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61. 发明专利

JPH06120637A RIGID CIRCUIT BOARD WITH FLEXIBLE WIRING BOARD 失效
公开(公告)号：JPH06120637A
公开(公告)日：1994-04-28
申请号：JP28497292
申请日：1992-10-01
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI TAKAO , SAKAI KATSUTOSHI , KOBAYASHI KENZO
IPC分类号： H01L21/60 , H05K1/14 , H05K3/36
摘要： PURPOSE:To downsize a rigid circuit board by connecting the wire bonding pads of a flexible glass epoxy wiring board directly with the pads of an electronic component through wire bonding thereby eliminating the need of individual joints for the flexible wiring board and the electronic component. CONSTITUTION:A flexible glass epoxy wiring board 17 is bonded, on one end side thereof, to the vicinity of a bare chip component 13 mounted on an aluminium base circuit board 11. The flexible glass epoxy wiring board 17 has one end side where wire bonding pads are formed, the other end side where various components 21 of control/protective circuit for bare chips are mounted, and an intermediate part, i.e., a flexible interconnection part. Pads 19 of the flexible glass epoxy wiring board 17 are connected electrically with the pads of the bare chip component 13 by wire bonding 25. Since electrical connection is established through wire bonding, necessary area of rigid circuit board can be decreased resulting in downsizing.

62. 发明专利

JPH0566685B2 失效
公开(公告)号：JPH0566685B2
公开(公告)日：1993-09-22
申请号：JP25499384
申请日：1984-12-04
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , OOKUSA KUNITAKE , FUSE KENICHI , OONO RYOJI
IPC分类号： H01F7/08 , H01B7/08 , H01R23/66

63. 发明专利

JPH05243759A 失效
公开(公告)号：JPH05243759A
公开(公告)日：1993-09-21
申请号：JP7571992
申请日：1992-02-27
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI TAKAO , KOBAYASHI KENZO
IPC分类号： B29C65/08 , B29L31/34 , H05K5/06 , H05K7/12 , H05K7/14
摘要： PURPOSE:To prevent a circuit board from damage due to ultrasonic vibration by interposing an elastic body between the circuit board and a case and also placing the circuit board vertically against the ultrasonic vibration direction when two thermoplastic resin cases containing the circuit board are subject to ultrasonic welding and sealing. CONSTITUTION:A circuit board 27 is placed vertically against the butting faces P of two cases in a lower case 11 and an upper case 13 that are made of thermoplastic resin, and simultaneously an elastic body 29 such as formed plastic, etc., is interposed between end edges and the cases 11 and 13. In such a state, when ultrasonic vibration B is applied while applying a pressure A vertically against the faces P of the cases 11 and 13, the cases 11 and 13 can be ultrasonic-welded without giving any vibration to the board 27 at all. If ultrasonic welding is carried out with pressure A applied, the body 29 is compressed to hold the board 27 firmly in the cases 11 and 13.

64. 发明专利

JPH05191010A LARGE CURRENT CIRCUIT BOARD 失效
公开(公告)号：JPH05191010A
公开(公告)日：1993-07-30
申请号：JP2156292
申请日：1992-01-13
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , YAMAMORI KAZUYUKI , KOBAYASHI KENZO , YATABE HIROSHI
IPC分类号： H05K1/11 , H05K1/02 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/32 , H05K3/34 , H05K3/42
摘要： PURPOSE:To prevent a screw from loosening by heat cycle by a method wherein a plurality of through holes or through studs are formed on the region, where screw-fastening pressure is applied, on the circumference of screw-inserting holes. CONSTITUTION:A number of through holes 35, through an insulated board, are formed on the region where pressure is applied by screwing on the circumference of a screw-inserting hole. The screw hole 35 is formed by drilling a hole on an insulating board 13 and inner surface of the hole is copper-plated. When the through hole 35 is formed, the stress relaxation of the insulated board 13 can be prevented because the inner face plated part of the through hole functions as the erasing member when a large current circuit board 17 is fastened directly by a screw 21 and a nut 23, and the screw 21 is prevented from loosening. Accordingly, the formation of a cylindrical part is unnecessitated by conducting a burring process on a thick film circuit conductor 11. As a result, the cost of the large current circuit board can be cut down.

65. 发明专利

JPH05187915A OPTICAL SENSOR 失效
公开(公告)号：JPH05187915A
公开(公告)日：1993-07-27
申请号：JP335392
申请日：1992-01-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI TAKAO , OBARA YUICHI , KOBAYASHI KENZO
IPC分类号： G01J1/02 , G01N21/88 , G06K9/20 , H04N1/04 , H04N1/19
摘要： PURPOSE:To give a highly accurate discriminating ability to an optical sensor by incorporating an optical block composed of a substrate, light emitting element, and photodetector, translucent bodies provided between the block and an object to be detected, and means for controlling the light emitting element and photodetector in the sensor and dividing the translucent body into a plurality of areas in corresponding to the divided areas of the object to be detected. CONSTITUTION:A light emitting element 11 and a photodetector 12 are mounted on a substrate 10, constituting a module, and two translucent bodies 14 are formed below the substrate 10 so that the bodies can face the sections A and B of an object 13 to be detected. The light emitted from the element 11 reaches the object 13 after passing through the bodies 14. The light reflected by the object 13 is received by the photodetector 12 after passing through the bodies 14. The received light deciphers a pattern by collating with previously inputted basic patterns and the pattern information of the object 13. The above-mentioned operations are performed against each module corresponding to the sections A and B of the object 13. Since the pattern of the object is independently detected, the discriminating accuracy of this optical sensor is improved.

66. 发明专利

JPH04356000A HEAT RELEASING PART COOLING STRUCTURE FITTED TO BOARD 失效
公开(公告)号：JPH04356000A
公开(公告)日：1992-12-09
申请号：JP3165791
申请日：1991-01-31
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , KOBAYASHI KENZO , SOTANI JIYUNJI , TANAKA SUEMI
IPC分类号： H05K7/20
摘要： PURPOSE:To provide a cooling structure which is capable of dissipating the heat released from a heat generating part fixed onto a board. CONSTITUTION:An adequate number of flat first heat pipes 5 are provided along a prescribed direction so as to come into contact with a heat releasing part 2 on a board 1 or through the intermediary of a heat transfer plate 4, and second heat pipes 7 which are made to intersect the first heat pipes 5 and provided with the heat dissipating part 71 at the end are formed flat except the heat dissipating part 71. The first heat pipes 5 and the second heat pipes 7 are made to come into area contact with each other at intersections, whereby contact thermal resistance can be lessened and heat transportation can be enhanced between the heat pipes 5 and 7.

67. 发明专利

JPH04142097A INSULATING METHOD FOR INNER SURFACE OF HOLE OF CIRCUIT BOARD 失效
公开(公告)号：JPH04142097A
公开(公告)日：1992-05-15
申请号：JP26314890
申请日：1990-10-02
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , YAMAMORI KAZUYUKI , KOBAYASHI KENZO , YATABE HIROSHI
IPC分类号： H05K3/28 , H05K3/46
摘要： PURPOSE:To apply insulating ink in a uniform thickness to the inner surface of a hole of a circuit board by inserting a rodlike pen stuck or immersed with the ink into the hole of the board and then removing it. CONSTITUTION:When a circuit board 31 is set on a supporting base 32, a hole 23 coincides at center axial lines with a rodlike pen 34. Then, when sufficient amount of insulating ink is immersed at the end of the pen 34, a pen securing plate 33 is moved down, the end of the pen 34 is inserted into the hole 32, and then removed. Accordingly, the inner surface of the hole 23 is coated with the ink. Thus, the inner surface of the hole can be effectively coated with the ink in a uniform thickness.

68. 发明专利

JPH04132294A COMPOSITE CIRCUIT BOARD 失效
公开(公告)号：JPH04132294A
公开(公告)日：1992-05-06
申请号：JP25195390
申请日：1990-09-25
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , KOBAYASHI KENZO , YATABE HIROSHI
IPC分类号： H05K3/46
摘要： PURPOSE:To reduce a mounting space of a circuit board and to reduce the number of components by forming a large current thick circuit conductor and a small current thin circuit conductor separately on regions in a board surface direction in the same insulating board. CONSTITUTION:A composite circuit board 21 is divided in to a large current thick circuit conductor 15 and a small current thin circuit conductor 19 separately in regions in a board surface direction in one insulating board 22. A first weak current circuit board 31A, a predetermined number of prepreg sheets 32A, a first thick conductor pattern 33A, a prepreg sheet 32B, a second small current circuit board 31B, a prepreg sheet 32C, a second thick conductor pattern 33B, a prepreg sheet 32B, and a third small current circuit board 31C are laminated. The thin circuit conductors 19 of the boards 31A-31C are formed on a region not superposed with the conductor 15 at the right side of one-dotted chain line of the partial region of an insulating board 34. Accordingly, the board is simplified, the mounting space is reduced, the influence of a large current circuit side noise to the small current circuit is reduced.

69. 发明专利

JPH0361315B2 失效
公开(公告)号：JPH0361315B2
公开(公告)日：1991-09-19
申请号：JP16019085
申请日：1985-07-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , KOBAYASHI KENZO , OOKUSA KUNITAKE , FUSE KENICHI
IPC分类号： H01R11/01 , H01R43/00

70. 发明专利

JPH0321095A MANUFACTURING METHOD FOR LARGE ELECTRIC CURRENT CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH0321095A
公开(公告)日：1991-01-29
申请号：JP15447289
申请日：1989-06-19
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , YATABE HIROSHI , YAMAMOTO MASAAKI
IPC分类号： H05K3/20
摘要： PURPOSE:To obtain a large current circuit substrate where the positional accuracy of a circuit conductor is stabilized by allowing adjoining circuit conductors to form a punched circuit pattern connected with a narrow bridge, laminating the punched circuit pattern and a prepreg sheet, and heating and pressing them with a hot press. CONSTITUTION:A plurality of circuit conductors 12 are laid out at a specified position by punching work from a conductive metal sheet. Moreover, the adjoining circuit conductors 12 from a punched circuit pattern 13 connected with a narrow bridge 15. The punched circuit pattern 13 and a prepreg sheet 19 are laminated, heated and pressed with a hot press so as to produce an intermediate for a large electric current circuit substrate with the punched circuit pattern 13 embedded on the surface of an insulation substrate 11. After the above process is over, the bridge portion of the intermediate is cut off. As described above, the adjoining circuit conductors 12 are connected with the narrow bridge 15 and positioned when they are heated and pressed with the hot press. Therefore, they will not make any relative motion due to the fluidity of resin. It is, therefore, possible to produce the large current circuit substrate where the position of the circuit conductors is stabilized.

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