    • 67. 发明专利
    • CONVERTING LINE
    • JPH10335910A
    • 1998-12-18
    • JP13892897
    • 1997-05-28
    • KYOCERA CORP
    • KORIYAMA SHINICHIKITAZAWA KENJI
    • H01P5/08
    • PROBLEM TO BE SOLVED: To provide with a small loss a converting line for high frequency which can transmit milliwave signals to a microstrip line from a coplanar line with ground. SOLUTION: A converting line converts a coplanar line A with ground composed of a center conductor 1, first ground layers 2 formed on both sides of the conductor 1 at intervals Gc, and a second ground layer 3 formed in a plane which is parallel with the plane in which the center conductor 1 is formed, but different from the plane, into a microstrip line B composed of a strip conductor 4 and the second ground layer 3. Since the line width of the strip conductor 4 is made wider than that of the center conductor 1 and the conductor 4 is connected to the conductor 1 via a tapered conductor section 5 the line width of which is gradually made broader towards the conductor 1. Tapered ground layers 2 are formed on both sides of the tapered conductor section 5, so that the intervals between their edges and the section 5 become longer towards the line A, and the starting points 7 of the tapered ground layers 2' are shifted to the line A side from the expansion starting points 6 of the section 5, a converting line having a small milliwave signal loss can be realized.
    • 68. 发明专利
    • SEMICONDUCTOR DEVICE FOR HIGH FREQUENCY
    • JPH10163375A
    • 1998-06-19
    • JP31807296
    • 1996-11-28
    • KYOCERA CORP
    • FUJII MIKIOKITAZAWA KENJIKORIYAMA SHINICHI
    • H01L23/12H01P5/02
    • PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which can transmit microwaves and milliwaves at a low transmission loss through a high-frequency transmission line and has a simplified structure. SOLUTION: On the upper surface of a dielectric board 2, a semiconductor element 5 for high frequency is mounted and a first transmission line 6 for high frequency electrically connected with the element 5 is formed and, on the lower surface of the board 2, a second transmission line 8 is formed. In addition, a first grounding layer 7 is formed on the upper surface of the board 2 so as to surround the element 5 and line 6. The lines 6 and 8 are electromagnetically connected to each other and, at the same time, a conductive cap body 3 is attached to the first grounding layer 7 so as to airtightly seal the element 5 and line 6. In the board 2, moreover, a second grounding layer 9 having slot holes 12 is formed and the terminating end sections of the lines 6 and 8 are faced and electrically connected to each other through the holes 12.