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61. 发明专利

JPH04199590A ELECTRIC CIRCUIT MODULE 失效
公开(公告)号：JPH04199590A
公开(公告)日：1992-07-20
申请号：JP32566890
申请日：1990-11-29
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： NOKIMURA HITOSHI , AZUMAGUCHI YUTAKA , OTAGURO HIROYUKI , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H05K9/00 , H05K1/00 , H05K1/02 , H05K7/14
摘要： PURPOSE:To enable high-density packaging of electronic components by forming the peripheral end faces of a board each obliquely in a developed state of a module board and by bringing oblique faces counter in an assembled state as oblique faces into face contact. CONSTITUTION:Peripheral end faces are each formed to be oblique in a developed state of a module board 1 into oblique faces. A flexible printed wiring board 2 extends the oblique faces 5 and is so constituted that the conductive patterns of counter oblique faces 5 may come into face contact to have continuity in an assembled state. That is, a module board is shaped in a rectangular parallelepiped; therefore, electronic components can be packaged on the top face and the four sides in addition to the bottom face with the result that the mount area of electronic components can be enlarged without enlarging an occupation area to a packaging printed wiring board. This design allows high-density packaging of electronic components.

62. 发明专利

JPH04185003A ANTENNA MODULE AND ITS PRODUCTION 失效
公开(公告)号：JPH04185003A
公开(公告)日：1992-07-01
申请号：JP31294390
申请日：1990-11-20
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： AMANO TOSHIAKI , SHIROISHI HIROKAZU , FUSE KENICHI , AZUMAGUCHI YUTAKA , KASHIWABARA HIROTAKA , INAGAKI MITSUO
IPC分类号： H01Q1/38 , H01Q1/24 , H01Q9/26 , H01Q9/36 , H01Q9/40
摘要： PURPOSE:To produce an antenna module considerably lighter than sheet metal working products by fixing an element conductor layer and a ground conductor layer to the surface of a resin formed body by adhesion and eliminating a need of the mechanical strength only required to hold the shape of each conductor layer. CONSTITUTION:With respect to a metallic foil for an element conductor layer 32 and a feeder 33, a pattern of the conductor layer 32 and the feeder 33 is formed by pattern etching of a copper foil made of a composite material, and an adhesive 38 is applied to the side face of a plastic film 37 to be the adhesive face to the resin formed body and is half hardened, and the external form processing is performed. With respect to a metallic foil for a ground conductor layer 31, a pattern of the conductor layer 31 is formed by pattern etching of a copper foil made of a composite material. After the adhesive 38 is applied to the side face of the plastic film 37, the external form processing is performed. Thus, the antenna module considerably lighter than a sheet metal formed part is produced.

63. 发明专利

JPH0335541A MANUFACTURE OF CARRIER TAPE 失效
公开(公告)号：JPH0335541A
公开(公告)日：1991-02-15
申请号：JP16975289
申请日：1989-07-03
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To enable effective manufacture without causing environmental pollution, etc., by providing a device hole to an insulating tape, by filling and hardening removable ink thereon, by providing a metallic film layer, by forming a conductor circuit through etching and by peeling and removing the filled ink. CONSTITUTION:A device hole 5 and a sprocket hole 6 are punched in an insulating tape 1. An adhesive film 7 whose adhesiveness is eliminated by irradiation of ultraviolet ray is applied to one side of the insulating tape 1, and hole-filling ink 8 is filled in the device hole in the other side thereof; then, the ink is heated and hardened. Ultrasonic ray is irradiated to harden a resist and to eliminate adhesiveness, an adhesive film 7 is peeled, and a copper thin film is formed to the peeled side by sputtering. A copper foil layer 2 is provided by electrolytic copper plating. An etching resist is applied to a surface of the copper foil layer 2. After exposure through a photomask, development is carried out with NaCo3 water solution. Only a conductor circuit of the copper foil layer 2 is covered with an etching resist 3, and a conductor circuit 2a is formed by etching. Finally, the etching resist 3 and the hole-filling ink 8 are peeled and removed.

64. 发明专利

JPH01266789A MANUFACTURE OF MOLDED CIRCUIT BOARD 失效
公开(公告)号：JPH01266789A
公开(公告)日：1989-10-24
申请号：JP9443188
申请日：1988-04-19
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , ISAWA MASAYUKI , KATO TOMOYA
IPC分类号： H05K3/00 , H05K3/20
摘要： PURPOSE:To realize efficient manufacture by a method wherein solder resist is applied to one surface of a copper foil by printing, a carrier film is laminated, etching resist is applied to the other surface of the copper foil by printing and a circuit pattern is formed and, after molding, the carrier film is removed. CONSTITUTION:Solder resist 2 is applied to one surface of a copper foil 1 by printing and a carrier film 3 is laminated on it. Then etching resist 4 is applied to the other surface of the copper foil 1 by printing and the copper foil 1 is etched to form a circuit pattern 5. The circuit transcription film 7 formed like this is placed in dies 8A and 8B so as to bring the carrier film 3 side surface of the film 7 into contact with the inner surface of the die 8A and molded to form a resin molded unit 9. After that, the carrier film 3 is removed. Therefore, the copper foil circuit pattern 5 which has the printed solder resist 2 on its surface can be unified with the resin molded unit without employing nonelectrolytic plating. With this constitution, the productivity can be improved.

65. 发明专利

JPS6334933A FORMATION OF BUMP ON LEAD 失效
公开(公告)号：JPS6334933A
公开(公告)日：1988-02-15
申请号：JP17761186
申请日：1986-07-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO , AMANO TOSHIAKI
IPC分类号： H01L21/60
摘要： PURPOSE:To eliminate a bump transfer substrate and an accurate bump positioning by coating leads with a viscous solution in which a metal salt of abietic acid and a bump material is dissolved in an organic solvent, and heating it to form a bump. CONSTITUTION:When a gold bump is formed, a tape carrier 11 formed with leads 11 made of copper foils is prepared on a plastic tape 12 having a hole 13, and the surfaces of the leads 14 are nickel-plated. Metal salt of abietic acid and gold is dissolved in an organic solvent to form a viscous solution 21, and the ends of leads 14 are coated with the solution. Then, it is heated to approx. 200 deg.C to precipitate gold 22 on the leads 14, residue 23 is then removed by cleaning. Then, a gold bump 24 can be formed. Thus, the bump can be simply formed on the leads without transferring.

66. 发明专利

JPS6317589A DOUBLE-LAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS6317589A
公开(公告)日：1988-01-25
申请号：JP16082886
申请日：1986-07-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , KOBAYASHI KENZO
IPC分类号： H05K1/02 , H05K3/46

67. 发明专利

JPS62190796A DOUBLE-LAYER PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS62190796A
公开(公告)日：1987-08-20
申请号：JP3201586
申请日：1986-02-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： AMANO TOSHIAKI , KATO TOMOYA , KOBAYASHI KENZO
IPC分类号： H05K3/46

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