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61. 发明专利

JPS63159434A POLYIMIDE FILM AND ITS PRODUCTION 失效
公开(公告)号：JPS63159434A
公开(公告)日：1988-07-02
申请号：JP19143187
申请日：1987-07-30
申请人： HITACHI LTD
发明人： NUMATA SHUNICHI , IKEDA TAKAE , FUJISAKI KOJI , MIWA TAKAO , KANESHIRO TOKUYUKI
IPC分类号： B32B27/34 , B05D7/24 , C08G73/10 , C23C14/12 , C23C14/24 , H01L21/312
摘要： PURPOSE:To obtain the title film which is pinhole-free, uniform and excellent in strength, by vapor-depositing a specified aromatic compound (derivative) on a base and polymerizing the compound on the base. CONSTITUTION:An aromatic compound having one amino group and two vicinal carboxyl groups in the molecule (e.g., aminophthalic acid) or its derivative such as a monoester, diester, acid chloride or acid anhydride is vapor-deposited on a base and polymerized on the base to obtain a polyimide film in which the imido groups in the main chains are oriented in one direction and which is represented by the formula (wherein R is a bivalent hydrocarbon group or a bivalent aromatic group, and is optional).

62. 发明专利

JPS6364340A INTERCONNECTION STRUCTURE EFFECTIVE FOR IMPROVING FLATNESS OF ORGANIC INTERLAYER FILM 失效
公开(公告)号：JPS6364340A
公开(公告)日：1988-03-22
申请号：JP20778786
申请日：1986-09-05
申请人： HITACHI LTD
发明人： MIWA TAKAO , NUMATA SHUNICHI , FUJISAKI KOJI , IKEDA TAKAE , KANESHIRO TOKUYUKI
IPC分类号： H01L21/3205 , H05K3/46
摘要： PURPOSE:To obtain an interlayer insulation film having improved flatness and improved characteristics well applicable to practical use, by providing a required number of projected layers between interconnection conductor layers on the reference plane on which an interconnection structure is to be provided, while the projected layers have a height similar to that of the interconnection conductor layers. CONSTITUTION:When varnish is used for an interlayer insulation film, the flatness of the resulting organic interlayer film becomes more improved, the smaller is a distance between interconnection conductor layers provided on the reference plane such as a substrate or the like on which an interconnection structure is to be provided. If the distance between the interconnection conductor layers provided on the reference plane is too large, a required number of projected layers having a thickness similar to that of the interconnection layers are provided therebetween. As a result, the distance between the portions projected from the reference plane including the interconnection conductor layers is decreased. An organic interlayer film having an improved flatness can be obtained in this manner.

63. 发明专利

JPS6239939B2 失效
公开(公告)号：JPS6239939B2
公开(公告)日：1987-08-26
申请号：JP15220081
申请日：1981-09-28
申请人： HITACHI LTD
发明人： KANESHIRO TOKUYUKI , OOHARA SHUICHI , SUGAWARA TOORU , TSUCHA SHIGEKI
IPC分类号： H01C7/00 , G01N27/12

64. 发明专利

JPS62146935A RESIN COMPOSITION HIGHLY FILLED WITH INORGANIC SUBSTANCE AND RESIN-SEALED SEMICONDUCTOR DEVICE USING THE SAME 失效
公开(公告)号：JPS62146935A
公开(公告)日：1987-06-30
申请号：JP28774385
申请日：1985-12-23
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , OGATA MASAJI , KANESHIRO TOKUYUKI , NARAHARA TOSHIKAZU
IPC分类号： H01L23/29 , C08K7/00 , C08K7/08 , C08L101/00 , H01L23/31
摘要： PURPOSE:To obtain a resin composition highly filled with an inorganic substance which can give a resin-sealed semiconductor device excellent in reliability, by mixing a thermoplastic or thermosetting resin with a filler which is an inorganic substance of an octahedral shape. CONSTITUTION:The titled composition is obtained by kneading a thermoplastic or thermosetting resin (A) [e.g., a polyepoxy oligomer based on tris(hydroxyphenyl)methane] with 70vol% or above filler (B) which is an inorganic substance having an octahedral shape shown in the Fig. and preferably has such a dimension that a/d and c/b are each 0.1-100 and each length is 100mum or below (e.g., potassium titanate of the composition of K2O.nTiO2 wherein n>=6) and, optionally, other fillers at a normal or elevated temperature under a normal or diminished pressure. This composition is molded under applied heat and pressure or under applied ultrasonic waves or mechanical vibrations.

65. 发明专利

JPS62146914A EPOXY RESIN COMPOSITION 失效
公开(公告)号：JPS62146914A
公开(公告)日：1987-06-30
申请号：JP28774985
申请日：1985-12-23
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , ISHII TAKEO , NISHIKAWA AKIO , OGATA MASAJI , KANESHIRO TOKUYUKI
IPC分类号： C08G59/42
摘要： PURPOSE:To obtain the title resin composition having a high glass transition temperature and excellent heat resistance and flexibility, by mixing an epoxy resin with trimellitic anhydride triglyceride as a curing agent, a cure accelerator and a flexibilizer. CONSTITUTION:The purpose epoxy resin composition is obtained by mixing an epoxy resin (A) (e.g., phenol novolak epoxy resin) with a curing agent (B) comprising trimellitic anhydride triglyceridee of the formula, a cure accelerator (C) (e.g., triethylamine tetraphenylborate) and a flexibilizer (D) (e.g., carboxyl group-terminated polybutadiene or epoxy-modified silicone intermediate) as essential components. this epoxy resin composition has such heat resistance that it can be used at temperatures as high as about 200 deg., does not crack and can be suitably used as a material for electronic components, a material for laminates or the like.

66. 发明专利

JPS62112048A ION SELECTIVE ELECTRODE 失效
公开(公告)号：JPS62112048A
公开(公告)日：1987-05-23
申请号：JP25079485
申请日：1985-11-11
申请人： HITACHI LTD
发明人： OKI NAOTO , SHIBATA YASUHISA , MIYAGI HIROYUKI , KANESHIRO TOKUYUKI
IPC分类号： C07F7/00 , G01N27/30 , G01N27/333
摘要： PURPOSE:To obtain high selectivity for a specific anion by using a metal type org. compd. of which the part enclosed by plural metallic elements form an ionophore as an anion selective material. CONSTITUTION:The titled ion-selective electrode utilizes an ion sensitive film which is formed by dispersing ion sensitive material in a polymer. As the ion- sensitive material, a compound having composition as shown by the formula is used. Since the IV metallic element M serves as an electron donar by combina tion of the compound with electron attractive group X, the part enclosed by plural metallic elements forms an ionophore as an anion. The electrode thus obtained exhibits high selectivity for a specific anion, enhancing precision in electrolyte analysis of blood. This can also be applied to the analysis of Cl , HCO3 , NO3 , or an organic anion. In the formula, R1-R6 are organo group, M is IV metallic element, X is electron attractive group, and m, n are repeating number.

67. 发明专利

JPS61281152A RESIN COMPOSITION 失效
公开(公告)号：JPS61281152A
公开(公告)日：1986-12-11
申请号：JP12247885
申请日：1985-06-07
申请人： HITACHI LTD
发明人： YOKOYAMA TAKASHI , KANESHIRO TOKUYUKI
IPC分类号： C08K7/00 , C08L1/00 , C08L23/00 , C08L27/00 , C08L77/00 , C08L101/00
摘要： PURPOSE:To provide a resin composition effective to decrease the disconnection defect of a semiconductor element especially having high integration degree when applied to the element as a sealing and surface protection material, by compounding a resin component with a filler consisting of powder of a resin having low expansion coefficient. CONSTITUTION:(A) A resin component composed of a thermoplastic resin or thermosetting resin composition, e.g. a resin containing imide ring or a resin component containing epoxy compound as at least a component is compounded with (B) a powdery resin having low expansion coefficient, e.g. (B1) powdery polyimide having low expansion coefficient and obtained by (1) reacting p- phenylenediamine with equimolar amount of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride in N-methyl-2-pyrrolidone solution, (2) pouring the obtained polyamic acid varnish in ice water to produce amic acid powder and, (3) heating the powder under reduced pressure, or (B2) fibrous resin powder obtained by heat-treating a thermoplastic polymer under uniaxial drawing.

68. 发明专利

JPS61177756A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61177756A
公开(公告)日：1986-08-09
申请号：JP1656685
申请日：1985-02-01
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , OGATA MASAJI , KANESHIRO TOKUYUKI , TAKAHASHI AKIO
IPC分类号： C08G59/00 , C08G59/08 , C08G59/14 , H01L23/29 , H01L23/31
摘要： PURPOSE:To enable high-reliability action even in long-time leaving states under high temperature and high moisture, by a method wherein the title device is formed by sealing with a compound having a specific cyanamide terminal group and a glycidyl ether terminal group and a resin composition containing an N, N'-substituted bisimide compound. CONSTITUTION:This device contains a cyanamide terminal group and a glycidyl terminal group expressed by formulas. [In formulas, an annular side chain R is H or CH3, and respective mol numbers m, n are any of m+n>2, m=1-5, n=0-5]. The resin composition can also compound a kind or more of epoxy resin, phenol resin, melamine resin, etc. Use with particularly epoxy resin from among them is useful in enlargement af application and effect.

69. 发明专利

JPS61176803A STRAIN GAGE 失效
公开(公告)号：JPS61176803A
公开(公告)日：1986-08-08
申请号：JP1689085
申请日：1985-01-31
申请人： HITACHI LTD , MINEBEA KK
发明人： NUMATA SHUNICHI , KANESHIRO TOKUYUKI , HOSHI KATSUYUKI , SUGAWARA HIDEO
IPC分类号： G01B7/16
摘要： PURPOSE:To obtain a strain gage having high reliability by using a low thermal expansion resin material having a specific chemical structure and consisting of oriented polyimide. CONSTITUTION:The strain gage is formed with a gage pattern consisting of a resistor grid made of a nickel alloy (for example, copper-nickel alloy and/or nickel chromium alloy) on a film constituted of a polyimide resin material and is connected with lead wires at both ends (may not be complete ends) of the gage pattern. The low expandable polyimide expressed by, for example, the formula is used. In the formula, R is an alkyl group, fluorinated alkyl group, alkoxyl group, fluorinated alkoxyl group, acyl group or halogen, l is 0-4, m is 0-2, n is 0-3. This resin is lower in thermal expandability and higher in strength, elasticity and heat resistance that other polymers but the properties thereof are remarkably improved when subjected to a molecular orientation treatment.

70. 发明专利

JPS60226144A RESIN-SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60226144A
公开(公告)日：1985-11-11
申请号：JP8183384
申请日：1984-04-25
申请人： HITACHI LTD
发明人： OGATA MASAJI , ABE HIDETOSHI , SEGAWA MASANORI , NISHIKAWA AKIO , KANESHIRO TOKUYUKI
IPC分类号： H01L23/52 , H01L21/3205 , H01L23/28 , H01L23/29
摘要： PURPOSE:To improve the reliability of titled device at high temperature and high humidity by a method wherein aluminum and/or aluminium alloy as electrode and wiring member are processed in water solution with specific pH value preliminarily containing antimony oxide and aminosilane compound to be sealed with resin. CONSTITUTION:When the surface of aluminum and/or aluminium alloy as electrode and wiring member is processed in water solution with specific values of pH 3-9 containing antimony oxide and aminosilane compound, corrosion protective covering containing said compounds is formed on the surface to improve the moisture proof reliability. As for the aminosilane compound, e.g. gamma- aminopropyltriethoxysilane etc. is applicable. The process solution composed of antimony oxide and aminosilane compound added to pure water may be thoroughly agitated and mixed under heating condition at 60-100 deg.C to adjust the pH value thereof by means of adding organic or inorganic acid thereto as necessary.

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