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61. 发明专利

JP2005170514A Electrically conductive sheet for packaging container for electronic component 有权
标题翻译：电子元件包装容器的导电片
公开(公告)号：JP2005170514A
公开(公告)日：2005-06-30
申请号：JP2004350677
申请日：2004-12-03
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： KOSUGI KAZUHIRO , MIYAGAWA KENJI , HIGANO MASANORI , SHIMIZU MIKIO
IPC分类号： B65D73/02 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/30 , B32B27/36 , B42D1/08 , B65D65/40 , B65D85/86 , C08K3/04 , C08L69/00
CPC分类号： B32B27/08 , B32B27/20 , B32B27/302 , B32B27/36 , B32B27/365 , B32B2307/202 , B32B2307/538 , B32B2313/04 , B32B2325/00 , B32B2355/02 , B32B2369/00 , B32B2439/06 , B42D1/08 , Y10S428/902 , Y10T428/30 , Y10T428/31504 , Y10T428/31507 , Y10T428/31855 , Y10T428/31935 , Y10T428/31938
摘要： PROBLEM TO BE SOLVED: To provide a packaging container for electronic components, in which contamination of the electronic components caused by wear between a sheet and the electronic components is slight and which has sufficient mechanical strength to withstand packaging and mounting of the electronic components at a high speed. SOLUTION: An electrically conductive sheet, which is prepared by laminating a surface layer, composed of electrically conductive resin composition containing 5 to 50 wt% of a carbon black in a polycarbonate type resin on the both surfaces of a basis material layer selected from among (1) to (3) shown below, is used for the packaging container for electronic components. (1) a basis material layer containing an ethylene terephthalate type resin and a polycarbonate type resin. (2) a backing material layer, containing an imido copolymer having an aromatic vinyl monomer residue and an unsaturated dicarboxylic acid imido derivative residue. (3) a basic material layer containing a rubber like polymer and imido copolymer having an aromatic vinyl monomer residue and an unsaturated dicarboxylic acid imido derivative residue and an unsaturated dicarboxylic acid anhydride residue. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电子部件的包装容器，其中由片材和电子部件之间的磨损引起的电子部件的污染是轻微的并且具有足够的机械强度来承受电子包装和安装组件高速。解决方案：一种导电片，其通过在选择的基材层的两个表面上层叠由聚碳酸酯型树脂中含有5至50重量％的炭黑的导电树脂组合物制成的表面层从以下所示的（1）至（3）中，用于电子部件用包装容器。（1）含有对苯二甲酸乙二酯型树脂和聚碳酸酯型树脂的基材层。（2）背衬材料层，其含有具有芳族乙烯基单体残基和不饱和二羧酸亚胺衍生物残基的亚氨基共聚物。（3）含有橡胶状聚合物的基本材料层和具有芳族乙烯基单体残基和不饱和二羧酸亚胺衍生物残基的酰亚胺共聚物和不饱和二羧酸酐残基。版权所有（C）2005，JPO＆NCIPI

62. 发明专利

JP2004337714A Marking method 审中-公开
公开(公告)号：JP2004337714A
公开(公告)日：2004-12-02
申请号：JP2003135975
申请日：2003-05-14
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： TAKEI ATSUSHI , TOKUNAGA HISAJI , SHIMIZU MIKIO
IPC分类号： G02B5/30 , B05D1/32 , B05D5/06 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide a marking method of a surface of a protection film, a marked protection film and a structure stuck with it. SOLUTION: In order to inspect a part under a marked ink, it is preferable that the marking method is applied onto a surface of a protection film stuck to the structure using a transparent ink generating a color by a black light when the marking is applied. Thereby, for example, in the inspection step of a liquid crystal display in which the structure uses a polarizing plate, the inspection can easily be carried out without peeling off the protection film and with a picture element hidden by the ink. Whereas the content of the marking can also easily be read by applying the black light thereto. COPYRIGHT: (C)2005,JPO&NCIPI

63. 发明专利

JP2004018080A Carrier tape 审中-公开
公开(公告)号：JP2004018080A
公开(公告)日：2004-01-22
申请号：JP2002179409
申请日：2002-06-20
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： FUJIMURA TETSUO , KOSUGI KAZUHIRO , SHIMIZU MIKIO
IPC分类号： B65D73/02 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To provide a carrier tape and a carrier tape body, which prevent an electronic component from adhering to a cover tape and prevent the electronic component from falling in a pocket part of the carrier tape, when the cover tape is peeled.
SOLUTION: The carrier tape has the pocket part for housing the electronic component, and an opening surface of the pocket part, which is to be covered with the cover tape; and an interval between the top surface of the electronic component and the opening surface is set at 0.1-0.8 mm. In the carrier tape body, the carrier tape, where the electronic component is housed in the pocket part, is covered with the cover tape, and an interval between the top surface of the electronic component and the cover tape is set at 0.1-0.8 mm.
COPYRIGHT: (C)2004,JPO

64. 发明专利

JP2003026916A Electroconductive resin composition 有权
标题翻译：电极树脂组合物
公开(公告)号：JP2003026916A
公开(公告)日：2003-01-29
申请号：JP2002101010
申请日：2002-04-03
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： MIYAGAWA KENJI , SHIMIZU MIKIO , NABETA KENJI
IPC分类号： B65D85/86 , C08J5/00 , C08J5/18 , C08K3/04 , C08L23/08 , C08L71/12 , H01B1/24
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive resin composition for IC packaging.
SOLUTION: The electroconductive resin composition for IC packaging comprises (A) a thermoplastic resin being a polyphenylene ether-based resin, (B) carbon black and (C) an ethylene-α-olefin copolymer resin, wherein (a): the electroconductive resin composition contains 5-50 pts.wt. of (B) the carbon black per 100 pts.wt. of (A) the thermoplastic resin and 1-30 pts.wt. of (C) the ethylene-α-olefin copolymer resin having a surface hardness, of 90 or less as Durometer A type surface hardness stipulated in JIS-K-7215 per 100 pts.wt. of the total amount of (A) the thermoplastic resin and (B) the carbon black and (b): the electroconductive resin composition has a surface resistivity of 10
2 -10
10 Ω and carbon black is less liable to fall off from the surface of a molded product formed from the electroconductive resin composition. A molded product and a sheet for IC packaging formed from the electroconductive resin composition are provided.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供用于IC封装的导电树脂组合物。解决方案：用于IC封装的导电树脂组合物包括（A）作为聚苯醚系树脂的热塑性树脂，（B）炭黑和（C）乙烯-α-烯烃共聚物树脂，其中（a）：导电树脂组合物含有5-50重量份（B）碳黑每100重量份（A）热塑性树脂和1-30重量份的（C）表面硬度为90或更小的乙烯-α-烯烃共聚物树脂作为JIS-K-7215中规定的硬度计A型表面硬度/ 100重量份。（A）热塑性树脂和（B）炭黑的总量（b）：导电树脂组合物的表面电阻率为10 -2 -10 10Ω，而碳黑较不易于下降从由导电树脂组合物形成的模制品的表面脱落。提供了由导电树脂组合物形成的用于IC封装的成型产品和片材。

65. 发明专利

JP2002365323A PEELING CHARGE MEASUREMENT DEVICE 审中-公开
公开(公告)号：JP2002365323A
公开(公告)日：2002-12-18
申请号：JP2001205777
申请日：2001-07-06
申请人： DENKI KAGAKU KOGYO KK
发明人： TAKEI ATSUSHI , TOKUNAGA HISAJI , SHIMIZU MIKIO
IPC分类号： G01R29/24
摘要： PROBLEM TO BE SOLVED: To provide a measurement device and method for measuring the charging quantity generated in the peeling of a protective film from a substance having the film stuck thereto. SOLUTION: This measuring device comprises a metal plate for placing the substance and protective film and a coulomb meter for measuring charge quantity connected thereto through a conductor, and the metal plate can successively measure the charge quantity generated, when peeling the protective film from the matter placed on an insulation substance. In this method using this measuring device, the substance and the protective film stuck thereto are placed on the metal plate, and the charge quantity generated, when peeling the protective film, is measured by the coulomb meter.

66. 发明专利

JP2002316396A MULTI-LAYERED SHEET AND MOLDINGS USING THE MULTI-LAYERED SHEET 失效
公开(公告)号：JP2002316396A
公开(公告)日：2002-10-29
申请号：JP2001157882
申请日：2001-04-19
申请人： DENKI KAGAKU KOGYO KK
发明人： SHIMIZU MIKIO
IPC分类号： B65D73/02 , B32B1/02 , B32B27/18 , B32B27/40 , B65D65/40 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To solve the problem that wear dust is generated by a wear in the resin of a packaging material through rubbing of an electronic part with the inner face of the packaging material due to vibration or impact generated during conveyance, when the electronic part is packed using a ray and a carrier tape and provide a packaging container for an electronic part as a product to deal with this problem. SOLUTION: The multi-layered sheet has a base material layer composed of a thermoplastic resin and a face layer composed of a thermoplastic polyurethane resin formed on at least one of the sides of the sheet. The thickness of the face layer is invariably 1 μm or above and the total thickness of the face layer is equivalent to 50% or below of the overall thickness of the multi- layered sheet. Also the packaging container for an electronic part is provided.

67. 发明专利

JP2002225925A CARRIER TAPE 失效
公开(公告)号：JP2002225925A
公开(公告)日：2002-08-14
申请号：JP2001017742
申请日：2001-01-26
申请人： DENKI KAGAKU KOGYO KK
发明人： KADOYA YUICHI , SHIMIZU MIKIO , MIYAGAWA KENJI
IPC分类号： B65D73/02 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To provide a carrier tape comprising a plastic foam sheet as its base member, which carrier tape has excellent features in which, for example, when tension is applied to the tape, stretch of the tape is restricted, thereby hindering a reduction in dimensional accuracy, and the generation of static charges and the occurrence of fiber waste are prevented. SOLUTION: The carrier tape has a bottom member on one side of the base member, which has through-holes and is made of a plastic foam sheet having a density of equal to or greater than 300 kgm-3 and a surface ratio resistance of 104 to 1014 Ω. In a carrier tape body, the carrier tape accommodates contents, such as electronic parts, and is covered with a lid.

68. 发明专利

JP2002208312A CONDUCTIVE RESIN COMPOSITION 审中-公开
公开(公告)号：JP2002208312A
公开(公告)日：2002-07-26
申请号：JP2001326161
申请日：2001-10-24
申请人： DENKI KAGAKU KOGYO KK
发明人： MIYAGAWA KENJI , SHIMIZU MIKIO , HIROKAWA HIROSHI
IPC分类号： B65D85/86 , C08J5/18 , C08K3/04 , C08L71/12 , H01B1/24
摘要： PROBLEM TO BE SOLVED: To provide a conductive resin composition in which contamination by IC or the like caused by separation of carbon black or the like due to wear in contact with IC or the like is greatly reduced. SOLUTION: The IC packaging conductive resin composition is comprised of (A) polyphenylene ether group resin, (B) carbon black, (C) olefin group resin and (D) a block copolymer manufactured by styrene and conjugated diene. It contains (a), (B) carbon black 5-50 pts.wt. for (A) polyphenylene ether group resin 100 pts.wt. and (C) olefin group resin 1-30 pts.wt. and (D) a block copolymer manufactured by styrene and conjugated diene 0.2-10 pts.wt. for the total amount of 100 pts.wt. of (A) polyphenylene ether group resin and (B) carbon black, and (b), the surface specific resistance of the conductive resin composition is 102-1010 Ω.

69. 发明专利

JP2001294677A FILM FOR HEAT-SEALING 失效
公开(公告)号：JP2001294677A
公开(公告)日：2001-10-23
申请号：JP2000113474
申请日：2000-04-14
申请人： DENKI KAGAKU KOGYO KK
发明人： ISHII MASATOMO , SHIMIZU MIKIO , ODA TAKESHI , SUZUKI SHIGERU , ARAI TORU
IPC分类号： C08J5/18 , B32B7/02 , B32B27/28 , C08F4/64 , C08F4/659 , C08F4/6592 , C08F210/00 , C08F210/02 , C08F212/02 , C08F212/08 , C08F232/04 , C08L23/02 , C08L23/06 , C08L25/00 , C08L45/00 , C08L51/04 , C08L53/00
摘要： PROBLEM TO BE SOLVED: To prepare a film which is used for heat-sealing, has excellent low temperature sealing characteristics, thermal stability, weather resistance and chemical resistance, scarcely has the irregularity of sealing strength, and has good peeling touch. SOLUTION: This film for heat-sealing is characterized by comprising a thermoplastic resin composition containing an aromatic vinyl compound-olefin random copolymer in an amount of >=20 wt.% and having a heat-sealing strength of 0.02 to 2 N per mm of sealing width under heat-sealing conditions comprising a heat-sealing temperature of 120 deg.C, a heat-sealing pressure of 0.4 MPa and a heat-sealing time of 1 sec.

70. 发明专利

JPH1177914A PACKAGING COVER FILM 失效
公开(公告)号：JPH1177914A
公开(公告)日：1999-03-23
申请号：JP23672997
申请日：1997-09-02
申请人： DENKI KAGAKU KOGYO KK
发明人： HIGANO MASANORI , NAKAJIMA MASAKI , SHIMIZU MIKIO
IPC分类号： B65D65/40 , B32B27/18 , B32B27/28 , B32B27/32 , C09J7/02 , C09J123/08
摘要： PROBLEM TO BE SOLVED: To obtain a cover film having a small sealing temperature dependence and aging change of peel strength, and an excellent transparency, low- temperature sealability and anti-blocking properties. SOLUTION: The packaging cover film comprises a heat sealing layer containing compound obtained by mixing (A) 0 to 30 wt.% of ethylene-vinyl acetate copolymerized resin containing water-emulsion adhesive having (A) glass transition temperature of 40 deg.C to lower than 65 deg.C, (B) 0 to 100 wt.% of ethylene-vinyl acetate copolymerized resin containing water-emulsion adhesive having (B) glass transition temperature of 65 deg.C to lower than 85 deg.C and (C)0 to 75 wt.% of ethylene-vinyl acetate copolymerized resin containing water- emulsion adhesive having (C) glass transition temperature of 85 deg.C to lower than 105 deg.C, and heat fusion bonding agent containing anti-blocking agent as a main component. Particularly, further satisfactory characteristics are obtained by using both 0.1 to 5 wt.% of amide anti-blocking agent and 0.1 to 5 wt.% of particulate anti-blocking agent as the anti-blocking agent.

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